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1. 发明申请

US20090130908A1 Memory module, socket and mounting method providing improved heat dissipating characteristics 审中-公开
公开(公告)号：US20090130908A1
公开(公告)日：2009-05-21
申请号：US12318386
申请日：2008-12-29
申请人： Sang-Wook Park , Joong-Hyun Baek , Hae-Hyung Lee , Hee-Kook Choi , Jin-Yang Lee
发明人： Sang-Wook Park , Joong-Hyun Baek , Hae-Hyung Lee , Hee-Kook Choi , Jin-Yang Lee
IPC分类号： H01R24/00
CPC分类号： H01R12/721 , H05K3/305 , H05K3/306 , H05K2201/0133 , H05K2201/10189 , H05K2201/10446 , H05K2203/1147 , H05K2203/304 , Y02P70/613
摘要： In a memory module, a gap filler for eliminating an air gap may be formed on an end of a PCB where a tab may be formed. The gap filler may be formed on a surface of a socket receiving the memory module. A grease may be coated on the tab to provide a heat conduction path away from the memory module.

2. 发明授权

US07345882B2 Semiconductor module with heat sink and method thereof 有权
标题翻译：具有散热器的半导体模块及其方法
公开(公告)号：US07345882B2
公开(公告)日：2008-03-18
申请号：US10958392
申请日：2004-10-06
申请人： Hae-Hyung Lee , Sang-Wook Park , Joong-Hyun Baek , Jin-Yang Lee
发明人： Hae-Hyung Lee , Sang-Wook Park , Joong-Hyun Baek , Jin-Yang Lee
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： H01L23/427 , H01L23/3672 , H01L23/467 , H01L2924/0002 , H05K7/20509 , H01L2924/00
摘要： A semiconductor module, including a semiconductor device mounted on a printed circuit board (PCB), the PCB having an electrical connection to the semiconductor module, and a heat sink in direct contact with the semiconductor device, the heat sink being formed with a first end and a second end, the first end and the second end being formed with different heights, wherein the semiconductor module allows air flow to pass through the semiconductor module, radiating heat away from the heat sink. Another semiconductor module, including a semiconductor device mounted on a PCB, a heat sink in direct contact with the semiconductor device, the heat sink having a first portion and a second portion, wherein the first portion has a flat shape and is in direct contact with the semiconductor device and the second portion has a corrugated shape and is not in contact with the semiconductor device, wherein the semiconductor module allows air flow to pass through the semiconductor module, radiating heat away from the heat sink.
摘要翻译：一种半导体模块，包括安装在印刷电路板（PCB）上的半导体器件，具有与半导体模块的电连接的PCB以及与半导体器件直接接触的散热器，散热器形成有第一端以及第二端，所述第一端和所述第二端形成有不同的高度，其中所述半导体模块允许空气流通过所述半导体模块，从所述散热器辐射热量。另一个半导体模块，包括安装在PCB上的半导体器件，与半导体器件直接接触的散热器，散热器具有第一部分和第二部分，其中第一部分具有扁平形状并且直接与半导体器件和第二部分具有波纹形状并且不与半导体器件接触，其中半导体模块允许空气流通过半导体模块，从散热器辐射热量。

3. 发明授权

US07301233B2 Semiconductor chip package with thermoelectric cooler 有权
标题翻译：半导体芯片封装带热电冷却器
公开(公告)号：US07301233B2
公开(公告)日：2007-11-27
申请号：US11169615
申请日：2005-06-30
申请人： Hae-Hyung Lee , Sang-Wook Park , Joong-Hyun Baek , Dong-Ho Lee , Jin-Yang Lee
发明人： Hae-Hyung Lee , Sang-Wook Park , Joong-Hyun Baek , Dong-Ho Lee , Jin-Yang Lee
IPC分类号： H01L23/34 , H01L23/10 , H01L23/02
CPC分类号： H01L23/38 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/05553 , H01L2224/05554 , H01L2224/16 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/37599 , H01L2224/48091 , H01L2224/48227 , H01L2224/49112 , H01L2224/49113 , H01L2224/73253 , H01L2224/73265 , H01L2224/8385 , H01L2224/8485 , H01L2225/06589 , H01L2924/00014 , H01L2924/10161 , H01L2924/15311 , H01L2924/19107 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/37099
摘要： The semiconductor chip package may include a substrate having circuit patterns and substrate pads connected with the circuit patterns. At least one semiconductor chip is mounted on the substrate, and a thermoelectric cooler having a P-type material plate and an N-type material plate is mounted on the semiconductor chip. Portions of the P-type and N-type material plates may be attached on the semiconductor chip. The P-type and N-type material plates may be electrically connected to the circuit patterns of the substrate to be provided with DC power.
摘要翻译：半导体芯片封装可以包括具有电路图案的衬底和与电路图案连接的衬底焊盘。至少一个半导体芯片安装在基板上，并且具有P型材料板和N型材料板的热电冷却器安装在半导体芯片上。 P型和N型材料板的部分可以附着在半导体芯片上。 P型和N型材料板可以电连接到衬底的电路图案以提供DC电力。

