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1. 发明授权

US06590285B1 Method and composition for mounting an electronic component and device formed therewith 失效
标题翻译：用于安装由其形成的电子部件和装置的方法和组合物
公开(公告)号：US06590285B1
公开(公告)日：2003-07-08
申请号：US09723706
申请日：2000-11-28
申请人： John G. Davis , Joseph D. Poole , Kris A. Slesinger , Michael C. Weller
发明人： John G. Davis , Joseph D. Poole , Kris A. Slesinger , Michael C. Weller
IPC分类号： H01L2348
CPC分类号： H05K3/321 , H05K3/305 , H05K2201/10689 , H05K2201/10734 , H05K2203/0191 , H05K2203/0278 , H05K2203/1476 , H05K2203/162 , H05K2203/176 , Y02P70/613 , Y10T29/49133 , Y10T29/53178 , Y10T29/53183 , Y10T156/1092
摘要： A method of mounting a component on a substrate includes applying a conductive adhesive on a contact pad joined to a substrate, aligning a component with the substrate such that at least one lead of the component is juxtaposed with the conductive adhesive, performing a partial cure of the conductive adhesive, testing performance of the component, and performing a full cure of the conductive adhesive. Another method includes the additional steps of applying a tacky film to the substrate and juxtaposing the component with the tacky film. When the testing in either embodiment shows a defective or misaligned component, the component may be replaced or repositioned by cold separation of the at least one component lead from the partially cured conductive adhesive. Optionally, additional conductive adhesive may be applied, when needed, before replacement or repositioning of a component. A composition for mounting a component on a circuit board includes a conductive adhesive screened on a contact pad, the conductive adhesive being partially cured, wherein the composition allows cold separation of the component from the substrate and may be fully cured by heat exposure. An apparatus is also provided including a component, a substrate, and a means for temporarily mounting and electrically connecting the component on the substrate.
摘要翻译：将部件安装在基板上的方法包括将导电粘合剂施加到接合到基板的接触垫上，使部件与基板对准，使得部件的至少一个引线与导电粘合剂并置，执行部分固化导电粘合剂，组分的测试性能，以及完全固化导电粘合剂。另一种方法包括将粘性膜施加到基底上并与粘性膜并置该组分的附加步骤。当在任一实施例中的测试显示出有缺陷或不对准的部件时，可以通过将部分导体与部分固化的导电粘合剂冷分离来替换或重新定位部件。任选地，当需要时，可以在组分的替换或重新定位之前施加另外的导电粘合剂。用于将部件安装在电路板上的组合物包括屏蔽在接触垫上的导电粘合剂，该导电粘合剂被部分固化，其中组合物允许组分与基底冷分离，并且可以通过热暴露完全固化。还提供了一种装置，其包括部件，基板和用于临时安装和电连接基板上的部件的装置。

2. 发明授权

US06432511B1 Thermoplastic adhesive preform for heat sink attachment 失效
标题翻译：用于散热器附件的热塑性粘合剂预制件
公开(公告)号：US06432511B1
公开(公告)日：2002-08-13
申请号：US08864726
申请日：1997-06-06
申请人： John G. Davis , Michael A. Gaynes , Joseph D. Poole
发明人： John G. Davis , Michael A. Gaynes , Joseph D. Poole
IPC分类号： B32B300
CPC分类号： H01L21/67132 , H01L23/36 , H01L23/3737 , H01L2924/0002 , Y10T428/24479 , H01L2924/00
摘要： Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.
摘要翻译：热塑性粘合剂预成型件的弯曲表面提供改进的气体加热和排除调节，因为待粘合的表面被加热并压靠在热塑性粘合剂预型件上。可以将微粒或丝状材料加入到热塑性粘合剂中以调节热膨胀系数或进一步增加通过粘合剂或两者的热传递。优选地通过模制来制造预成型件，优选地与从完全粘结的大致相同厚度的幅材对所需体积的预成型件进行模切而成型。

