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1. 发明申请

US20130210173A1 Multiple Zone Temperature Control for CMP 审中-公开
标题翻译：多区域温度控制CMP
公开(公告)号：US20130210173A1
公开(公告)日：2013-08-15
申请号：US13372872
申请日：2012-02-14
申请人： Jiann Lih Wu , Bo-I Lee , Soon Kang Huang , Chih-I Peng , Chi-Ming Yang , Chin-Hsiang Lin
发明人： Jiann Lih Wu , Bo-I Lee , Soon Kang Huang , Chih-I Peng , Chi-Ming Yang , Chin-Hsiang Lin
IPC分类号： H01L21/66 , B24B49/00
CPC分类号： H01L22/12 , B24B37/013 , B24B37/015 , B24B49/105 , B24B49/14 , H01L22/26
摘要： To provide improved planarization, techniques in accordance with this disclosure include a CMP station that includes a plurality of concentric temperature control elements arranged over a number of concentric to-be-polished wafer surfaces. During polishing, a wafer surface planarity sensor monitors relative heights of the concentric to-be-polished wafer surfaces, and adjusts the temperatures of the concentric temperature control elements to provide an extremely well planarized wafer surface. Other systems and methods are also disclosed.
摘要翻译：为了提供改进的平面化，根据本公开的技术包括CMP站，其包括布置在多个同心待抛光晶片表面上的多个同心温度控制元件。在抛光期间，晶片表面平面度传感器监测同心待抛光的晶片表面的相对高度，并且调节同心温度控制元件的温度以提供非常好的平坦化晶片表面。还公开了其它系统和方法。

2. 发明授权

US06221199B1 Apparatus and method for removing an adhesive bonded pad 有权
标题翻译：用于去除粘合剂粘合垫的设备和方法
公开(公告)号：US06221199B1
公开(公告)日：2001-04-24
申请号：US09243033
申请日：1999-02-03
申请人： Yu-Chia Chang , Chih-I Peng , Chen-Chia Chiu , Yu-Sheng Shen
发明人： Yu-Chia Chang , Chih-I Peng , Chen-Chia Chiu , Yu-Sheng Shen
IPC分类号： B32B3500
CPC分类号： B24B37/20 , B24B37/34 , Y10T156/1174 , Y10T156/1184 , Y10T156/195
摘要： An apparatus and a method for removing an adhesive bonded pad from a backing plate are disclosed. The apparatus and the method are particularly suitable for removing a polishing pad in a chemical mechanical polishing apparatus, however, they can be used for removal of any other adhesively bonded pad on a rigid surface. The removal apparatus can be advantageously used without causing any danger to a machine operator even when a slippage of the tool has occurred. The T-shaped removal tool can be operated in a rotational motion such that an adhesive bond existed between a pad and a backing surface may be broken by shear force. A minimal amount of force is required due to the large T-shaped handle used for the removal operation.
摘要翻译：公开了一种用于从背板去除粘合剂粘合垫的设备和方法。该装置和方法特别适合于去除化学机械抛光装置中的抛光垫，然而，它们可用于去除刚性表面上的任何其它粘合粘合垫。即使当工具的滑动发生时，也可以有利地使用去除装置，而不会对机器操作者造成任何危险。 T形去除工具可以以旋转运动操作，使得存在于垫和背衬表面之间的粘合剂粘合可能被剪切力破坏。由于用于拆卸操作的大的T形把手需要最小的力。

3. 发明授权

US06857942B1 Apparatus and method for pre-conditioning a conditioning disc 失效
标题翻译：用于预调节调节盘的装置和方法
公开(公告)号：US06857942B1
公开(公告)日：2005-02-22
申请号：US09481224
申请日：2000-01-11
申请人： Yu-Liang Lin , Chih-I Peng
发明人： Yu-Liang Lin , Chih-I Peng
IPC分类号： B24B1/00 , B24B37/04 , B24B53/007 , B24B53/12
CPC分类号： B24B53/017 , B24B53/12
摘要： An apparatus and a method for off-line pre-conditioning a conditioning disc that is used in a chemical mechanical polishing process are provided. In the apparatus, an upper platform for mounting a conditioning disc thereto and a lower platform for mounting a polishing pad thereto are engaged together under a pre-set pressure and rotated in opposite directions for a pre-set length of time. The apparatus is effective in removing loose particles from the surface of the conditioning disc such that the possibility of any such particles causing scratches on a wafer surface during a subsequently conducted chemical mechanical polishing process is eliminated. The present invention novel apparatus can be used off-line for pre-conditioning a conditioning disc such that valuable machine time of a chemical mechanical polishing apparatus is not wasted.
摘要翻译：提供了用于离线预处理用于化学机械抛光工艺中的调节盘的设备和方法。在该装置中，用于安装调节盘的上平台和用于将抛光垫安装在其上的下平台在预定压力下接合在一起并以相反方向旋转预定的时间长度。该装置有效地从调节盘的表面去除松散的颗粒，使得在随后进行的化学机械抛光工艺期间任何这种颗粒在晶片表面上引起划痕的可能性被消除。本发明的新型设备可以离线使用，用于对调节盘进行预处理，使得化学机械抛光装置的有价值的机器时间不被浪费。

