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1. 发明授权

US5905566A Laser ablation top surface reference chuck 失效
标题翻译：激光烧蚀顶面参考卡盘
公开(公告)号：US5905566A
公开(公告)日：1999-05-18
申请号：US838588
申请日：1997-04-10
申请人： Ralph R. Comulada , Bouwe W. Leenstra , Christopher L. Tessler
发明人： Ralph R. Comulada , Bouwe W. Leenstra , Christopher L. Tessler
IPC分类号： H01L21/68 , H02N13/00
CPC分类号： H02N13/00 , H01L21/68
摘要： A reference chuck which is used with a leveling device for holding microelectronic substrates and other electronic component substrates for laser ablation and other exposure processes, the chuck comprising a frame body for supporting the substrate to be processed, clamping means at the periphery of the frame body for holding the substrate to the frame body and elastomeric means for urging the substrate mounted in the reference chuck against the clamping means. The undersides of the clamping means which contacts the upper surface of the substrate forms in its tightened position a clamping plane which clamping plane is parallel with an established plane of the lower surface of the chuck. The reference chuck provides a very low profile envelope for use with conventional leveling devices and the top surface of the substrate and the lower surface of the reference chuck are in parallel planes when the chuck is placed on the working surface of the leveling device.
摘要翻译：一种与用于保持微电子基板和其他用于激光烧蚀和其他曝光工艺的电子部件基板的调平装置一起使用的参考卡盘，该卡盘包括用于支撑待加工基板的框架体，在框体周边的夹紧装置用于将基板保持在框体上，以及用于将安装在基准卡盘中的基板推向夹紧装置的弹性装置。夹紧装置的与基板的上表面接触的下侧在紧固位置形成夹紧平面，夹紧平面与卡盘的下表面的已建立的平面平行。参考卡盘提供了一个非常低的外形，用于与传统的调平装置一起使用，当卡盘放置在整平装置的工作表面上时，基板的顶表面和基准卡盘的下表面处于平行的平面。

2. 发明授权

US07401637B2 Pressure-only molten metal valving apparatus and method 失效
标题翻译：仅压力熔融金属阀门装置及方法
公开(公告)号：US07401637B2
公开(公告)日：2008-07-22
申请号：US11495966
申请日：2006-07-28
申请人： Glen N. Biggs , John J. Garant , Peter A. Gruber , Bouwe W. Leenstra , Christopher L. Tessler , Thomas Weiss
发明人： Glen N. Biggs , John J. Garant , Peter A. Gruber , Bouwe W. Leenstra , Christopher L. Tessler , Thomas Weiss
IPC分类号： B22D18/00
CPC分类号： B23K3/0638
摘要： A new pressure-only molten metal valving apparatus and method is provided. This novel approach to controlling the flow of liquids eliminates the need for active, moving valve components. Using the natural surface tension properties of liquids, the gas pressure either activates liquid flow when a threshold is overcome or retains the liquid in a head, even when lifted.
摘要翻译：提供了一种新的仅压力熔融金属阀装置和方法。这种控制液体流动的新方法消除了对活动的，移动的阀部件的需要。使用液体的天然表面张力特性，当克服阈值或者将液体保持在头部时，气体压力也可以激活液体流动，即使在抬起时也是如此。

3. 发明申请

US20080023526A1 Pressure-only molten metal valving apparatus and method 失效
公开(公告)号：US20080023526A1
公开(公告)日：2008-01-31
申请号：US11495966
申请日：2006-07-28
申请人： Glen N. Biggs , John J. Garant , Peter A. Gruber , Bouwe W. Leenstra , Christopher L. Tessler , Thomas Weiss
发明人： Glen N. Biggs , John J. Garant , Peter A. Gruber , Bouwe W. Leenstra , Christopher L. Tessler , Thomas Weiss
IPC分类号： B23K1/00 , B22D18/04
CPC分类号： B23K3/0638
摘要： A new pressure-only molten metal valving apparatus and method is provided. This novel approach to controlling the flow of liquids eliminates the need for active, moving valve components. Using the natural surface tension properties of liquids, the gas pressure either activates liquid flow when a threshold is overcome or retains the liquid in a head, even when lifted.

