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    • 2. 发明授权
    • Processing platform with integrated particle removal system
    • 具有集成颗粒去除系统的加工平台
    • US06725564B2
    • 2004-04-27
    • US10006020
    • 2001-12-06
    • Reginald W. HunterJoel Brad Bailey
    • Reginald W. HunterJoel Brad Bailey
    • F26B1900
    • H01L21/67196B08B7/00H01L21/67017H01L21/67051H01L21/67069H01L21/6875H01L21/68792Y10S134/902
    • Embodiments of the invention generally provide a multistage semiconductor processing tool, wherein the processing tool includes a first transfer chamber having a first substrate transfer robot positioned therein and at least one load lock chamber in communication with the first transfer chamber. The at least one load lock is generally configured to communicate substrates into and out of the first transfer chamber. Further, the processing tool includes at least one substrate cleaning chamber positioned in communication with the first transfer chamber. The at least one substrate cleaning chamber generally includes a substrate support member, a broadband actuation device in communication with the substrate support member, and a particle removal device configured to sweep away dislodged particles from an area proximate the substrate surface. The processing tool further includes a second transfer chamber having a second substrate transfer robot positioned therein, the second transfer chamber being in selective communication with the first transfer chamber, and at least one substrate processing chamber in communication with the second transfer chamber.
    • 本发明的实施例通常提供一种多级半导体处理工具,其中该处理工具包括一第一传送室,该第一传送室具有位于其中的第一衬底传送机器人和与第一传送室连通的至少一个装载锁定室。 所述至少一个加载锁通常被配置为将基板传送到第一传送室和从第一传送室传出。 此外,处理工具包括至少一个与第一传送室连通的基板清洁室。 所述至少一个衬底清洗室通常包括衬底支撑构件,与衬底支撑构件连通的宽带致动装置,以及被配置为从靠近衬底表面的区域扫除移出的颗粒的颗粒去除装置。 所述处理工具还包括第二传送室,其具有位于其中的第二基板传送机械手,所述第二传送室与所述第一传送室选择性连通,以及至少一个与所述第二传送室连通的基板处理室。
    • 4. 发明授权
    • Factory interface particle removal platform
    • 工厂界面颗粒去除平台
    • US06779226B2
    • 2004-08-24
    • US10006187
    • 2001-12-06
    • Reginald W. HunterJoel Brad Bailey
    • Reginald W. HunterJoel Brad Bailey
    • B08B1100
    • H01L21/6875B08B7/00H01L21/67017H01L21/67051H01L21/67069H01L21/68792
    • Embodiments of the invention generally provide a processing system for removing contaminant particles from substrates. The processing system generally includes at least one processing enclosure having a particle removal assembly positioned therein. The particle removal assembly generally includes a substrate support member, a broadband actuator in communication with the substrate support member, and an air knife assembly positioned proximate the substrate support member. The air knife assembly is generally configured to generate a high pressure laminar flow of gas across the surface of the substrate. The processing system further includes a substrate transfer enclosure in communication with each of the at least one processing enclosures, at least one substrate supply source in communication with the substrate transfer chamber, and at least one transfer robot positioned in the substrate transfer enclosure, the transfer robot being configured to transfer substrates between the at least one substrate supply source and the at least one processing enclosure.
    • 本发明的实施例通常提供用于从基底去除污染物颗粒的处理系统。 处理系统通常包括至少一个具有定位在其中的颗粒去除组件的处理外壳。 颗粒去除组件通常包括衬底支撑构件,与衬底支撑构件连通的宽带致动器以及靠近衬底支撑构件定位的气刀组件。 气刀组件通常构造成在衬底的表面上产生高压的气流层流。 所述处理系统还包括与所述至少一个处理外壳中的每一个连通的基板传送外壳,与所述基板传送室连通的至少一个基板供应源以及位于所述基板传送外壳中的至少一个传送机器人,所述传送 机器人被配置为在所述至少一个基板供应源和所述至少一个处理外壳之间传送基板。