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1. 发明申请

US20120241116A1 REMOVING MATERIAL FROM DEFECTIVE OPENING IN GLASS MOLD 有权
标题翻译：从玻璃模具中的缺陷开启中去除材料
公开(公告)号：US20120241116A1
公开(公告)日：2012-09-27
申请号：US13491093
申请日：2012-06-07
申请人： Jerome D. Cohen , Robert G. Haas , Enrico Herz , Michael Teich , Christopher L. Tessler
发明人： Jerome D. Cohen , Robert G. Haas , Enrico Herz , Michael Teich , Christopher L. Tessler
IPC分类号： B22D46/00 , B22D25/02
CPC分类号： B23K1/018 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L2224/11 , H01L2224/11003 , H01L2224/111 , H01L2924/14 , H05K3/3478 , H05K2203/0113 , H05K2203/107 , Y10T156/10
摘要： Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.
摘要翻译：公开了使用激光脉冲从玻璃模具中的缺陷开口移除材料的方法，修理玻璃模具和用于注射成型焊料的相关玻璃模具（IMS）。在一个实施例中，一种方法包括提供包括多个焊料填充开口的玻璃模具; 识别玻璃模具中有缺陷的开口; 通过向缺陷开口施加激光脉冲从缺陷开口移除材料; 并通过以下方式填补缺陷开口来修复缺陷开口：通过向开口施加激光脉冲从玻璃模具中的开口去除冗余的，无缺陷的焊料部分，并且将冗余的，无缺陷的缺陷开口处的焊料部分。

2. 发明授权

US08237086B2 Removing material from defective opening in glass mold 有权
标题翻译：从玻璃模具中打开的缺陷中取出材料
公开(公告)号：US08237086B2
公开(公告)日：2012-08-07
申请号：US12014959
申请日：2008-01-16
申请人： Jerome D. Cohen , Robert G. Haas , Enrico Herz , Michael Teich , Christopher L. Tessler
发明人： Jerome D. Cohen , Robert G. Haas , Enrico Herz , Michael Teich , Christopher L. Tessler
IPC分类号： B23K26/36
CPC分类号： B23K1/018 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L2224/11 , H01L2224/11003 , H01L2224/111 , H01L2924/14 , H05K3/3478 , H05K2203/0113 , H05K2203/107 , Y10T156/10
摘要： Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.
摘要翻译：公开了使用激光脉冲从玻璃模具中的缺陷开口移除材料的方法，修理玻璃模具和用于注射成型焊料的相关玻璃模具（IMS）。在一个实施例中，一种方法包括提供包括多个焊料填充开口的玻璃模具; 识别玻璃模具中有缺陷的开口; 通过向缺陷开口施加激光脉冲从缺陷开口移除材料; 并通过以下方式填补缺陷开口来修复缺陷开口：通过向开口施加激光脉冲从玻璃模具中的开口去除冗余的，无缺陷的焊料部分，并且将冗余的，无缺陷的缺陷开口处的焊料部分。

3. 发明申请

US20090179020A1 REMOVING MATERIAL FROM DEFECTIVE OPENING IN GLASS MOLD AND RELATED GLASS MOLD FOR INJECTION MOLDED SOLDER 有权
标题翻译：从玻璃模具中的有缺陷的开放中去除材料以及用于注射成型的焊接的相关玻璃模具
公开(公告)号：US20090179020A1
公开(公告)日：2009-07-16
申请号：US12014959
申请日：2008-01-16
申请人： Jerome D. Cohen , Robert G. Haas , Enrico Herz , Michael Teich , Christopher L. Tessler
发明人： Jerome D. Cohen , Robert G. Haas , Enrico Herz , Michael Teich , Christopher L. Tessler
IPC分类号： B23K26/36 , B22C9/20
CPC分类号： B23K1/018 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L2224/11 , H01L2224/11003 , H01L2224/111 , H01L2924/14 , H05K3/3478 , H05K2203/0113 , H05K2203/107 , Y10T156/10
摘要： Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.
摘要翻译：公开了使用激光脉冲从玻璃模具中的缺陷开口移除材料的方法，修理玻璃模具和用于注射成型焊料的相关玻璃模具（IMS）。在一个实施例中，一种方法包括提供包括多个焊料填充开口的玻璃模具; 识别玻璃模具中有缺陷的开口; 通过向缺陷开口施加激光脉冲从缺陷开口移除材料; 并通过以下方式填补缺陷开口来修复缺陷开口：通过向开口施加激光脉冲从玻璃模具中的开口去除冗余的，无缺陷的焊料部分，并且将冗余的，无缺陷的缺陷开口处的焊料部分。

