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1. 发明申请

US20080296577A1 Camera module package 审中-公开
标题翻译：相机模块包
公开(公告)号：US20080296577A1
公开(公告)日：2008-12-04
申请号：US12155268
申请日：2008-05-30
申请人： Jingli Yuan , Won Kyu Jeung , Dae Jun Kim , Chang Hyun Lim , Jae Cheon Doh
发明人： Jingli Yuan , Won Kyu Jeung , Dae Jun Kim , Chang Hyun Lim , Jae Cheon Doh
IPC分类号： H01L31/00 , H01L21/02
CPC分类号： H01L27/14618 , H01L27/14687 , H01L31/0203 , H01L31/02325 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/10253 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： There is provided a camera module package including: a substrate having an image sensor disposed on one surface thereof and a pad electrically connected to the image sensor; a protective cap adhered onto the substrate by an adhesive surrounding the image sensor to seal the image sensor, the protective cap transmitting light; and a supporting part surrounding the protective cap, the supporting part adhering and supporting at least one lens formed corresponding to the image sensor. The camera module package is reduced in thickness and size, and minimized in an error of a focal length between the lens and the image sensor, thereby achieving accuracy and high reliability.
摘要翻译：提供了一种照相机模块包装，包括：具有设置在其一个表面上的图像传感器的基板和与图像传感器电连接的焊盘; 保护盖通过围绕图像传感器的粘合剂附着在基板上，以密封图像传感器，保护盖透射光; 以及围绕保护盖的支撑部分，支撑部分粘附并支撑形成对应于图像传感器的至少一个透镜。相机模块包装的厚度和尺寸减小，并且在透镜和图像传感器之间的焦距误差最小化，从而实现精度和高可靠性。

2. 发明申请

US20080296714A1 Wafer level package of image sensor and method for manufacturing the same 审中-公开
标题翻译：图像传感器的晶片级封装及其制造方法
公开(公告)号：US20080296714A1
公开(公告)日：2008-12-04
申请号：US12155267
申请日：2008-05-30
申请人： Jingli Yuan , Won Kvu Jeung , Dae Jun Kim , Chang Hyun Lim , Young Do Kweon , Jae Cheon Doh
发明人： Jingli Yuan , Won Kvu Jeung , Dae Jun Kim , Chang Hyun Lim , Young Do Kweon , Jae Cheon Doh
IPC分类号： H01L31/0232 , H01L31/18
CPC分类号： H01L27/14618 , H01L27/14632 , H01L27/14687 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/16195 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： Provided is a wafer level package of an image sensor capable of simply and easily packaging an image sensor in a packaging process, and a method for manufacturing the same. The wafer level package of an image sensor includes a lower substrate including an image sensor, a conductive pattern coupled to the image sensor, and a plurality of vias coupled to the conductive pattern; a micro lens array film having a plurality of micro lenses corresponding to the image sensor, the micro lenses being formed on the lower substrate; and a sealing line surrounding the image sensor while being spaced apart from the image sensor and being in contact with an upper substrate. The wafer level package may be useful to have an electrical connection structure using vias without any need to a bonding wire, an electrode pad and an electrode lead in the conventional wafer level package since a packaging process is carried out by bonding a wafer for an upper substrate with a plurality of the vias being provided in a wafer for a lower substrate
摘要翻译：提供了能够简单且容易地在封装过程中封装图像传感器的图像传感器的晶片级封装及其制造方法。图像传感器的晶片级封装包括下基板，其包括图像传感器，耦合到图像传感器的导电图案以及耦合到导电图案的多个通孔; 具有与所述图像传感器对应的多个微透镜的微透镜阵列膜，所述微透镜形成在所述下基板上; 以及围绕图像传感器同时与图像传感器间隔开并与上基板接触的密封线。晶片级封装可能有用于具有使用通孔的电连接结构，而不需要常规晶片级封装中的接合线，电极焊盘和电极引线，因为封装过程是通过将用于上部具有多个通孔的基板设置在用于下基板的晶片中

