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    • 3. 发明授权
    • Method and apparatus for chemical-mechanical polishing of diamond
    • 钻石化学机械抛光的方法和装置
    • US5746931A
    • 1998-05-05
    • US760845
    • 1996-12-05
    • John Edwin GraebnerSungho JinWei Zhu
    • John Edwin GraebnerSungho JinWei Zhu
    • B24B37/04H01L21/00
    • B24B37/04
    • This application describes a new method for rapid thinning, planarizing and fine polishing surfaces of diamond to the submicron/nanometer level so that large area, uniform thickness diamond wafers can be obtained. The method combines both chemical (dissolution of carbon in molten metals) and mechanical (rotating or moving sample fixtures in contact with the dissolving metals) polishing to achieve flat, smooth surface finishes in a relatively short period of time, thus improving the quality and economics of the overall polishing process. Several embodiments of apparatus for performing such chemical-mechanical polishing (CMP) of diamond are described.
    • 该应用描述了一种用于将金刚石的表面快速稀释,平面化和精细抛光到亚微米/纳米级的新方法,从而可以获得大面积均匀厚度的金刚石晶片。 该方法结合了化学(溶解在金属中的碳)和机械(与溶解金属接触的旋转或移动的样品夹具)抛光,以在相对较短的时间内实现平坦,光滑的表面光洁度,从而提高了质量和经济性 的整体抛光过程。 描述了用于进行金刚石的这种化学机械抛光(CMP)的设备的几个实施例。
    • 6. 发明授权
    • Surface acoustic wave devices comprising large-grained diamonds and methods for making
    • 表面声波装置包括大颗粒钻石和制造方法
    • US06222299B1
    • 2001-04-24
    • US09020752
    • 1998-02-09
    • John Edwin GraebnerSungho JinWei Zhu
    • John Edwin GraebnerSungho JinWei Zhu
    • H03H925
    • H03H9/059H01L2224/16225H03H3/08H03H9/02582
    • Embodiments of the invention include an improved diamond-based surface acoustic wave (SAW) filter device. The SAW device comprises polished, large-grained diamond in combination with a piezoelectric layer to enhance the acoustic velocity and operational frequency of the SAW device with reduced loss and increased efficiency. Also, the use of a pre-polished, large-grained diamond slab reduces processing complications such as contamination or stressing of delicate device circuitry adjacent to the diamond component. Alternative embodiments of the invention include planar or vertical interconnection schemes for packaging of the SAW device and also include planarization schemes for convenient deposition and patterning of the SAW device metallization layer.
    • 本发明的实施例包括改进的基于金刚石的表面声波(SAW)滤波器装置。 SAW器件包括与压电层组合的抛光的大颗粒金刚石,以增加SAW器件的声速和操作频率,减少损耗并提高效率。 此外,使用预抛光的大颗粒金刚石板可减少加工并发症,例如与金刚石部件相邻的精密器件电路的污染或应力。 本发明的替代实施例包括用于SAW器件封装的平面或垂直互连方案,并且还包括用于SAW器件金属化层的方便沉积和图案化的平面化方案。
    • 9. 发明授权
    • Apparatus for determining the thermal resistivity of electrically
insulating crystalline materials
    • 用于确定电绝缘结晶材料的热阻的装置
    • US5664884A
    • 1997-09-09
    • US509267
    • 1995-07-31
    • John Edwin GraebnerSungho Jin
    • John Edwin GraebnerSungho Jin
    • G01N25/18G01N25/20
    • G01N25/18
    • This invention involves apparatus for determining the thermal resistivities W.sub.s (=1/.kappa..sub.s) of electrically insulating, crystalline or polycrystalline samples under test (SUTs), all comprising host material such as CVD diamond. Once the optical absorptivities .alpha..sub.1 and .alpha..sub.2 and the thermal resistivities W.sub.1 and W.sub.2 of at least two other crystalline or polycrystalline bodies B.sub.1 and B.sub.2, respectively, comprising the same host material as the SUTs, and containing the same type of impurity or combination of impurities as the SUTs, are measured by some other technique--the inventive apparatus can then determine the thermal resistivities W.sub.s of the SUTs rather quickly from a measurement only of the optical absorptivities a.sub.s of the SUTs. These determinations of the thermal resistivities W.sub.s of the SUTs rely on our discovery that the following linear relationship exists: W=A+C.alpha., where A and C are constants so long as the type of impurity or combination of impurities in all the bodies B.sub.1, B.sub.2, and SUTs is the same, even though the impurities or combination of impurities have different concentrations in the bodies B.sub.1 and B.sub.2, as well as in the SUTs.
    • 本发明涉及用于确定所测试的电绝缘,结晶或多晶样品(SUT)的热电阻W s(= 1 / kapp)的设备,其全部包括诸如CVD金刚石的主体材料。 一旦光吸收率α1和α2以及至少两个其它晶体或多晶体B1和B2的热电阻W1和W2分别包含与SUT相同的主体材料,并且含有相同类型的杂质或组合 作为SUT的杂质通过一些其它技术来测量,然后本发明的设备可以从仅从SUT的光吸收率的测量中快速地确定SUT的热电阻Ws。 SUT的热电阻Ws的这些测定依赖于我们的发现,存在以下线性关系:W = A +Cα,其中A和C是常数,只要所有体的杂质或杂质的组合B1 ,B2和SUT相同,即使杂质或杂质组合在体B1和B2以及SUT中也具有不同的浓度。
    • 10. 发明授权
    • Method comprising removal of material from a diamond film
    • 包括从金刚石薄膜中去除材料的方法
    • US06197375B1
    • 2001-03-06
    • US08278688
    • 1994-07-21
    • John Edwin GraebnerSungho JinThomas Henry Tiefel
    • John Edwin GraebnerSungho JinThomas Henry Tiefel
    • C23C1626
    • C23C16/56
    • Many potential applications of CVD diamond film require the ability to remove a predetermined quantity of material from a surface of the film. We have discovered that such removal is advantageously accomplished by contacting the surface of the polycrystalline diamond film with a metal selected from Fe, Ni, Mn and Ti (preferably Fe and Mn, most preferably Mn), and maintaining the metal-contacted diamond film at a temperature in the range 600-1100° C. (preferably 800-1000° C.) without relative lateral motion between the film and the metal, for an effective time for removal of the quantity of material, exemplarily less than 100 hours. The metal can be in any appropriate form, e.g., a deposited layer, (including a patterned layer), a foil, or powder. We have also discovered that the local thermal conductivity of CVD diamond films typically increases with distance from the lower surface of an as-grown film. Thus, in applications such as heat spreading it will frequently be advantageous to remove some of the fine-grained, low thermal conductivity material adjacent to the lower surface of the as-grown CVD film. Such removal can be accomplished by means of the above-described technique.
    • CVD金刚石膜的许多潜在应用需要从膜的表面去除预定量的材料的能力。 我们已经发现,这种去除有利地通过使多晶金刚石膜的表面与选自Fe,Ni,Mn和Ti(优选Fe和Mn,最优选Mn)的金属接触,并将金属接触的金刚石膜保持在 温度在600-1100℃(优选800-1000℃)的范围内,而膜和金属之间没有相对的横向运动,用于去除材料量的有效时间,示例性地小于100小时。 金属可以是任何适当的形式,例如沉积层(包括图案层),箔或粉末。 我们还发现,CVD金刚石膜的局部导热率通常随着从生长膜的下表面的距离而增加。 因此,在诸如散热的应用中,通常有利的是去除与生长的CVD膜的下表面相邻的细粒度低的热导率材料。 这种去除可以通过上述技术来实现。