3. 发明授权

US08053683B2 Equipment container retention and bonding system and method 有权
标题翻译：设备容器保持和粘接系统及方法
公开(公告)号：US08053683B2
公开(公告)日：2011-11-08
申请号：US12413637
申请日：2009-03-30
申请人： Douglas A. Slocum , John G. Davis , Jamey Kelsall , John A. Stubecki
发明人： Douglas A. Slocum , John G. Davis , Jamey Kelsall , John A. Stubecki
IPC分类号： H01R4/00 , H05K9/00
CPC分类号： H05K5/0204 , H05K7/1412 , Y10T29/5313
摘要： An equipment container retention and bonding system including a dagger pin block assembly that includes a mounting dagger pin and a bonding member formed of a compressive electrically conductive material that is retained on a surface of the dagger pin block assembly wherein the bonding member is compressed between the contact surface on the equipment container and the dagger pin block assembly when the fastening mechanism secures the equipment container in the mounting tray to form an EMI/EMC bonding connection between the mounting tray and the equipment container having an electrical resistance of less than 2.5 milli-ohms under vibration and other loading conditions encountered during use of the system.
摘要翻译：一种设备容器保持和接合系统，包括匕首销块组件，其包括安装匕首销和由压缩导电材料形成的接合构件，所述接合构件保持在匕首销块组件的表面上，其中，接合构件在当紧固机构将设备容器固定在安装托盘中以在安装托盘和具有小于2.5毫米的电阻的设备容器之间形成EMI / EMC接合连接时，设备容器和匕首销块组件上的接触表面，在使用系统时遇到的振动和其他负载条件下的欧姆。

4. 发明授权

US07645410B2 Thermoplastic adhesive preform for heat sink attachment 失效
标题翻译：用于散热器附件的热塑性粘合剂预制件
公开(公告)号：US07645410B2
公开(公告)日：2010-01-12
申请号：US10915374
申请日：2004-08-11
申请人： John G. Davis , Michael A. Gaynes , Joseph D. Poole
发明人： John G. Davis , Michael A. Gaynes , Joseph D. Poole
IPC分类号： B29C51/02
CPC分类号： H01L21/67132 , H01L23/36 , H01L23/3737 , H01L2924/0002 , Y10T428/24479 , H01L2924/00
摘要： Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.
摘要翻译：热塑性粘合剂预成型件的弯曲表面提供改进的气体加热和排除调节，因为待粘合的表面被加热并压靠在热塑性粘合剂预型件上。可以将微粒或丝状材料加入到热塑性粘合剂中以调节热膨胀系数或进一步增加通过粘合剂或两者的热传递。优选地通过模制来制造预成型件，优选地与从完全粘结的大致相同厚度的幅材对所需体积的预成型件进行模切而成型。

5. 发明授权

US06893591B2 Thermoplastic adhesive preform for heat sink attachment 失效
公开(公告)号：US06893591B2
公开(公告)日：2005-05-17
申请号：US10191061
申请日：2002-07-10
申请人： John G. Davis , Michael A. Gaynes , Joseph D. Poole
发明人： John G. Davis , Michael A. Gaynes , Joseph D. Poole
IPC分类号： H01L21/00 , H01L23/36 , H01L23/373 , B28B7/14
CPC分类号： H01L21/67132 , H01L23/36 , H01L23/3737 , H01L2924/0002 , Y10T428/24479 , H01L2924/00
摘要： Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.

6. 发明授权

US06589376B1 Method and composition for mounting an electronic component and device formed therewith 失效
公开(公告)号：US06589376B1
公开(公告)日：2003-07-08
申请号：US09067940
申请日：1998-04-28
申请人： John G. Davis , Joseph D. Poole , Kris A. Slesinger , Michael C. Weller
发明人： John G. Davis , Joseph D. Poole , Kris A. Slesinger , Michael C. Weller
IPC分类号： H01L2144
CPC分类号： H05K3/321 , H05K3/305 , H05K2201/10689 , H05K2201/10734 , H05K2203/0191 , H05K2203/0278 , H05K2203/1476 , H05K2203/162 , H05K2203/176 , Y02P70/613 , Y10T29/49133 , Y10T29/53178 , Y10T29/53183 , Y10T156/1092
摘要： A method of mounting a component on a substrate includes applying a conductive adhesive on a contact pad joined to a substrate, aligning a component with the substrate such that at least one lead of the component is juxtaposed with the conductive adhesive, performing a partial cure of the conductive adhesive, testing performance of the component, and performing a full cure of the conductive adhesive. Another method includes the additional steps of applying a tacky film to the substrate and juxtaposing the component with the tacky film. When the testing in either embodiment shows a defective or misaligned component, the component may be replaced or repositioned by cold separation of the at least one component lead from the partially cured conductive adhesive. Optionally, additional conductive adhesive may be applied, when needed, before replacement or repositioning of a component. A composition for mounting a component on a circuit board includes a conductive adhesive screened on a contact pad, the conductive adhesive being partially cured, wherein the composition allows cold separation of the component from the substrate and may be fully cured by heat exposure. An apparatus is also provided including a component, a substrate, and a means for temporarily mounting and electrically connecting the component on the substrate.