3. 发明申请

US20080304821A1 Camera module package and method of manufacturing the same 审中-公开
标题翻译：相机模块包装及其制造方法相同
公开(公告)号：US20080304821A1
公开(公告)日：2008-12-11
申请号：US12149751
申请日：2008-05-07
申请人： Won Kyu Jeung , Seog Moon Choi , Jingli Yuan , Chang Hyun Lim , Dae Jun Kim
发明人： Won Kyu Jeung , Seog Moon Choi , Jingli Yuan , Chang Hyun Lim , Dae Jun Kim
IPC分类号： G03B17/00 , H01L21/00
CPC分类号： H01L27/14618 , H01L27/14627 , H01L27/14683 , H01L2224/48091 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H01L2924/00014
摘要： The present invention relates to a camera module package having flexibility and a method of manufacturing the same. Provided is the camera module package according to the invention including a silicon wafer mounted with the image sensor in the center of a top surface thereof and provided with pads both sides of the image sensor, a lens unit opened to form a convex lens in a mounting portion of the image sensor in an upper part of the wafer, and a flexible board tightly joined to a bottom surface of the wafer and electrically connected to the pads by an internal pattern. The camera module package can be thinly manufactured and since the camera module package has flexibility, the camera module package can be easily attached to a bendable substrate and to the inside an IT apparatus.
摘要翻译：本发明涉及一种具有灵活性的相机模块封装及其制造方法。提供了根据本发明的相机模块包装，其包括安装有图像传感器的硅晶片在其顶表面的中心并且设置有图像传感器两侧的焊盘，透镜单元被打开以在安装中形成凸透镜图像传感器的一部分在晶片的上部，以及柔性板，其紧密接合到晶片的底表面并且通过内部图案电连接到焊盘。相机模块封装可以被薄制造，并且由于相机模块封装具有灵活性，所以相机模块封装可以容易地附接到可弯曲的基板和IT设备的内部。

4. 发明申请

US20090014827A1 Image sensor module at wafer level, method of manufacturing the same, and camera module 审中-公开
标题翻译：晶圆级图像传感器模块及其制造方法及相机模块
公开(公告)号：US20090014827A1
公开(公告)日：2009-01-15
申请号：US12155836
申请日：2008-06-10
申请人： Chang Hyun Lim , Seog Moon Choi , Dae Jun Kim , Won Kyu Jeung , Jingli Yuan
发明人： Chang Hyun Lim , Seog Moon Choi , Dae Jun Kim , Won Kyu Jeung , Jingli Yuan
IPC分类号： H01L31/0203 , H01L31/18
CPC分类号： H01L27/14618 , H01L2224/13 , H04N5/2257
摘要： Provided is an image sensor module at the wafer level including a wafer; an image sensor mounted on one surface of the wafer; a wireless communication chip formed outside the image sensor on the one surface of the wafer; and a protective cover installed on the one surface of the wafer.
摘要翻译：提供了包括晶片的晶片级的图像传感器模块; 安装在晶片的一个表面上的图像传感器; 在晶片的一个表面上形成在图像传感器外部的无线通信芯片; 以及安装在晶片的一个表面上的保护盖。