4. 发明授权

US09498837B2 Vacuum transition for solder bump mold filling 有权
标题翻译：焊锡凸块模具填充的真空过渡
公开(公告)号：US09498837B2
公开(公告)日：2016-11-22
申请号：US12551755
申请日：2009-09-01
申请人： John J. Garant , Robert G. Haas , Bouwe W. Leenstra , Phillip W. Palmatier
发明人： John J. Garant , Robert G. Haas , Bouwe W. Leenstra , Phillip W. Palmatier
IPC分类号： B23K31/02 , B23K35/12 , B23K3/06
CPC分类号： B23K3/0623 , B23K2101/42
摘要： A bond metal injection tool can include a fill head having a sealed chamber for containing a molten bond metal (e.g., solder) and a gas, and a nozzle for directing a flow of the molten bond metal into cavities in a major surface of a mold. A pressure control device can controllably apply pressure within the chamber to eject the bond metal from the nozzle into the cavities. The pressure control device may also controllably reduce a pressure within the chamber to inhibit the bond metal from being ejected from the nozzle, such as when the fill head is being moved onto the mold surface from a parking location or when the fill head is being moved off the mold surface onto a parking location.
摘要翻译：粘合金属注射工具可以包括具有用于容纳熔融粘合金属（例如焊料）和气体的密封室的填充头，以及用于将熔融粘合金属流引导到模具的主表面中的空腔中的喷嘴。压力控制装置可以可控制地在腔室内施加压力以将接合金属从喷嘴喷射到空腔中。压力控制装置还可以可控制地减小腔室内的压力以阻止接合金属从喷嘴喷射，例如当填充头从停车位置移动到模具表面上时或当填充头被移动时离开模具表面到停车位置。

5. 发明申请

US20110049759A1 VACUUM TRANSITION FOR SOLDER BUMP MOLD FILLING 有权
标题翻译：真空过滤器用于焊接模具填充
公开(公告)号：US20110049759A1
公开(公告)日：2011-03-03
申请号：US12551755
申请日：2009-09-01
申请人： John J. Garant , Robert G. Haas , Bouwe W. Leenstra , Phillip W. Palmatier
发明人： John J. Garant , Robert G. Haas , Bouwe W. Leenstra , Phillip W. Palmatier
IPC分类号： B29C45/14 , B29C45/77
CPC分类号： B23K3/0623 , B23K2101/42
摘要： A bond metal injection tool can include a fill head having a sealed chamber for containing a molten bond metal (e.g., solder) and a gas, and a nozzle for directing a flow of the molten bond metal into cavities in a major surface of a mold. A pressure control device can controllably apply pressure within the chamber to eject the bond metal from the nozzle into the cavities. The pressure control device may also controllably reduce a pressure within the chamber to inhibit the bond metal from being ejected from the nozzle, such as when the fill head is being moved onto the mold surface from a parking location or when the fill head is being moved off the mold surface onto a parking location.
摘要翻译：粘合金属注射工具可以包括具有用于容纳熔融粘合金属（例如焊料）和气体的密封室的填充头，以及用于将熔融粘合金属流引导到模具的主表面中的空腔中的喷嘴。压力控制装置可以可控制地在腔室内施加压力以将接合金属从喷嘴喷射到空腔中。压力控制装置还可以可控制地减小腔室内的压力以阻止接合金属从喷嘴喷射，例如当填充头从停车位置移动到模具表面上时或当填充头被移动时离开模具表面到停车位置。

