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1. 发明授权

US06589376B1 Method and composition for mounting an electronic component and device formed therewith 失效
公开(公告)号：US06589376B1
公开(公告)日：2003-07-08
申请号：US09067940
申请日：1998-04-28
申请人： John G. Davis , Joseph D. Poole , Kris A. Slesinger , Michael C. Weller
发明人： John G. Davis , Joseph D. Poole , Kris A. Slesinger , Michael C. Weller
IPC分类号： H01L2144
CPC分类号： H05K3/321 , H05K3/305 , H05K2201/10689 , H05K2201/10734 , H05K2203/0191 , H05K2203/0278 , H05K2203/1476 , H05K2203/162 , H05K2203/176 , Y02P70/613 , Y10T29/49133 , Y10T29/53178 , Y10T29/53183 , Y10T156/1092
摘要： A method of mounting a component on a substrate includes applying a conductive adhesive on a contact pad joined to a substrate, aligning a component with the substrate such that at least one lead of the component is juxtaposed with the conductive adhesive, performing a partial cure of the conductive adhesive, testing performance of the component, and performing a full cure of the conductive adhesive. Another method includes the additional steps of applying a tacky film to the substrate and juxtaposing the component with the tacky film. When the testing in either embodiment shows a defective or misaligned component, the component may be replaced or repositioned by cold separation of the at least one component lead from the partially cured conductive adhesive. Optionally, additional conductive adhesive may be applied, when needed, before replacement or repositioning of a component. A composition for mounting a component on a circuit board includes a conductive adhesive screened on a contact pad, the conductive adhesive being partially cured, wherein the composition allows cold separation of the component from the substrate and may be fully cured by heat exposure. An apparatus is also provided including a component, a substrate, and a means for temporarily mounting and electrically connecting the component on the substrate.

2. 发明授权

US06590285B1 Method and composition for mounting an electronic component and device formed therewith 失效
标题翻译：用于安装由其形成的电子部件和装置的方法和组合物
公开(公告)号：US06590285B1
公开(公告)日：2003-07-08
申请号：US09723706
申请日：2000-11-28
申请人： John G. Davis , Joseph D. Poole , Kris A. Slesinger , Michael C. Weller
发明人： John G. Davis , Joseph D. Poole , Kris A. Slesinger , Michael C. Weller
IPC分类号： H01L2348
CPC分类号： H05K3/321 , H05K3/305 , H05K2201/10689 , H05K2201/10734 , H05K2203/0191 , H05K2203/0278 , H05K2203/1476 , H05K2203/162 , H05K2203/176 , Y02P70/613 , Y10T29/49133 , Y10T29/53178 , Y10T29/53183 , Y10T156/1092
摘要： A method of mounting a component on a substrate includes applying a conductive adhesive on a contact pad joined to a substrate, aligning a component with the substrate such that at least one lead of the component is juxtaposed with the conductive adhesive, performing a partial cure of the conductive adhesive, testing performance of the component, and performing a full cure of the conductive adhesive. Another method includes the additional steps of applying a tacky film to the substrate and juxtaposing the component with the tacky film. When the testing in either embodiment shows a defective or misaligned component, the component may be replaced or repositioned by cold separation of the at least one component lead from the partially cured conductive adhesive. Optionally, additional conductive adhesive may be applied, when needed, before replacement or repositioning of a component. A composition for mounting a component on a circuit board includes a conductive adhesive screened on a contact pad, the conductive adhesive being partially cured, wherein the composition allows cold separation of the component from the substrate and may be fully cured by heat exposure. An apparatus is also provided including a component, a substrate, and a means for temporarily mounting and electrically connecting the component on the substrate.
摘要翻译：将部件安装在基板上的方法包括将导电粘合剂施加到接合到基板的接触垫上，使部件与基板对准，使得部件的至少一个引线与导电粘合剂并置，执行部分固化导电粘合剂，组分的测试性能，以及完全固化导电粘合剂。另一种方法包括将粘性膜施加到基底上并与粘性膜并置该组分的附加步骤。当在任一实施例中的测试显示出有缺陷或不对准的部件时，可以通过将部分导体与部分固化的导电粘合剂冷分离来替换或重新定位部件。任选地，当需要时，可以在组分的替换或重新定位之前施加另外的导电粘合剂。用于将部件安装在电路板上的组合物包括屏蔽在接触垫上的导电粘合剂，该导电粘合剂被部分固化，其中组合物允许组分与基底冷分离，并且可以通过热暴露完全固化。还提供了一种装置，其包括部件，基板和用于临时安装和电连接基板上的部件的装置。