4. 发明申请

US20140053980A1 SYSTEM AND METHOD FOR OPERATING CHEMICAL MECHANICAL POLISHING PROCESS 审中-公开
标题翻译：操作化学机械抛光工艺的系统和方法
公开(公告)号：US20140053980A1
公开(公告)日：2014-02-27
申请号：US13591167
申请日：2012-08-21
申请人： Chih-I Peng , Hsiang-Pi Chang , Cary Chia-Chiung Lo , Teng-Chun Tsai , Kuo-Yin Lin , Chih-Yuan Yang
发明人： Chih-I Peng , Hsiang-Pi Chang , Cary Chia-Chiung Lo , Teng-Chun Tsai , Kuo-Yin Lin , Chih-Yuan Yang
IPC分类号： B01D53/26 , B44C1/22
CPC分类号： B01D53/265
摘要： A chemical mechanical polishing (CMP) chamber is disclosed. The CMP chamber includes a chamber body, a door mounted on the chamber body and a chamber substructure being one selected from a group consisting of a moisture separator separating a moisture generated in the CMP chamber, a supplementary exhaust port, a transparent window mounted on the door, a sampling port mounted on the door, a sealing material including a metal frame, an o-ring for sealing the door and a combination thereof.
摘要翻译：公开了一种化学机械抛光（CMP）室。 CMP室包括室主体，安装在室主体上的门和一个室底部结构，其中一个选自一个选自由分离在CMP室中产生的水分的湿气分离器组成的组，辅助排气口，安装在该室主体上的透明窗口门，安装在门上的取样口，包括金属框架的密封材料，用于密封门的O形环及其组合。

5. 发明授权

US06672950B2 Contamination prevention system and method 有权
标题翻译：防污染系统及方法
公开(公告)号：US06672950B2
公开(公告)日：2004-01-06
申请号：US10062965
申请日：2002-01-30
申请人： Chih-I Peng , Wen-Ten Chen , Yu-Chia Chang , Yao-Hsiang Liang
发明人： Chih-I Peng , Wen-Ten Chen , Yu-Chia Chang , Yao-Hsiang Liang
IPC分类号： B24B5504
CPC分类号： B24B37/34 , B24B53/017 , B24B55/12
摘要： The present invention discloses a contamination prevention system and method of use having a contamination prevention shield that cooperates with a high pressure rinse apparatus to prevent contamination of particles within a CMP apparatus. The contamination prevention shield has a cleaning cup, two vertical side shields, a front vertical shield, and a floor that cooperate to prevent leakage of fluid splattered during a high pressure rinse of the CMP apparatus and an interior portion of a CMP apparatus housing; and a high pressure rinse apparatus connected to the contamination prevention shield having a conduit with at least one nozzle for dispensing cleaning fluid during a high pressure rinse cycle. Additionally, a plurality of contamination prevention shields may be used in combination with the high pressure rinse apparatus to further prevent contamination of an interior portion of the housing and the CMP apparatus.
摘要翻译：本发明公开了一种防污染系统和使用方法，其具有与高压冲洗装置配合的防污染屏蔽物，以防止CMP装置内的颗粒污染。防污染屏蔽件具有清洁杯，两个垂直侧屏蔽，前垂直屏蔽和底板，其配合以防止在CMP设备的高压冲洗期间溅射的流体的泄漏和CMP设备壳体的内部; 以及连接到防污染屏蔽件的高压冲洗装置，其具有在高压漂洗循环期间具有用于分配清洁流体的至少一个喷嘴的导管。另外，多个防污屏蔽可以与高压冲洗装置组合使用，以进一步防止外壳和CMP装置的内部部分的污染。

6. 发明授权

US10279311B2 System and method for operating chemical mechanical polishing process 有权
公开(公告)号：US10279311B2
公开(公告)日：2019-05-07
申请号：US13591167
申请日：2012-08-21
申请人： Chih-I Peng , Hsiang-Pi Chang , Cary Chia-Chiung Lo , Teng-Chun Tsai , Kuo-Yin Lin , Chih-Yuan Yang
发明人： Chih-I Peng , Hsiang-Pi Chang , Cary Chia-Chiung Lo , Teng-Chun Tsai , Kuo-Yin Lin , Chih-Yuan Yang
IPC分类号： B24B37/04 , B24B37/30 , H01L21/67 , B01D53/26 , F24F3/16
摘要： A chemical mechanical polishing (CMP) chamber is disclosed. The CMP chamber includes a chamber body, a door mounted on the chamber body and a chamber substructure being one selected from a group consisting of a moisture separator separating a moisture generated in the CMP chamber, a supplementary exhaust port, a transparent window mounted on the door, a sampling port mounted on the door, a sealing material including a metal frame, an o-ring for sealing the door and a combination thereof.