6. 发明授权

US6099935A Apparatus for providing solder interconnections to semiconductor and electronic packaging devices 失效
标题翻译：用于向半导体和电子封装装置提供焊料互连的装置
公开(公告)号：US6099935A
公开(公告)日：2000-08-08
申请号：US573469
申请日：1995-12-15
申请人： William Brearley , Laertis Economikos , Paul F. Findeis , Kimberley A. Kelly , Bouwe W. Leenstra , Arthur Gilman Merryman , Eric Daniel Perfecto , Chandrika Prasad , James Patrick Wood , Roy Yu
发明人： William Brearley , Laertis Economikos , Paul F. Findeis , Kimberley A. Kelly , Bouwe W. Leenstra , Arthur Gilman Merryman , Eric Daniel Perfecto , Chandrika Prasad , James Patrick Wood , Roy Yu
IPC分类号： H01L21/60 , H01L21/68 , H05K3/34 , B23K31/02
CPC分类号： H01L24/81 , H01L21/6835 , H01L24/75 , H05K3/3484 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/0568 , H01L2224/05684 , H01L2224/11003 , H01L2224/11332 , H01L2224/11334 , H01L2224/11472 , H01L2224/13111 , H01L2224/16 , H01L2224/742 , H01L2224/75 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15787 , H05K2201/10734 , H05K2203/0113 , H05K2203/0338 , H05K2203/043 , Y10T428/24174 , Y10T428/24273 , Y10T428/24479
摘要： An apparatus for use in manufacturing a semiconductor device having input-output (IO) lands arranged in an IO array on an IO face includes a body having a plurality of cavities extending from an operating face into the body; the cavities are arranged in a cavity loci array which is in registeration with the IO lands when the apparatus is in a manufacturing position with the operating face generally adjacent the IO face. Each cavity has a depth and a lateral expanse which cooperate to establish a volume defined by a cavity bottom and at least one cavity wall. The volume accommodates an appropriate amount of solder material to establish a measure of the solder material on a facing IO land when the apparatus is in the manufacturing position. The depth is appropriate to facilitate wettingly attracting the solder material to the facing IO land when the apparatus is in the manufacturing position and the semiconductor device and the apparatus are exposed to appropriate ambient conditions to effect reflow of the solder material. The invention also includes a method for using the apparatus in manufacturing a semiconductor device.
摘要翻译：一种用于制造半导体器件的装置，其具有以IO阵列布置在IO面上的输入 - 输出（IO）焊盘，该主体具有从操作面延伸到主体中的多个空腔; 空腔被布置在空腔轨迹阵列中，当该设备处于制造位置时，其中操作面大体上邻近IO面，该腔轨迹阵列与IO凸台对齐。每个空腔具有深度和横向宽度，其协作以建立由空腔底部和至少一个空腔壁限定的体积。当装置处于制造位置时，体积容纳适当量的焊料材料以建立在面对的IO焊盘上的焊料材料的量度。当装置处于制造位置时，该深度适于促进将焊料材料润湿地吸引到相对的IO焊盘，并且半导体器件和设备暴露于适当的环境条件以实现焊料材料的回流。本发明还包括一种在制造半导体器件中使用该装置的方法。

7. 发明授权

US06678949B2 Process for forming a multi-level thin-film electronic packaging structure 失效
标题翻译：用于形成多层薄膜电子封装结构的方法
公开(公告)号：US06678949B2
公开(公告)日：2004-01-20
申请号：US09886326
申请日：2001-06-21
申请人： Chandrika Prasad , Roy Yu , Richard L. Canull , Giulio DiGiacomo , Ajay P. Giri , Lewis S. Goldmann , Kimberley A. Kelly , Bouwe W. Leenstra , Voya R. Markovich , Eric D. Perfecto , Sampath Purushothaman , Joseph M. Sullivan
发明人： Chandrika Prasad , Roy Yu , Richard L. Canull , Giulio DiGiacomo , Ajay P. Giri , Lewis S. Goldmann , Kimberley A. Kelly , Bouwe W. Leenstra , Voya R. Markovich , Eric D. Perfecto , Sampath Purushothaman , Joseph M. Sullivan
IPC分类号： H05K334
CPC分类号： H01L21/6835 , H01L21/4857 , H01L23/16 , H01L23/49833 , H01L2221/68359 , H01L2221/68368 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H05K1/141 , H05K3/20 , H05K3/284 , H05K3/3436 , H05K3/467 , H05K7/023 , H05K2201/049 , H05K2201/10977 , H05K2201/2036 , H05K2203/0182 , Y02P70/613 , Y10T29/49126 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49149 , Y10T29/49165 , Y10T29/49169 , Y10T29/49174 , Y10T29/49211 , Y10T29/49213 , H01L2924/00 , H01L2924/00014
摘要： A structure for mounting electronic devices. The structure uses a non-conductive, compliant spacer interposed between an underlying carrier and an overlying thin film. The spacer includes a pattern of through-vias which matches opposing interconnects on opposing surfaces of the carrier and the thin film. In this way, solder connections can extend in the through-vias to electrically connect the thin film to the carrier and smooth out topography. In a related process for forming the structure, the thin film is built on a first sacrificial carrier and then further processed on a second sacrificial carrier to keep it from distorting, expanding, or otherwise suffering adversely during its processing. The solder connections between the thin film and the carrier are formed using a closed solder joining process. The spacer is used with laminate cards to create thermal stress release structures on portions of the cards carrying a thin film.
摘要翻译：一种用于安装电子设备的结构。该结构使用介于下面的载体和上覆薄膜之间的非导电的兼容间隔物。间隔件包括通孔的图形，其与载体和薄膜的相对表面上的相对互连匹配。以这种方式，焊接连接可以在通孔中延伸，以将薄膜电连接到载体上并平滑地形。在用于形成结构的相关方法中，薄膜建立在第一牺牲载体上，然后在第二牺牲载体上进一步处理，以防止其在其加工期间变形，膨胀或以其它方式受到不利影响。使用封闭的焊料接合工艺形成薄膜和载体之间的焊接连接。间隔件与层压卡一起使用以在携带薄膜的卡的部分上产生热应力释放结构。