5. 发明授权

US07696004B2 Wafer level package fabrication method 有权
标题翻译：晶圆级封装制造方法
公开(公告)号：US07696004B2
公开(公告)日：2010-04-13
申请号：US12155317
申请日：2008-06-02
申请人： Jingli Yuan , Jae Cheon Doh , Si Joong Yang , In Goo Kang , Seung Wook Park
发明人： Jingli Yuan , Jae Cheon Doh , Si Joong Yang , In Goo Kang , Seung Wook Park
IPC分类号： H01L21/00
CPC分类号： H01L23/10 , H01L21/76898 , H01L2924/0002 , H03H9/105 , H03H9/1092 , H01L2924/00
摘要： Provided is a wafer level package fabrication method. The method includes providing a device substrate wafer including one or more devices on an upper surface thereof, and a bonding pad electrically connected to the device, providing a bonding seal surrounding the device along the bonding pad, bonding a cap substrate wafer to the device substrate wafer through the bonding seal, the cap substrate wafer having a via formed in a region corresponding to the bonding pad, forming an external terminal on the cap substrate wafer, the external terminal being electrically connected to the bonding pad, and cutting the cap substrate wafer and the device substrate wafer along a cutting line to individually separate a plurality of wafer level packages. The method is conducive to reducing product size for miniaturization, is capable of performing a bonding process without wafer deformation or damage, and increases freedom in wafer material selection.
摘要翻译：提供了晶片级封装制造方法。该方法包括提供在其上表面上包括一个或多个器件的器件衬底晶片和电连接到该器件的焊盘，提供围绕该焊盘的器件的接合密封，将盖衬底晶片接合到器件衬底晶片通过接合密封，所述盖基板晶片具有形成在与所述接合焊盘相对应的区域中的通孔，在所述盖基板晶片上形成外部端子，所述外部端子电连接到所述接合焊盘，以及切割所述盖基板晶片以及沿着切割线的装置基板晶片，以单独分离多个晶片级封装。该方法有利于减小产品尺寸以实现小型化，能够进行没有晶片变形或损坏的接合工艺，并增加晶片材料选择的自由度。

6. 发明申请

US20080299706A1 Wafer level package fabrication method 有权
标题翻译：晶圆级封装制造方法
公开(公告)号：US20080299706A1
公开(公告)日：2008-12-04
申请号：US12155317
申请日：2008-06-02
申请人： Jingli Yuan , Jae Cheon Doh , Si Joong Yang , In Goo Kang , Seung Wook Park
发明人： Jingli Yuan , Jae Cheon Doh , Si Joong Yang , In Goo Kang , Seung Wook Park
IPC分类号： H01L21/50
CPC分类号： H01L23/10 , H01L21/76898 , H01L2924/0002 , H03H9/105 , H03H9/1092 , H01L2924/00
摘要： Provided is a wafer level package fabrication method. The method includes providing a device substrate wafer including one or more devices on an upper surface thereof, and a bonding pad electrically connected to the device, providing a bonding seal surrounding the device along the bonding pad, bonding a cap substrate wafer to the device substrate wafer through the bonding seal, the cap substrate wafer having a via formed in a region corresponding to the bonding pad, forming an external terminal on the cap substrate wafer, the external terminal being electrically connected to the bonding pad, and cutting the cap substrate wafer and the device substrate wafer along a cutting line to individually separate a plurality of wafer level packages. The method is conducive to reducing product size for miniaturization, is capable of performing a bonding process without wafer deformation or damage, and increases freedom in wafer material selection.
摘要翻译：提供了晶片级封装制造方法。该方法包括提供在其上表面上包括一个或多个器件的器件衬底晶片和电连接到该器件的焊盘，提供围绕该焊盘的器件的接合密封，将盖衬底晶片接合到器件衬底晶片通过接合密封，所述盖基板晶片具有形成在与所述接合焊盘相对应的区域中的通孔，在所述盖基板晶片上形成外部端子，所述外部端子电连接到所述接合焊盘，以及切割所述盖基板晶片以及沿着切割线的装置基板晶片，以单独分离多个晶片级封装。该方法有利于减小产品尺寸以实现小型化，能够进行没有晶片变形或损坏的接合工艺，并增加晶片材料选择的自由度。