7. 发明授权

US06179625B2 Removable interlockable first and second connectors having engaging flexible members and process of making same 失效
标题翻译：可拆卸互锁的第一和第二连接器具有接合的柔性构件及其制造方法
公开(公告)号：US06179625B2
公开(公告)日：2001-01-30
申请号：US09275756
申请日：1999-03-25
申请人： John G. Davis , Richard J. Noreika , Michael C. Weller
发明人： John G. Davis , Richard J. Noreika , Michael C. Weller
IPC分类号： H05K100
CPC分类号： H01R12/52 , H05K3/325 , Y10T29/49126 , Y10T29/49165 , Y10T29/49453
摘要： A removably interlockable connector assembly and process for making the assembly that include a first connector having a head on a mesa and a second connector having an opening that receives the head on the first connector. The head on the first connector and the material defining the opening in the second connector are flexible and sized, so that the head on the first connector and the material defining the opening in the second connector flex as the head on the first connector is inserted into the opening in the second connector.
摘要翻译：一种用于制造所述组件的可拆卸地互锁的连接器组件和过程，所述组件包括具有台面上的头部的第一连接器和具有在所述第一连接器上接收所述头部的开口的第二连接器。第一连接器上的头部和限定第二连接器中的开口的材料是柔性和尺寸的，使得当第一连接器上的头部被插入时，第一连接器上的头部和限定第二连接器中的开口的材料弯曲第二个连接器的开口。

8. 发明授权

US6043110A Wire mesh insert for thermal adhesives 有权
标题翻译：用于热粘合剂的金属丝网插件
公开(公告)号：US6043110A
公开(公告)日：2000-03-28
申请号：US225268
申请日：1999-01-05
申请人： John G. Davis , Michael A. Gaynes , Joseph D. Poole
发明人： John G. Davis , Michael A. Gaynes , Joseph D. Poole
IPC分类号： H01L23/433 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/433 , H01L2924/0002
摘要： Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Volume and thickness of the bond are controlled by the inclusion of a wire mesh embedded in a preform or through which the thermoplastic adhesive is pressed during bonding. The wire mesh also increases heat transfer through the adhesive in a regulated and even manner over the area of the bond or any desired portion thereof. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.
摘要翻译：热塑性粘合剂预成型件的弯曲表面提供改进的气体加热和排除调节，因为待粘合的表面被加热并压靠在热塑性粘合剂预型件上。结合体的体积和厚度通过包含嵌入在预成型体中的丝网来控制，或者在粘结期间通过该金属网挤压热塑性粘合剂。丝网还可以在粘合区域或其任何所需部分上以均匀的方式增加通过粘合剂的热传递。可以将微粒或丝状材料加入到热塑性粘合剂中以调节热膨胀系数或进一步增加通过粘合剂或两者的热传递。优选地通过模制来制造预成型件，优选地与从完全粘结的大致相同厚度的幅材对所需体积的预成型件进行模切而成型。

9. 发明授权

US5940687A Wire mesh insert for thermal adhesives 失效
公开(公告)号：US5940687A
公开(公告)日：1999-08-17
申请号：US870800
申请日：1997-06-06
申请人： John G. Davis , Michael A. Gaynes , Joseph D. Poole
发明人： John G. Davis , Michael A. Gaynes , Joseph D. Poole
IPC分类号： H01L23/433 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/433 , H01L2924/0002
摘要： Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Volume and thickness of the bond are controlled by the inclusion of a wire mesh embedded in a preform or through which the thermoplastic adhesive is pressed during bonding. The wire mesh also increases heat transfer through the adhesive in a regulated and even manner over the area of the bond or any desired portion thereof. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.

10. 发明授权

US4254898A Particle spacing and metering device 失效
标题翻译：颗粒间距和计量装置
公开(公告)号：US4254898A
公开(公告)日：1981-03-10
申请号：US99828
申请日：1979-12-03
申请人： John G. Davis
发明人： John G. Davis
IPC分类号： B65G65/48 , G01F11/00
CPC分类号： G01F11/003 , B65G65/4881
摘要： A particle spacing and metering device having a supply hopper above a pair of contra-rotating rollers. An aperture in the floor of the hopper is provided with a regulator which controls the flow of particles to the rollers. The regulator has a body fixed to a shaft rotatably mounted in the aperture. A cam-type metering face has a groove of increasing depth and width to enable selected variation of a throat through which the particles flow.
摘要翻译：颗粒间隔和计量装置在一对反转辊之上具有供料漏斗。漏斗底部的孔口设置有一个调节器，该调节器控制颗粒流向辊子。调节器具有固定到可旋转地安装在孔中的轴的主体。凸轮式计量面具有增加深度和宽度的凹槽，以使颗粒流过的喉部能够选择变化。

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