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    • 1. 发明申请
    • METHOD OF PROCESSING A SEMICONDUCTOR SUBSTRATE BY THERMAL ACTIVATION OF LIGHT ELEMENTS
    • 通过热元件热激活加工半导体基板的方法
    • US20090253225A1
    • 2009-10-08
    • US12401152
    • 2009-03-10
    • Sebastien DuboisNicolas EnjalbertRemi Monna
    • Sebastien DuboisNicolas EnjalbertRemi Monna
    • H01L21/322H01L31/0232H01L31/0236
    • H01L31/182C30B29/52C30B33/02H01L21/3225H01L21/3242H01L31/03685H01L31/1812H01L31/1864Y02E10/546Y02P70/521
    • Method of processing a substrate containing at least one semiconductor of the SiXAY type and comprising at least four separate types of light elements, comprising at least the following steps: carrying out a first anneal of the substrate at a temperature T1 corresponding to a thermal activation temperature for a first one of the four types of light elements, carrying out a second anneal of the substrate at a temperature T2 corresponding to a thermal activation temperature for a second one of the four types of light elements, carrying out a third anneal of the substrate at a temperature T3 corresponding to a thermal activation temperature for a third one of the four types of light elements, carrying out a fourth anneal of the substrate at a temperature T4 corresponding to a thermal activation temperature for a fourth one of the four types of light elements, each anneal comprising a holding at the temperature T1, T2, T3 or T4 and the temperatures T1, T2, T3 and T4 being such that T1>T2>T3>T4.
    • 处理包含至少一种SiXay类型的半导体并且包括至少四种分离类型的光元件的衬底的方法,包括至少以下步骤:在对应于热活化温度的温度T1下进行衬底的第一退火 对于四种类型的光元件中的第一种,在与四种类型的光元件中的第二种类型的光元件的热激活温度相对应的温度T2下进行基板的第二退火,进行基板的第三退火 在与四种类型的光元件中的第三种类型的光元件的热活化温度相对应的温度T3下,在与四种类型的光中的第四种类型的光的热活化温度相对应的温度T4下进行基板的第四退火 元素,每个退火包括在温度T1,T2,T3或T4以及温度T1,T2,T3和T4的保持,使得T1> T2> T 3> T4。