3. 发明授权

US06499644B2 Rework and underfill nozzle for electronic components 失效
标题翻译：电子零件返修和底部填充喷嘴
公开(公告)号：US06499644B2
公开(公告)日：2002-12-31
申请号：US09783643
申请日：2001-02-14
申请人： Wilton L. Cox , Joseph D. Poole , Kris A. Slesinger
发明人： Wilton L. Cox , Joseph D. Poole , Kris A. Slesinger
IPC分类号： B23K100
CPC分类号： H01L24/81 , B23K1/018 , H01L21/563 , H01L24/75 , H01L24/98 , H01L2224/16 , H01L2224/16225 , H01L2224/73203 , H01L2224/75 , H01L2224/75743 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/15151 , H05K3/3436 , H05K3/3494 , H05K13/0486 , H05K2201/10977 , H05K2203/0195 , H05K2203/081 , H05K2203/082 , H05K2203/088 , Y02P70/613
摘要： A method and apparatus for desoldering electronic components from a substrate. A vacuum is used to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections. A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.
摘要翻译：一种用于从基板上去除电子部件的方法和装置。使用真空来增强电子部件下的热气流，以将焊接连接到基板上。将水蒸气加入到热气中以增加热气体的热容量。一种用于周期性地改变热气体的流动方向和电子部件下的真空的系统用于均匀加热焊料连接。一种用于在电子部件和其上安装有电子部件的基板之间沉积底部填充材料的方法和装置。施加真空以增强底部填充材料流入电子部件和基板之间的空间。

4. 发明授权

US06264094B1 Rework and underfill nozzle for electronic components 失效
公开(公告)号：US06264094B1
公开(公告)日：2001-07-24
申请号：US09511036
申请日：2000-02-23
申请人： Wilton L. Cox , Joseph D. Poole , Kris A. Slesinger
发明人： Wilton L. Cox , Joseph D. Poole , Kris A. Slesinger
IPC分类号： B23K3100
CPC分类号： H01L24/81 , B23K1/018 , H01L21/563 , H01L24/75 , H01L24/98 , H01L2224/16 , H01L2224/16225 , H01L2224/73203 , H01L2224/75 , H01L2224/75743 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/15151 , H05K3/3436 , H05K3/3494 , H05K13/0486 , H05K2201/10977 , H05K2203/0195 , H05K2203/081 , H05K2203/082 , H05K2203/088 , Y02P70/613
摘要： A method and apparatus for desoldering electronic components from a substrate. A vacuum is used to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections. A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.

5. 发明授权

US06464125B2 Rework and underfill nozzle for electronic components 失效
标题翻译：电子零件返修和底部填充喷嘴
公开(公告)号：US06464125B2
公开(公告)日：2002-10-15
申请号：US09783642
申请日：2001-02-14
申请人： Wilton L. Cox , Joseph D. Poole , Kris A. Slesinger
发明人： Wilton L. Cox , Joseph D. Poole , Kris A. Slesinger
IPC分类号： B23K100
CPC分类号： H01L24/81 , B23K1/018 , H01L21/563 , H01L24/75 , H01L24/98 , H01L2224/16 , H01L2224/16225 , H01L2224/73203 , H01L2224/75 , H01L2224/75743 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/15151 , H05K3/3436 , H05K3/3494 , H05K13/0486 , H05K2201/10977 , H05K2203/0195 , H05K2203/081 , H05K2203/082 , H05K2203/088 , Y02P70/613
摘要： A method and apparatus for desoldering electronic components from a substrate. A vacuum is used to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections. A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.
摘要翻译：一种用于从基板上去除电子部件的方法和装置。使用真空来增强电子部件下的热气流，以将焊接连接到基板上。将水蒸气加入到热气中以增加热气体的热容量。使用用于周期性地改变热气体的流动方向和电子部件下的真空的系统来均匀地加热焊料连接。一种用于在电子部件和其上安装有电子部件的基板之间沉积底部填充材料的方法和装置。施加真空以增强底部填充材料流入电子部件和基板之间的空间。