4. 发明授权

US09254533B2 Removing material from defective opening in glass mold 有权
标题翻译：从玻璃模具中打开的缺陷中取出材料
公开(公告)号：US09254533B2
公开(公告)日：2016-02-09
申请号：US13491093
申请日：2012-06-07
申请人： Jerome D. Cohen , Robert G. Haas , Enrico Herz , Michael Teich , Christopher L. Tessler
发明人： Jerome D. Cohen , Robert G. Haas , Enrico Herz , Michael Teich , Christopher L. Tessler
IPC分类号： B23K1/018 , B23K1/005 , H05K3/34 , B23K26/40
CPC分类号： B23K1/018 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L2224/11 , H01L2224/11003 , H01L2224/111 , H01L2924/14 , H05K3/3478 , H05K2203/0113 , H05K2203/107 , Y10T156/10
摘要： Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.
摘要翻译：公开了使用激光脉冲从玻璃模具中的缺陷开口移除材料的方法，修理玻璃模具和用于注射成型焊料的相关玻璃模具（IMS）。在一个实施例中，一种方法包括提供包括多个焊料填充开口的玻璃模具; 识别玻璃模具中有缺陷的开口; 通过向缺陷开口施加激光脉冲从缺陷开口移除材料; 并通过以下方式填补缺陷开口来修复缺陷开口：通过向开口施加激光脉冲从玻璃模具中的开口去除冗余的，无缺陷的焊料部分，并且将冗余的，无缺陷的缺陷开口处的焊料部分。

5. 发明授权

US08800952B2 Removing material from defective opening in glass mold and related glass mold for injection molded solder 有权
标题翻译：从注射成型焊料玻璃模具及相关玻璃模具中取出有缺陷的材料
公开(公告)号：US08800952B2
公开(公告)日：2014-08-12
申请号：US13432966
申请日：2012-03-28
申请人： Jerome D. Cohen , Robert G. Haas , Enrico Herz , Michael Teich , Christopher L. Tessler
发明人： Jerome D. Cohen , Robert G. Haas , Enrico Herz , Michael Teich , Christopher L. Tessler
IPC分类号： B23K26/36
CPC分类号： B23K1/018 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L2224/11 , H01L2224/11003 , H01L2224/111 , H01L2924/14 , H05K3/3478 , H05K2203/0113 , H05K2203/107 , Y10T156/10
摘要： Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.
摘要翻译：公开了使用激光脉冲从玻璃模具中的缺陷开口移除材料的方法，修理玻璃模具和用于注射成型焊料的相关玻璃模具（IMS）。在一个实施例中，一种方法包括提供包括多个焊料填充开口的玻璃模具; 识别玻璃模具中有缺陷的开口; 通过向缺陷开口施加激光脉冲从缺陷开口移除材料; 并通过以下方式填补缺陷开口来修复缺陷开口：通过向开口施加激光脉冲从玻璃模具中的开口去除冗余的，无缺陷的焊料部分，并且将冗余的，无缺陷的缺陷开口处的焊料部分。

6. 发明申请

US20120186771A1 REMOVING MATERIAL FROM DEFECTIVE OPENING IN GLASS MOLD AND RELATED GLASS MOLD FOR INJECTION MOLDED SOLDER 有权
标题翻译：从玻璃模具中的有缺陷的开放中去除材料以及用于注射成型的焊接的相关玻璃模具
公开(公告)号：US20120186771A1
公开(公告)日：2012-07-26
申请号：US13432966
申请日：2012-03-28
申请人： Jerome D. Cohen , Robert G. Haas , Enrico Herz , Michael Teich , Christopher L. Tessler
发明人： Jerome D. Cohen , Robert G. Haas , Enrico Herz , Michael Teich , Christopher L. Tessler
IPC分类号： B22C9/00
CPC分类号： B23K1/018 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L2224/11 , H01L2224/11003 , H01L2224/111 , H01L2924/14 , H05K3/3478 , H05K2203/0113 , H05K2203/107 , Y10T156/10
摘要： Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.
摘要翻译：公开了使用激光脉冲从玻璃模具中的缺陷开口移除材料的方法，修理玻璃模具和用于注射成型焊料的相关玻璃模具（IMS）。在一个实施例中，一种方法包括提供包括多个焊料填充开口的玻璃模具; 识别玻璃模具中有缺陷的开口; 通过向缺陷开口施加激光脉冲从缺陷开口移除材料; 并通过以下方式填补缺陷开口来修复缺陷开口：通过向开口施加激光脉冲从玻璃模具中的开口去除冗余的，无缺陷的焊料部分，并且将冗余的，无缺陷的缺陷开口处的焊料部分。