7. 发明申请

US20110129994A1 Method of manufacturing a dual face package 有权
标题翻译：制造双面包装的方法
公开(公告)号：US20110129994A1
公开(公告)日：2011-06-02
申请号：US12929614
申请日：2011-02-03
申请人： Seung Wook Park , Young Do Kweon , Jingli Yuan , Seon Hee Moon , Ju Pyo Hong , Jae Kwang Lee
发明人： Seung Wook Park , Young Do Kweon , Jingli Yuan , Seon Hee Moon , Ju Pyo Hong , Jae Kwang Lee
IPC分类号： H01L21/60
CPC分类号： H01L21/76898 , H01L21/481 , H01L23/3114 , H01L23/49827 , H01L2924/0002 , H01L2924/00
摘要： A method of manufacturing a dual face package, including: preparing an upper substrate composed of an insulating layer including a post via-hole; forming a filled electrode in a semiconductor substrate, the filled electrode being connected to a die pad; applying an adhesive layer on one side of the semiconductor substrate including the filled electrode, and attaching the upper substrate to the semiconductor substrate; cutting another side of the semiconductor substrate in a thickness direction, thus making the filled electrode into a through-electrode; and forming a post electrode in the post via-hole, forming an upper redistribution layer connected to the post electrode of the semiconductor substrate, and forming a lower redistribution layer connected to the through-electrode on the other side of the semiconductor substrate.
摘要翻译：一种双面包装的制造方法，包括：准备由包括柱状通孔的绝缘层构成的上基板; 在半导体衬底中形成填充电极，所述填充电极连接到管芯焊盘; 在包括填充电极的半导体衬底的一侧上施加粘合剂层，并将上衬底附接到半导体衬底; 在厚度方向切割半导体衬底的另一侧，从而使填充的电极成为通孔; 在柱状通孔中形成柱状电极，形成与半导体衬底的柱状电极连接的上部再分配层，在半导体衬底的另一侧形成与贯通电极连接的下部再分布层。

8. 发明申请

US20090166859A1 Semiconductor device and method of manufacturing the same 审中-公开
标题翻译：半导体装置及其制造方法
公开(公告)号：US20090166859A1
公开(公告)日：2009-07-02
申请号：US12078049
申请日：2008-03-26
申请人： Jingli Yuan , Young Do Kweon , Jong Hwan Baek , Joon Seok Kang , Seung Wook Park , Jong Yun Lee
发明人： Jingli Yuan , Young Do Kweon , Jong Hwan Baek , Joon Seok Kang , Seung Wook Park , Jong Yun Lee
IPC分类号： H01L23/488 , H01L21/44
CPC分类号： H01L24/05 , H01L24/03 , H01L24/11 , H01L24/13 , H01L2224/02313 , H01L2224/02351 , H01L2224/0236 , H01L2224/02377 , H01L2224/0332 , H01L2224/0401 , H01L2224/05548 , H01L2224/05567 , H01L2224/05572 , H01L2224/0579 , H01L2224/058 , H01L2224/11849 , H01L2224/13022 , H01L2224/131 , H01L2924/00013 , H01L2924/0002 , H01L2924/01019 , H01L2924/01033 , H01L2924/01047 , H01L2924/014 , H01L2924/00014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552
摘要： Provided is a semiconductor device including a wafer having an electrode pad; an insulating layer that is formed on the wafer and has an exposure hole formed in one side thereof, the exposure layer exposing the electrode pad, and a support post formed in the other side, the support post having a buffer groove; a redistribution layer that is formed on the top surface of the insulating layer and has one end connected to the electrode pad and the other end extending to the support post; an encapsulation layer that is formed on the redistribution layer and the insulating layer and exposes the redistribution layer formed on the support post; and a solder bump that is provided on the exposed portion of the redistribution layer.
摘要翻译：提供一种半导体器件，其包括具有电极焊盘的晶片; 绝缘层，其形成在所述晶片上并且具有形成在其一侧的曝光孔，所述曝光层暴露所述电极焊盘;以及支撑柱，形成在所述另一侧，所述支撑柱具有缓冲槽; 形成在所述绝缘层的顶表面上并且一端连接到所述电极焊盘并且另一端延伸到所述支撑柱的再分布层; 形成在再分配层和绝缘层上并且暴露形成在支撑柱上的再分布层的封装层; 以及设置在再分配层的暴露部分上的焊料凸块。

