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    • 1. 发明授权
    • Non-volatile memory devices
    • 非易失性存储器件
    • US08675409B2
    • 2014-03-18
    • US13463060
    • 2012-05-03
    • Jong-Sun SelJung-Dal ChoiYoung-Woo ParkJin-Taek Park
    • Jong-Sun SelJung-Dal ChoiYoung-Woo ParkJin-Taek Park
    • G11C11/34G11C16/04
    • G11C16/0483G11C16/3427
    • A non-volatile memory device may include a semiconductor substrate including an active region at a surface thereof, a ground select line crossing the active region, and a string select line crossing the active region and spaced apart from the ground select line. A plurality of memory cell word lines may cross the active region between the ground select line and the string select line with about a same first spacing provided between adjacent ones of the plurality of word lines and between a last of the plurality of memory cell word lines and the string select line. A second spacing may be provided between the ground select line and a first of the plurality of memory cell word lines.
    • 非易失性存储器件可以包括半导体衬底,其包括其表面处的有源区,与有源区交叉的接地选择线,以及与有源区交叉并与地选线相隔的串选择线。 多个存储单元字线可以与地线选择线和弦选择线之间的有源区域相交,并且与多个字线中的相邻字线之间以及多个存储单元字线中的最后一个之间提供大致相同的第一间隔 和字符串选择行。 可以在接地选择线和多个存储单元字线中的第一个之间提供第二间隔。
    • 6. 发明授权
    • Nonvolatile memory devices having a fin shaped active region and methods of fabricating the same
    • 具有鳍状有源区的非易失性存储器件及其制造方法
    • US07605430B2
    • 2009-10-20
    • US11474699
    • 2006-06-23
    • Chang-Hyun LeeJung-Dal ChoiChang-Seok KangYoo-Cheol ShinJong-Sun Sel
    • Chang-Hyun LeeJung-Dal ChoiChang-Seok KangYoo-Cheol ShinJong-Sun Sel
    • H01L29/76
    • H01L27/115H01L27/11521
    • A nonvolatile memory device includes a semiconductor substrate and a device isolation layer on the semiconductor substrate. A fin-shaped active region is formed between portions of the device isolation layer. A sidewall protection layer is formed on the sidewall of the fin-shaped active region where source and drain regions are formed. Thus, it may be possible to reduce the likelihood of an undesirable connection between an interconnection layer connected to the source and drain regions and a lower sidewall of the active region so that charge leakage from the interconnection layer to a substrate can be prevented or reduced. The sidewall protection layer may be formed using the device isolation layer. Alternatively, an insulating layer having an etch selectivity with respect to an interlayer insulating layer may be formed on the device isolation layer so as to cover the sidewall of the active region.
    • 非易失性存储器件包括半导体衬底和半导体衬底上的器件隔离层。 翅片形有源区形成在器件隔离层的各部分之间。 侧壁保护层形成在形成源区和漏区的鳍状有源区的侧壁上。 因此,可以降低连接到源极和漏极区域的互连层和有源区域的下侧壁之间的不期望的连接的可能性,从而可以防止或减少从互连层到衬底的电荷泄漏。 侧壁保护层可以使用器件隔离层形成。 或者,可以在器件隔离层上形成具有相对于层间绝缘层的蚀刻选择性的绝缘层,以覆盖有源区的侧壁。
    • 10. 发明授权
    • Semiconductor memory devices
    • 半导体存储器件
    • US08217467B2
    • 2012-07-10
    • US12984860
    • 2011-01-05
    • Jong-Sun SelJung-Dal ChoiChoong-Ho LeeJu-Hyuck ChungHee-Soo KangDong-uk Choi
    • Jong-Sun SelJung-Dal ChoiChoong-Ho LeeJu-Hyuck ChungHee-Soo KangDong-uk Choi
    • H01L21/70
    • H01L23/485H01L21/76804H01L21/76816H01L27/11519H01L27/11521H01L27/11524H01L2924/0002H01L2924/00
    • In some embodiments, a semiconductor memory device includes a substrate that includes a cell array region and a peripheral circuit region. The semiconductor memory device further includes a device isolation pattern on the substrate. The device isolation pattern defines a first active region and a second active region within the cell array region and a third active region in the peripheral circuit region. The semiconductor memory device further includes a first common source region, a plurality of first source/drain regions, and a first drain region in the first active region. The semiconductor memory device further includes a second common source region, a plurality of second source/drain regions, and a second drain region in the second active region. The semiconductor memory device further includes a third source/drain region in the third active region. The semiconductor memory device further includes a common source line contacting the first and second common source regions.
    • 在一些实施例中,半导体存储器件包括包括单元阵列区域和外围电路区域的衬底。 半导体存储器件还包括在衬底上的器件隔离图案。 器件隔离图案限定了单元阵列区域内的第一有源区和第二有源区以及外围电路区中的第三有源区。 半导体存储器件还包括第一有源区中的第一公共源极区,多个第一源极/漏极区和第一漏极区。 半导体存储器件还包括第二公共源极区域,多个第二源极/漏极区域和第二有源区域中的第二漏极区域。 半导体存储器件还包括第三有源区中的第三源/漏区。 半导体存储器件还包括与第一和第二公共源极区域接触的公共源极线。