4. 发明申请

US20060006517A1 Multi-chip package having heat dissipating path 审中-公开
标题翻译：具有散热路径的多芯片封装
公开(公告)号：US20060006517A1
公开(公告)日：2006-01-12
申请号：US11176800
申请日：2005-07-06
申请人： Jin-Yang Lee , Sang-Wook Park , Hae-Hyung Lee , Dong-Ho Lee , Joong-Hyun Baek
发明人： Jin-Yang Lee , Sang-Wook Park , Hae-Hyung Lee , Dong-Ho Lee , Joong-Hyun Baek
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L23/3677 , H01L24/45 , H01L24/48 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2225/0651 , H01L2225/06586 , H01L2225/06589 , H01L2924/00014 , H01L2924/01077 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： A multi-chip package having a heat dissipating path. The multi-chip package includes a stack of integrated circuit (IC) chips, a heat sink part interposed between the IC chips so that one end portion of the heat sink part can be exposed from a side of the stack of integrated circuit chips, a substrate on which the stack of integrated circuit chips is mounted, and solder or solder ball-shaped thermally connecting parts to thermally connect the exposed end portion of the heat sink part to the substrate to dissipate heat collected in the heat sink part through the substrate.
摘要翻译：具有散热路径的多芯片封装。多芯片封装包括集成电路（IC）芯片堆叠，插入在IC芯片之间的散热器部分，使得散热部件的一个端部可以从集成电路芯片堆叠的一侧露出，其上安装有集成电路芯片的堆叠的基板，以及焊料或焊球形的热连接部件，以将散热部件的暴露端部热连接到基板，以散发通过基板收集在散热部件中的热量。

5. 发明申请

US20050245137A1 Memory module, socket and mounting method providing improved heat dissipating characteristics 有权
标题翻译：内存模块，插座和安装方法，提供改善的散热特性
公开(公告)号：US20050245137A1
公开(公告)日：2005-11-03
申请号：US11093236
申请日：2005-03-30
申请人： Sang-Wook Park , Joong-Hyun Baek , Hae-Hyung Lee , Hee-Kook Choi , Jin-Yang Lee
发明人： Sang-Wook Park , Joong-Hyun Baek , Hae-Hyung Lee , Hee-Kook Choi , Jin-Yang Lee
IPC分类号： H01L23/50 , H01R13/62 , H05K3/30
CPC分类号： H01R12/721 , H05K3/305 , H05K3/306 , H05K2201/0133 , H05K2201/10189 , H05K2201/10446 , H05K2203/1147 , H05K2203/304 , Y02P70/613
摘要： In a memory module, a gap filler for eliminating an air gap may be formed on an end of a PCB where a tab may be formed. The gap filler may be formed on a surface of a socket receiving the memory module. A grease may be coated on the tab to provide a heat conduction path away from the memory module.
摘要翻译：在存储器模块中，可以在PCB的可以形成突片的端部上形成用于消除气隙的间隙填充物。间隙填料可以形成在接收存储器模块的插座的表面上。可以在突片上涂覆润滑脂以提供远离存储器模块的热传导路径。

