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    • 2. 发明授权
    • Methods for improving adhesion on dielectric substrates
    • 改善电介质基片上粘附性的方法
    • US09349392B1
    • 2016-05-24
    • US13480278
    • 2012-05-24
    • Wanxue ZengWeimin SiYing HongLieping Zhong
    • Wanxue ZengWeimin SiYing HongLieping Zhong
    • G11B5/187G11B5/31
    • G11B5/1272G11B5/1278G11B5/187G11B5/3116G11B5/3163
    • Various embodiments described herein provide for substrate structures including uniform plating seed layers, and that provide favorable adhesion on dielectric substrate layers. According to some embodiments, a methods for forming a magnetic recording pole is provided comprising: forming an insulator layer; forming a trench in the insulator layer; forming an amorphous seed layer over the insulator layer; forming an adhesion layer over the amorphous seed layer, the adhesion layer comprising a physical vapor deposited (PVD) noble metal; forming a plating seed layer over the adhesion layer, the plating seed layer comprising chemical vapor deposited (CVD) Ru; and forming a magnetic material layer over the plating seed layer.
    • 本文描述的各种实施例提供了包括均匀电镀种子层的衬底结构,并且在电介质衬底层上提供有利的粘附。 根据一些实施例,提供了一种用于形成磁记录极的方法,包括:形成绝缘体层; 在绝缘体层中形成沟槽; 在所述绝缘体层上形成无定形晶种层; 在所述无定形种子层上形成粘合层,所述粘合层包括物理气相沉积(PVD)贵金属; 在粘附层上形成电镀种子层,包括化学气相沉积(CVD)Ru的电镀种子层; 以及在所述电镀种子层上形成磁性材料层。