9. 发明申请

US20090166862A1 Semiconductor device and method of manufacturing the same 审中-公开
标题翻译：半导体装置及其制造方法
公开(公告)号：US20090166862A1
公开(公告)日：2009-07-02
申请号：US12213367
申请日：2008-06-18
申请人： Young Do Kweon , Jae Kwang Lee , Jong Hwan Baek , Hyung Jin Jeon , Jingli Yuan
发明人： Young Do Kweon , Jae Kwang Lee , Jong Hwan Baek , Hyung Jin Jeon , Jingli Yuan
IPC分类号： H01L23/498 , H01L21/768
CPC分类号： H01L24/11 , H01L2224/05001 , H01L2224/05024 , H01L2224/05026 , H01L2224/05548 , H01L2224/13099 , H01L2224/16 , H01L2924/00014 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2224/05599 , H01L2224/05099
摘要： Provided is a semiconductor device including a wafer having an electrode pad; an insulation layer that is formed on the wafer and has an exposure hole exposing the electrode pad; a redistribution layer that is formed on the insulation layer and the exposure hole of the insulation layer and has one end connected to the electrode pad; a conductive post that is formed at the other end of the redistribution layer; an encapsulation layer that is formed on the redistribution layer and the insulation layer such that the upper end portion of the conductive post is exposed; and a solder bump that is formed on the exposed upper portion of the conducive post.
摘要翻译：提供一种半导体器件，其包括具有电极焊盘的晶片; 绝缘层，其形成在所述晶片上并且具有暴露所述电极焊盘的曝光孔; 形成在所述绝缘层和所述绝缘层的曝光孔上并且一端连接到所述电极焊盘的再分配层; 形成在再分布层的另一端的导电柱; 形成在再分布层和绝缘层上的封装层，使得导电柱的上端部露出; 以及形成在所述有利柱的暴露的上部上的焊料凸块。

10. 发明授权

US07465747B2 Fluorescent label compounds 有权
标题翻译：荧光标签化合物
公开(公告)号：US07465747B2
公开(公告)日：2008-12-16
申请号：US10506242
申请日：2003-03-10
申请人： Kazuko Matsumoto , Jingli Yuan , Guilan Wang , Mingqian Tan
发明人： Kazuko Matsumoto , Jingli Yuan , Guilan Wang , Mingqian Tan
IPC分类号： C07D401/02 , A61K31/44
CPC分类号： C07D213/36 , C07D401/14 , G01N33/533
摘要： It is intended to provide novel labeling reagents characterized by having a group capable of binding to a substance to be labeled (for example, a biological substance, a physiologically active substance, etc.), easily forming a complex together with a rare earth ion, the complex being stable in an aqueous solution, and having a sufficient fluorescence intensity and a long fluorescence life time regardless of buffer types; complexes composed of the above labeling reagent with a rare earth ion; fluorescence labels containing the above complex; a fluorescence assay method using the above fluorescent label; etc. Namely, labeling reagents comprising a compound having a 2,2′:6′,2″-tripyridine skeleton or a 2,6-dipyrazolopyridine skeleton and having a group capable of binding to a substance to be labeled (for example, a biological substance, a physiologically active substance, etc.) and a group capable of forming a complex together with a rare earth ion; complexes composed of the above labeling reagent with a rare earth ion; fluorescence labels containing the above complex; a fluorescence labeling method using the above complex as a label; and a fluorescence assay method using the above fluorescent label.
摘要翻译：旨在提供新颖的标记试剂，其特征在于具有能够与待标记的物质结合的基团（例如生物物质，生理活性物质等），容易与稀土离子一起形成络合物，该复合物在水溶液中稳定，并且具有足够的荧光强度和长的荧光寿命，而不管缓冲液类型如何; 由上述标记试剂与稀土离子组成的络合物; 含有上述复合物的荧光标记物; 使用上述荧光标记物的荧光检测方法; 即，包括具有2,2'：6'，2“ - 三吡啶骨架或2,6-二吡唑并吡啶骨架的化合物的标记试剂，并具有能够结合待标记的物质的基团（例如，生物物质，生理活性物质等）和能够与稀土离子一起形成络合物的基团; 由上述标记试剂与稀土离子组成的络合物; 含有上述复合物的荧光标记物; 使用上述复合物作为标签的荧光标记方法; 和使用上述荧光标记物的荧光测定方法。

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