8. 发明授权

US06448169B1 Apparatus and method for use in manufacturing semiconductor devices 失效
标题翻译：用于制造半导体器件的装置和方法
公开(公告)号：US06448169B1
公开(公告)日：2002-09-10
申请号：US08576185
申请日：1995-12-21
申请人： William Brearley , Laertis Economikos , Paul F. Findeis , Kimberley A. Kelly , Bouwe W. Leenstra , Arthur Gilman Merryman , Eric Daniel Perfecto , Chandrika Prasad , James Patrick Wood , Roy Yu
发明人： William Brearley , Laertis Economikos , Paul F. Findeis , Kimberley A. Kelly , Bouwe W. Leenstra , Arthur Gilman Merryman , Eric Daniel Perfecto , Chandrika Prasad , James Patrick Wood , Roy Yu
IPC分类号： H01L2144
CPC分类号： B23K3/0607 , B23K2101/40 , H05K3/3484 , H05K2201/10734 , H05K2203/0113 , H05K2203/0338 , H05K2203/043 , Y10T29/49204
摘要： An apparatus for use in manufacturing a semiconductor device includes an input-output (IO) face having a plurality of IO lands, and is situated in an operating position in abutting relation with a depositor. The apparatus includes a first holding member holding the depositor in a first position; a second holding member holding the semiconductor device in the operating position. The depositor and the semiconductor device cooperate in the operating position to deposit solder ball connection structures to the IO lands. The apparatus further includes a separating member for moving at least one of the depositor and the semiconductor device from the operating position to an interim orientation. The interim orientation establishes a separation distance intermediate the depositor and the semiconductor device appropriate to disengage the solder ball connecting structures from the depositor.
摘要翻译：一种用于制造半导体器件的装置包括具有多个IO引脚的输入输出（IO）面，并且位于与沉积器邻接的操作位置。该装置包括将第一保持构件保持在第一位置; 保持半导体器件处于操作位置的第二保持构件。存储器和半导体器件在操作位置协作以将焊球连接结构沉积到IO焊盘。该装置还包括用于将存储器和半导体器件中的至少一个从操作位置移动到临时取向的分离构件。临时方向建立了适于使焊球连接结构与沉积器脱离接触的存放器和半导体器件之间的间隔距离。