7. 发明授权

US09937536B2 Air purge cleaning for semiconductor polishing apparatus 有权
公开(公告)号：US09937536B2
公开(公告)日：2018-04-10
申请号：US13547275
申请日：2012-07-12
申请人： Kuo-Yin Lin , Chih-I Peng , Kun-Tai Wu , Teng-Chun Tsai , Hsiang-Pi Chang , Cary Chia-Chiung Lo
发明人： Kuo-Yin Lin , Chih-I Peng , Kun-Tai Wu , Teng-Chun Tsai , Hsiang-Pi Chang , Cary Chia-Chiung Lo
IPC分类号： B08B9/093 , H01L21/67 , B24B37/34 , B08B5/02
CPC分类号： B08B9/093 , B08B5/02 , B24B37/34 , H01L21/67028
摘要： Among other things, one or more techniques and/or systems are provided for cleaning a polishing module of a semiconductor polishing apparatus. Purge air flow can be supplied into the polishing module (e.g., directed towards a polishing unit, a shield, and/or other polishing components) to create turbulence air flow within the polishing module. An auxiliary exhaust can be invoked to exhaust one or more particulates removed from the polishing module by the turbulence air flow. A purge air flow cycle can be performed by cycling the purge air flow and the auxiliary exhaust between on and off states. One or more purge air flow cycles can be performed during a main air flow cycle where laminar air flow is supplied into the polishing module and exhausted using a main exhaust. In this way, one or more particulates can be cleaned from the polishing module.

8. 发明申请

US20140014136A1 AIR PURGE CLEANING FOR SEMICONDUCTOR POLISHING APPARATUS 有权
标题翻译：用于半导体抛光装置的空气清洁
公开(公告)号：US20140014136A1
公开(公告)日：2014-01-16
申请号：US13547275
申请日：2012-07-12
申请人： Kuo-Yin Lin , Chih-I Peng , Kun-Tai Wu , Teng-Chun Tsai , Hsiang-Pi Chang , Cary Chia-Chiung Lo
发明人： Kuo-Yin Lin , Chih-I Peng , Kun-Tai Wu , Teng-Chun Tsai , Hsiang-Pi Chang , Cary Chia-Chiung Lo
IPC分类号： B08B9/093
CPC分类号： B08B9/093 , B08B5/02 , B24B37/34 , H01L21/67028
摘要： Among other things, one or more techniques and/or systems are provided for cleaning a polishing module of a semiconductor polishing apparatus. Purge air flow can be supplied into the polishing module (e.g., directed towards a polishing unit, a shield, and/or other polishing components) to create turbulence air flow within the polishing module. An auxiliary exhaust can be invoked to exhaust one or more particulates removed from the polishing module by the turbulence air flow. A purge air flow cycle can be performed by cycling the purge air flow and the auxiliary exhaust between on and off states. One or more purge air flow cycles can be performed during a main air flow cycle where laminar air flow is supplied into the polishing module and exhausted using a main exhaust. In this way, one or more particulates can be cleaned from the polishing module.
摘要翻译：除其他之外，还提供了一种或多种技术和/或系统来清洁半导体抛光装置的抛光模块。吹扫空气流可以被提供到抛光模块中（例如，指向抛光单元，屏蔽件和/或其它抛光部件），以在抛光模块内产生湍流空气流。可以调用辅助排气以排出通过湍流空气流从抛光模块移除的一个或多个颗粒。吹扫空气流循环可以通过在打开和关闭状态之间循环吹扫空气流和辅助排气来进行。在主空气流循环期间可以执行一个或多个吹扫空气流循环，其中层流气流被供应到抛光模块中并且使用主排气排出。以这种方式，可以从抛光模块清洁一个或多个颗粒。

9. 发明授权

US06394886B1 Conformal disk holder for CMP pad conditioner 有权
标题翻译：用于CMP垫调节器的保形盘支架
公开(公告)号：US06394886B1
公开(公告)日：2002-05-28
申请号：US09975539
申请日：2001-10-10
申请人： Wen-Ten Chen , Yao-Hsiang Liang , Chih-I Peng , Yu-Chia Chang
发明人： Wen-Ten Chen , Yao-Hsiang Liang , Chih-I Peng , Yu-Chia Chang
IPC分类号： B24B4702
CPC分类号： B24B53/017 , B24B53/12
摘要： A conformal disk holder for holding a rotating disk against a surface of a polishing pad is described. The conformal disk holder can be used for any polishing apparatus, but is particularly suited for use in a CMP pad conditioning disk. The conformal disk holder is constructed by a cover member, a flexural plate member and a base member. The flexural plate member has a center protrusion with a downwardly facing convex surface for intimately engaging an upwardly facing concave surface on a center protrusion of the base member. The intimate engagement between the convex surface and the concave surface allows at least a 5° tilt of the base member from a horizontal plane, and preferably allows a tilt between about 5° and about 30°.
摘要翻译：描述了用于将旋转盘保持抵靠抛光垫的表面的保形盘保持器。共形盘保持器可用于任何抛光装置，但特别适用于CMP垫调节盘。共形盘保持器由盖构件，弯曲板构件和基座构件构成。弯曲板构件具有中心突起，其具有向下的凸起表面，用于紧密接合基座构件的中心突出部上的面向上的凹面。凸表面和凹面之间的紧密接合允许基部构件从水平面至少5°倾斜，并且优选地允许约5°至约30°之间的倾斜。

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