6. 发明授权

US06457631B2 Rework and underfill nozzle for electronic components 失效
标题翻译：电子零件返修和底部填充喷嘴
公开(公告)号：US06457631B2
公开(公告)日：2002-10-01
申请号：US09774971
申请日：2001-01-31
申请人： Wilton L. Cox , Joseph D. Poole , Kris A. Slesinger
发明人： Wilton L. Cox , Joseph D. Poole , Kris A. Slesinger
IPC分类号： B23K120
CPC分类号： H01L24/81 , B23K1/018 , H01L21/563 , H01L24/75 , H01L24/98 , H01L2224/16 , H01L2224/16225 , H01L2224/73203 , H01L2224/75 , H01L2224/75743 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/15151 , H05K3/3436 , H05K3/3494 , H05K13/0486 , H05K2201/10977 , H05K2203/0195 , H05K2203/081 , H05K2203/082 , H05K2203/088 , Y02P70/613
摘要： A method and apparatus for desoldering electronic components from a substrate. A vacuum is used, to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections. A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.
摘要翻译：一种用于从基板上去除电子部件的方法和装置。使用真空来增强电子部件下方的热气流，以将附着电子部件的焊料回流到基板。将水蒸气加入到热气中以增加热气体的热容量。一种用于周期性地改变热气体的流动方向和电子部件下的真空的系统用于均匀加热焊料连接。一种用于在电子部件和其上安装有电子部件的基板之间沉积底部填充材料的方法和装置。施加真空以增强底部填充材料流入电子部件和基板之间的空间。

7. 发明授权

US06220503B1 Rework and underfill nozzle for electronic components 失效
标题翻译：电子零件返修和底部填充喷嘴
公开(公告)号：US06220503B1
公开(公告)日：2001-04-24
申请号：US09244565
申请日：1999-02-02
申请人： Wilton L. Cox , Joseph D. Poole , Kris A. Slesinger
发明人： Wilton L. Cox , Joseph D. Poole , Kris A. Slesinger
IPC分类号： B23K3102
CPC分类号： H01L24/81 , B23K1/018 , H01L21/563 , H01L24/75 , H01L24/98 , H01L2224/16 , H01L2224/16225 , H01L2224/73203 , H01L2224/75 , H01L2224/75743 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/15151 , H05K3/3436 , H05K3/3494 , H05K13/0486 , H05K2201/10977 , H05K2203/0195 , H05K2203/081 , H05K2203/082 , H05K2203/088 , Y02P70/613
摘要： A method and apparatus for desoldering electronic components from a substrate. A vacuum is used to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections. A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.
摘要翻译：一种用于从基板上去除电子部件的方法和装置。使用真空来增强电子部件下的热气流，以将焊接连接到基板上。将水蒸气加入到热气中以增加热气体的热容量。一种用于周期性地改变热气体流动方向和电子部件下的真空的系统被用于均匀地加热焊料连接。一种用于在电子部件和其上安装有电子部件的基板之间沉积底部填充材料的方法和装置。施加真空以增强底部填充材料流入电子部件和基板之间的空间。

8. 发明授权

US06633663B1 Method and system for determining component dimensional information 失效
标题翻译：用于确定部件尺寸信息的方法和系统
公开(公告)号：US06633663B1
公开(公告)日：2003-10-14
申请号：US09072498
申请日：1998-05-05
申请人： Kris A. Slesinger
发明人： Kris A. Slesinger
IPC分类号： G06K900
CPC分类号： G06T7/66 , G06T2207/30141 , H05K13/0812
摘要： A method and system for determining component dimensional information in a component placement system. The component information is derived from the pick and place equipment which is used to place the components on the substrate. The component is grasped at substantially the centroid position and moved over the aperture of a camera. The edges of the component are located, and from the edges an accurate location of the centroid may be obtained. The centroid, as well as the length, width and thickness of the component is stored in a database for use during placing of the component. Other features derived include orientation indicia obtained from component features which are viewed by the camera. During placement, all features associated with the component necessary to accurately locate the component on a substrate are obtained from the database.
摘要翻译：一种用于确定部件放置系统中的部件尺寸信息的方法和系统。组件信息来自用于将组件放置在基板上的拾取和放置设备。该部件基本上被抓握在重心位置并移动到相机的孔上。组件的边缘位于，并且从边缘可以获得质心的精确位置。质心以及组件的长度，宽度和厚度存储在数据库中，以便在组件放置期间使用。派生的其他特征包括从照相机观看的组件特征获得的取向标记。在放置期间，从数据库中获取与准确定位衬底上的组件所需的组件相关联的所有功能。

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