7. 发明申请

US20090179019A1 REMOVING MATERIAL FROM DEFECTIVE OPENING IN GLASS MOLD 审中-公开
标题翻译：从玻璃模具中的缺陷开启中去除材料
公开(公告)号：US20090179019A1
公开(公告)日：2009-07-16
申请号：US12014940
申请日：2008-01-16
申请人： Jerome D. Cohen , Robert G. Haas , Christopher L. Tessler
发明人： Jerome D. Cohen , Robert G. Haas , Christopher L. Tessler
IPC分类号： B23K26/36
CPC分类号： H05K3/3478 , B23K1/018 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L24/11 , H01L2224/11003 , H01L2224/111 , H01L2924/14 , H05K2203/0113 , H05K2203/107
摘要： Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; and removing material from the defective opening by applying a laser pulse to the defective opening.
摘要翻译：公开了使用激光脉冲从玻璃模具中的缺陷开口中去除材料的方法，修理注射成型焊料用玻璃模具（IMS）。在一个实施例中，一种方法包括提供包括多个焊料填充开口的玻璃模具; 识别玻璃模具中有缺陷的开口; 以及通过向缺陷开口施加激光脉冲从缺陷开口移除材料。

8. 发明申请

US20080302860A1 AIR BEARING GAP CONTROL FOR INJECTION MOLDED SOLDER HEADS 失效
标题翻译：注射成型焊枪头的空气轴承挡板控制
公开(公告)号：US20080302860A1
公开(公告)日：2008-12-11
申请号：US11760813
申请日：2007-06-11
申请人： Glen N. Biggs , Timothy J. Chainer , John P. Karidis , Dennis G. Manzer , Christopher L. Tessler
发明人： Glen N. Biggs , Timothy J. Chainer , John P. Karidis , Dennis G. Manzer , Christopher L. Tessler
IPC分类号： B23K31/02
CPC分类号： B23K3/0623
摘要： An air bearing gap control arrangement for injection molded solder filler heads. Also provided is a method of providing for a gap control for injection molded solder filler heads utilizing an air bearing arrangement. Provided is a C-ring seal, at the lower or dispensing region of the solder filler head structure, wherein the C-shape is open at the leading edge thereof. Hereby, a prevalent leading edge gap is tightly controlled by means of pressurized air in order to form an air bearing. Downstream of this leading edge is the molten solder, which is contained within a very narrow gap height between the solder filler head and the mold. As the solder fills the pits or recesses which are formed in the mold surface, air will rush out or be displaced from the pits towards the air bearing and is then expelled, while the deposited solder remains in place.
摘要翻译：用于注射成型焊料填充头的空气轴承间隙控制装置。还提供了一种利用空气轴承装置为注射成型的焊料填充头提供间隙控制的方法。提供了在焊料填充头结构的下部或分配区域处的C形环密封件，其中C形在其前缘处是敞开的。因此，为了形成空气轴承，通过加压空气严格控制流行的前缘间隙。该前沿的下游是熔融焊料，其被包含在焊料填充头和模具之间的非常窄的间隙高度内。当焊料填充形成在模具表面中的凹坑或凹槽时，空气将从凹坑向空气轴承移出或移出，然后排出，同时沉积的焊料保持在适当的位置。