6. 发明授权

US07485006B2 Memory module, socket and mounting method providing improved heat dissipating characteristics 有权
标题翻译：内存模块，插座和安装方法，提供改善的散热特性
公开(公告)号：US07485006B2
公开(公告)日：2009-02-03
申请号：US11093236
申请日：2005-03-30
申请人： Sang-Wook Park , Joong-Hyun Baek , Hae-Hyung Lee , Hee-Kook Choi , Jin-Yang Lee
发明人： Sang-Wook Park , Joong-Hyun Baek , Hae-Hyung Lee , Hee-Kook Choi , Jin-Yang Lee
IPC分类号： H01R24/00
CPC分类号： H01R12/721 , H05K3/305 , H05K3/306 , H05K2201/0133 , H05K2201/10189 , H05K2201/10446 , H05K2203/1147 , H05K2203/304 , Y02P70/613
摘要： In a memory module, a gap filler for eliminating an air gap may be formed on an end of a PCB where a tab may be formed. The gap filler may be formed on a surface of a socket receiving the memory module. A grease may be coated on the tab to provide a heat conduction path away from the memory module.
摘要翻译：在存储器模块中，可以在PCB的可以形成突片的端部上形成用于消除气隙的间隙填充物。间隙填料可以形成在接收存储器模块的插座的表面上。可以在突片上涂覆润滑脂以提供远离存储器模块的热传导路径。

7. 发明授权

US07473993B2 Semiconductor stack package and memory module with improved heat dissipation 有权
标题翻译：半导体堆叠封装和内存模块具有改进的散热性能
公开(公告)号：US07473993B2
公开(公告)日：2009-01-06
申请号：US11057007
申请日：2005-02-11
申请人： Joong-Hyun Baek , Sang-Wook Park , Hae-Hyung Lee
发明人： Joong-Hyun Baek , Sang-Wook Park , Hae-Hyung Lee
IPC分类号： H01L23/02
CPC分类号： H01L23/36 , H01L21/563 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L25/105 , H01L2224/29099 , H01L2224/32225 , H01L2224/451 , H01L2224/4824 , H01L2224/73215 , H01L2224/73265 , H01L2224/83856 , H01L2225/1005 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/14 , H01L2924/15311 , H01L2924/15321 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2924/00015 , H01L2224/05599
摘要： A semiconductor stack package includes lower and upper individual packages. When the upper individual package is stacked on the lower individual package, a heat-conducting layer provided under the upper package touches a heat-mediating layer provided on the lower package. Thus, a layer of trapped air found in conventional stack packages is eliminated, and a direct heat-dissipating path is produced through both the heat-conducting layer and the heat-mediating layer. Therefore, the heat dissipation of the stack package is improved. Alternatively, the stack package may have a symmetric configuration in which each IC chip faces away from each other. A memory module has several stack packages mounted on one or both surfaces of a module board. The method includes forming the packages and stacking the packages. The method further includes forming a module board and mounting the stack packages on the module board.
摘要翻译：半导体堆叠封装包括下部和上部单个封装。当上单个包装堆叠在下单个包装上时，设置在上包装下方的导热层接触设置在下包装上的热介质层。因此，消除了在常规堆叠包装中发现的被捕获的空气层，并且通过导热层和热介质层两者产生直接散热路径。因此，堆叠包装的散热得到改善。或者，堆叠封装可以具有对称配置，其中每个IC芯片彼此背离。存储器模块具有安装在模块板的一个或两个表面上的多个堆叠封装。该方法包括形成包装并堆叠包装。该方法还包括形成模块板并将堆叠封装安装在模块板上。

8. 发明申请

US20050201063A1 Semiconductor module with heat sink and method thereof 有权
标题翻译：具有散热器的半导体模块及其方法
公开(公告)号：US20050201063A1
公开(公告)日：2005-09-15
申请号：US10958392
申请日：2004-10-06
申请人： Hae-Hyung Lee , Sang-Wook Park , Joong-Hyun Baek , Jin-Yang Lee
发明人： Hae-Hyung Lee , Sang-Wook Park , Joong-Hyun Baek , Jin-Yang Lee
IPC分类号： H01L23/34 , H05K7/20
CPC分类号： H01L23/427 , H01L23/3672 , H01L23/467 , H01L2924/0002 , H05K7/20509 , H01L2924/00
摘要： A semiconductor module, including a semiconductor device mounted on a printed circuit board (PCB), the PCB having an electrical connection to the semiconductor module, and a heat sink in direct contact with the semiconductor device, the heat sink being formed with a first end and a second end, the first end and the second end being formed with different heights, wherein the semiconductor module allows air flow to pass through the semiconductor module, radiating heat away from the heat sink. Another semiconductor module, including a semiconductor device mounted on a PCB, a heat sink in direct contact with the semiconductor device, the heat sink having a first portion and a second portion, wherein the first portion has a flat shape and is in direct contact with the semiconductor device and the second portion has a corrugated shape and is not in contact with the semiconductor device, wherein the semiconductor module allows air flow to pass through the semiconductor module, radiating heat away from the heat sink.
摘要翻译：一种半导体模块，包括安装在印刷电路板（PCB）上的半导体器件，具有与半导体模块的电连接的PCB以及与半导体器件直接接触的散热器，散热器形成有第一端以及第二端，所述第一端和所述第二端形成有不同的高度，其中所述半导体模块允许空气流通过所述半导体模块，从所述散热器辐射热量。另一个半导体模块，包括安装在PCB上的半导体器件，与半导体器件直接接触的散热器，散热器具有第一部分和第二部分，其中第一部分具有扁平形状并且直接与半导体器件和第二部分具有波纹形状并且不与半导体器件接触，其中半导体模块允许空气流通过半导体模块，从散热器辐射热量。