9. 发明授权

US06281452B1 Multi-level thin-film electronic packaging structure and related method 失效
标题翻译：多层薄膜电子封装结构及相关方法
公开(公告)号：US06281452B1
公开(公告)日：2001-08-28
申请号：US09204851
申请日：1998-12-03
申请人： Chandrika Prasad , Roy Yu , Richard L. Canull , Giulio DiGiacomo , Ajay P. Giri , Lewis S. Goldmann , Kimberley A. Kelly , Bouwe W. Leenstra , Voya R. Markovich , Eric D. Perfecto , Sampath Purushothaman , Joseph M. Sullivan
发明人： Chandrika Prasad , Roy Yu , Richard L. Canull , Giulio DiGiacomo , Ajay P. Giri , Lewis S. Goldmann , Kimberley A. Kelly , Bouwe W. Leenstra , Voya R. Markovich , Eric D. Perfecto , Sampath Purushothaman , Joseph M. Sullivan
IPC分类号： H01R1204
CPC分类号： H01L21/6835 , H01L21/4857 , H01L23/16 , H01L23/49833 , H01L2221/68359 , H01L2221/68368 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H05K1/141 , H05K3/20 , H05K3/284 , H05K3/3436 , H05K3/467 , H05K7/023 , H05K2201/049 , H05K2201/10977 , H05K2201/2036 , H05K2203/0182 , Y02P70/613 , Y10T29/49126 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49149 , Y10T29/49165 , Y10T29/49169 , Y10T29/49174 , Y10T29/49211 , Y10T29/49213 , H01L2924/00 , H01L2924/00014
摘要： A structure for mounting electronic devices which uses a non-conductive, compliant spacer interposed between an underlying carrier and an overlying thin film. The spacer includes a pattern of through-vias which matches opposing interconnects on opposing surfaces of the carrier and the thin film. In this way, solder connections can extend in the through-vias to electrically connect the thin film to the carrier and smooth out topography. In a related process for forming the structure, the thin film is built on a first sacrificial carrier and then further processed on a second sacrificial carrier to keep it from distorting, expanding, or otherwise suffering adversely during its processing. The solder connections between the thin film and the carrier are formed using a closed solder joining process. The spacer is used with laminate cards to create thermal stress release structures on portions of the cards carrying a thin film.
摘要翻译：一种用于安装电子器件的结构，其使用插入在下面的载体和上覆薄膜之间的非导电兼容间隔物。间隔件包括通孔的图形，其与载体和薄膜的相对表面上的相对互连匹配。以这种方式，焊接连接可以在通孔中延伸，以将薄膜电连接到载体上并平滑地形。在用于形成结构的相关方法中，薄膜建立在第一牺牲载体上，然后在第二牺牲载体上进一步处理，以防止其在其加工期间变形，膨胀或以其它方式受到不利影响。使用封闭的焊料接合工艺形成薄膜和载体之间的焊接连接。间隔件与层压卡一起使用以在携带薄膜的卡的部分上产生热应力释放结构。

10. 发明授权

US6149048A Apparatus and method for use in manufacturing semiconductor devices 失效
公开(公告)号：US6149048A
公开(公告)日：2000-11-21
申请号：US057421
申请日：1998-04-08
申请人： William Brearley , Laertis Economikos , Paul F. Findeis , Kimberley A. Kelly , Bouwe W. Leenstra , Arthur Gilman Merryman , Eric Daniel Perfecto , Chandrika Prasad , James Patrick Wood , Roy Yu
发明人： William Brearley , Laertis Economikos , Paul F. Findeis , Kimberley A. Kelly , Bouwe W. Leenstra , Arthur Gilman Merryman , Eric Daniel Perfecto , Chandrika Prasad , James Patrick Wood , Roy Yu
IPC分类号： B23K3/06 , H05K3/34 , B23K1/00
CPC分类号： B23K3/0607 , H05K3/3484 , B23K2201/40 , H05K2201/10734 , H05K2203/0113 , H05K2203/0338 , H05K2203/043 , Y10T29/49204
摘要： An apparatus for use in manufacturing a semiconductor device includes an input-output (IO) face having a plurality of IO lands, and is situated in an operating position in abutting relation with a depositor. The apparatus includes a first holding member holding the depositor in a first position; a second holding member holding the semiconductor device in the operating position. The depositor and the semiconductor device cooperate in the operating position to deposit solder ball connection structures to the IO lands. The apparatus further includes a separating member for moving at least one of the depositor and the semiconductor device from the operating position to an interim orientation. The interim orientation establishes a separation distance intermediate the depositor and the semiconductor device appropriate to disengage the solder ball connecting structures from the depositor.

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