9. 发明授权

US5905566A Laser ablation top surface reference chuck 失效
标题翻译：激光烧蚀顶面参考卡盘
公开(公告)号：US5905566A
公开(公告)日：1999-05-18
申请号：US838588
申请日：1997-04-10
申请人： Ralph R. Comulada , Bouwe W. Leenstra , Christopher L. Tessler
发明人： Ralph R. Comulada , Bouwe W. Leenstra , Christopher L. Tessler
IPC分类号： H01L21/68 , H02N13/00
CPC分类号： H02N13/00 , H01L21/68
摘要： A reference chuck which is used with a leveling device for holding microelectronic substrates and other electronic component substrates for laser ablation and other exposure processes, the chuck comprising a frame body for supporting the substrate to be processed, clamping means at the periphery of the frame body for holding the substrate to the frame body and elastomeric means for urging the substrate mounted in the reference chuck against the clamping means. The undersides of the clamping means which contacts the upper surface of the substrate forms in its tightened position a clamping plane which clamping plane is parallel with an established plane of the lower surface of the chuck. The reference chuck provides a very low profile envelope for use with conventional leveling devices and the top surface of the substrate and the lower surface of the reference chuck are in parallel planes when the chuck is placed on the working surface of the leveling device.
摘要翻译：一种与用于保持微电子基板和其他用于激光烧蚀和其他曝光工艺的电子部件基板的调平装置一起使用的参考卡盘，该卡盘包括用于支撑待加工基板的框架体，在框体周边的夹紧装置用于将基板保持在框体上，以及用于将安装在基准卡盘中的基板推向夹紧装置的弹性装置。夹紧装置的与基板的上表面接触的下侧在紧固位置形成夹紧平面，夹紧平面与卡盘的下表面的已建立的平面平行。参考卡盘提供了一个非常低的外形，用于与传统的调平装置一起使用，当卡盘放置在整平装置的工作表面上时，基板的顶表面和基准卡盘的下表面处于平行的平面。

10. 发明申请

US20090020590A1 PROCESS FOR MAKING INTERCONNECT SOLDER Pb-FREE BUMPS FREE FROM ORGANO-TIN/TIN DEPOSITS ON THE WAFER SURFACE 有权
标题翻译：制造互连焊接工艺的方法无铅焊锡从无机表面上的有机锡/锡沉积物
公开(公告)号：US20090020590A1
公开(公告)日：2009-01-22
申请号：US11778678
申请日：2007-07-17
申请人： Sarah H. Knickerbocker , Sean A. Allen , John J. Garant , Jerry A. Gorrell , Phillip W Palmatier , Christopher L. Tessler
发明人： Sarah H. Knickerbocker , Sean A. Allen , John J. Garant , Jerry A. Gorrell , Phillip W Palmatier , Christopher L. Tessler
IPC分类号： B23K31/02
CPC分类号： B23K3/0623 , B23K2101/40
摘要： A method is provided for making of interconnect solder bumps on a wafer or other electronic device without depositing any significant amount of tin or other solder component from the solder onto the wafer surface which tin can cause shorts or other defects in the wafer. The method is particularly useful for well-known C4NP interconnect technology. In one aspect of the invention, a reducing gas flow rate is used to remove oxides from the solder surfaces and wafer pad surfaces and is of a sufficient determined or pre-determined flow and/or chamber or mold/wafer spacing to provide a gas velocity across the solder surfaces and wafer pad surfaces so that Sn or other contaminants do not deposit on the wafer surface during solder transfer. In another aspect, the transfer contact is performed below the melting point of the solder and subsequently heated to above the melting temperature while in transfer contact. The heated solder in contact with the wafer pads is transferred to the wafer pads.
摘要翻译：提供了一种用于在晶片或其他电子器件上制造互连焊料凸块的方法，而不会将任何显着量的锡或其他焊料组分从焊料沉积到晶片表面上，锡可能导致晶片中的短路或其它缺陷。该方法对于众所周知的C4NP互连技术特别有用。在本发明的一个方面，使用还原气体流速从焊料表面和晶片焊盘表面去除氧化物，并且具有足够的确定或预定的流动和/或室或模具/晶片间距以提供气体速度穿过焊料表面和晶片焊盘表面，使得Sn或其他污染物在焊料传输期间不会沉积在晶片表面上。在另一方面，转移接触在焊料的熔点之下进行，随后在转移接触的同时被加热至高于熔融温度。与晶片焊盘接触的加热焊料被转移到晶片焊盘。

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