9. 发明申请

US20080144292A1 Semiconductor module with heat sink and method thereof 审中-公开
公开(公告)号：US20080144292A1
公开(公告)日：2008-06-19
申请号：US12010133
申请日：2008-01-22
申请人： Hae-Hyung Lee , Sang-Wook Park , Joong-Hyun Baek , Jin-Yang Lee
发明人： Hae-Hyung Lee , Sang-Wook Park , Joong-Hyun Baek , Jin-Yang Lee
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/3672 , H01L23/467 , H01L2924/0002 , H05K7/20509 , H01L2924/00
摘要： A semiconductor module, including a semiconductor device mounted on a printed circuit board (PCB), the PCB having an electrical connection to the semiconductor module, and a heat sink in direct contact with the semiconductor device, the heat sink being formed with a first end and a second end, the first end and the second end being formed with different heights, wherein the semiconductor module allows air flow to pass through the semiconductor module, radiating heat away from the heat sink. Another semiconductor module, including a semiconductor device mounted on a PCB, a heat sink in direct contact with the semiconductor device, the heat sink having a first portion and a second portion, wherein the first portion has a flat shape and is in direct contact with the semiconductor device and the second portion has a corrugated shape and is not in contact with the semiconductor device, wherein the semiconductor module allows air flow to pass through the semiconductor module, radiating heat away from the heat sink.

10. 发明申请

US20060001140A1 Semiconductor chip package with thermoelectric cooler 有权
标题翻译：半导体芯片封装带热电冷却器
公开(公告)号：US20060001140A1
公开(公告)日：2006-01-05
申请号：US11169615
申请日：2005-06-30
申请人： Hae-Hyung Lee , Sang-Wook Park , Joong-Hyun Baek , Dong-Ho Lee , Jin-Yang Lee
发明人： Hae-Hyung Lee , Sang-Wook Park , Joong-Hyun Baek , Dong-Ho Lee , Jin-Yang Lee
IPC分类号： H01L23/02
CPC分类号： H01L23/38 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/05553 , H01L2224/05554 , H01L2224/16 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/37599 , H01L2224/48091 , H01L2224/48227 , H01L2224/49112 , H01L2224/49113 , H01L2224/73253 , H01L2224/73265 , H01L2224/8385 , H01L2224/8485 , H01L2225/06589 , H01L2924/00014 , H01L2924/10161 , H01L2924/15311 , H01L2924/19107 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/37099
摘要： The semiconductor chip package may include a substrate having circuit patterns and substrate pads connected with the circuit patterns. At least one semiconductor chip is mounted on the substrate, and a thermoelectric cooler having a P-type material plate and an N-type material plate is mounted on the semiconductor chip. Portions of the P-type and N-type material plates may be attached on the semiconductor chip. The P-type and N-type material plates may be electrically connected to the circuit patterns of the substrate to be provided with DC power.
摘要翻译：半导体芯片封装可以包括具有电路图案的衬底和与电路图案连接的衬底焊盘。至少一个半导体芯片安装在基板上，并且具有P型材料板和N型材料板的热电冷却器安装在半导体芯片上。 P型和N型材料板的部分可以附着在半导体芯片上。 P型和N型材料板可以电连接到衬底的电路图案以提供DC电力。

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