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1. 发明申请

US20080302860A1 AIR BEARING GAP CONTROL FOR INJECTION MOLDED SOLDER HEADS 失效
标题翻译：注射成型焊枪头的空气轴承挡板控制
公开(公告)号：US20080302860A1
公开(公告)日：2008-12-11
申请号：US11760813
申请日：2007-06-11
申请人： Glen N. Biggs , Timothy J. Chainer , John P. Karidis , Dennis G. Manzer , Christopher L. Tessler
发明人： Glen N. Biggs , Timothy J. Chainer , John P. Karidis , Dennis G. Manzer , Christopher L. Tessler
IPC分类号： B23K31/02
CPC分类号： B23K3/0623
摘要： An air bearing gap control arrangement for injection molded solder filler heads. Also provided is a method of providing for a gap control for injection molded solder filler heads utilizing an air bearing arrangement. Provided is a C-ring seal, at the lower or dispensing region of the solder filler head structure, wherein the C-shape is open at the leading edge thereof. Hereby, a prevalent leading edge gap is tightly controlled by means of pressurized air in order to form an air bearing. Downstream of this leading edge is the molten solder, which is contained within a very narrow gap height between the solder filler head and the mold. As the solder fills the pits or recesses which are formed in the mold surface, air will rush out or be displaced from the pits towards the air bearing and is then expelled, while the deposited solder remains in place.
摘要翻译：用于注射成型焊料填充头的空气轴承间隙控制装置。还提供了一种利用空气轴承装置为注射成型的焊料填充头提供间隙控制的方法。提供了在焊料填充头结构的下部或分配区域处的C形环密封件，其中C形在其前缘处是敞开的。因此，为了形成空气轴承，通过加压空气严格控制流行的前缘间隙。该前沿的下游是熔融焊料，其被包含在焊料填充头和模具之间的非常窄的间隙高度内。当焊料填充形成在模具表面中的凹坑或凹槽时，空气将从凹坑向空气轴承移出或移出，然后排出，同时沉积的焊料保持在适当的位置。

2. 发明申请

US20120043216A1 Working electrode design for electrochemical processing of electronic components 有权
标题翻译：电子元件电化学处理工作电极设计
公开(公告)号：US20120043216A1
公开(公告)日：2012-02-23
申请号：US12806719
申请日：2010-08-19
申请人： Charles L. Arvin , Raschid J. Bezama , Glen N. Biggs , Hariklia Deligianni , Tracy A. Tong
发明人： Charles L. Arvin , Raschid J. Bezama , Glen N. Biggs , Hariklia Deligianni , Tracy A. Tong
IPC分类号： C25D17/10 , C25D7/00 , C25D5/00
CPC分类号： C25D17/001 , C25D5/04 , C25D7/123 , C25D17/004 , C25D17/02 , C25D17/12
摘要： An electroplating apparatus is provided that includes a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.
摘要翻译：提供一种电镀设备，其包括用于容纳电镀液的镀槽。对电极，例如阳极，存在于镀槽的第一部分中。阴极系统存在于镀槽的第二部分中。阴极系统包括工作电极和小偷电极。小电极存在于工作电极和对电极之间。防窃电极包括与电镀电解质接触的外表面，其与工作电极的电镀表面偏移。在一个实施例中，窃电电极围绕工作电极的周边重叠一部分工作电极。在一个实施例中，提供了使用提供镀层厚度增加的均匀性的上述电镀设备的方法。

3. 发明申请

US20090242614A1 METHOD AND TOOL FOR REPOSITIONING SOLDER FILL HEAD 审中-公开
标题翻译：用于记录焊接头的方法和工具
公开(公告)号：US20090242614A1
公开(公告)日：2009-10-01
申请号：US12056573
申请日：2008-03-27
申请人： GLEN N. BIGGS , RUSSELL A. BUDD , JOHN J. GARANT , PETER A. GRUBER , BOUWE W. LEENSTRA , PHILLIP W. PALMATIER , CHRISTOPHER L. TESSLER , THOMAS WEISS
发明人： GLEN N. BIGGS , RUSSELL A. BUDD , JOHN J. GARANT , PETER A. GRUBER , BOUWE W. LEENSTRA , PHILLIP W. PALMATIER , CHRISTOPHER L. TESSLER , THOMAS WEISS
IPC分类号： B23K1/20 , B23K3/06
CPC分类号： B23K3/0623 , B23K1/0016 , H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/131 , H01L2224/742 , H01L2924/14 , H01L2924/181 , H01L2924/014 , H01L2924/00
摘要： A tool and method is provided for repositioning a solder injection head. The tool includes a first moveable platform positioned on a first side of a workpiece chuck and a second moveable platform positioned on a second side of the workpiece chuck. A solder injection head has a seal configured to seal molten solder within the solder injection head when contacting a surface of the first moveable platform or the second moveable platform. The method includes moving a workpiece chuck and a starting platform to a position such that the starting platform is at a finishing position and a finishing platform is in a starting position.
摘要翻译：提供了用于重新定位焊料注入头的工具和方法。该工具包括位于工件卡盘的第一侧上的第一可移动平台和位于工件卡盘的第二侧上的第二可移动平台。焊接注射头具有密封，其被配置为当接触第一可移动平台或第二可移动平台的表面时密封焊料注射头内的熔融焊料。该方法包括将工件卡盘和起始平台移动到使得起始平台处于完成位置并且精加工平台处于起始位置的位置。

4. 发明授权

US5869139A Apparatus and method for plating pin grid array packaging modules 失效
标题翻译：电镀针阵列封装模块的装置和方法
公开(公告)号：US5869139A
公开(公告)日：1999-02-09
申请号：US808925
申请日：1997-02-28
申请人： Glen N. Biggs , John Di Santis , Paul F. Findeis , Karen P. McLaughlin , Phillip W. Palmatier , Victor M. Vitek
发明人： Glen N. Biggs , John Di Santis , Paul F. Findeis , Karen P. McLaughlin , Phillip W. Palmatier , Victor M. Vitek
IPC分类号： C25D5/02 , C25D7/12 , C25D17/08 , H01L21/00 , B05D5/00 , B05C3/00
CPC分类号： H01L21/6715 , C25D17/08 , C25D5/028 , C25D7/12
摘要： An apparatus and a method for its use for plating pin grid array packaging modules, with a fixture capable of simultaneously holding a plurality of said pin grid array modules such that three-dimensional bottom surface metallurgy (BSM) is sealingly protected during plating of top surface metallurgy (TSM).
摘要翻译：一种用于电镀销栅格阵列封装模块的装置和方法，具有能够同时保持多个所述销栅格阵列模块的固定装置，使得三维底表面冶金（BSM）在顶表面的电镀期间被密封保护冶金（TSM）。

5. 发明授权

US07513410B2 Air bearing gap control for injection molded solder heads 失效
标题翻译：注射成型焊头的气隙间隙控制
公开(公告)号：US07513410B2
公开(公告)日：2009-04-07
申请号：US11760813
申请日：2007-06-11
申请人： Glen N. Biggs , Timothy J. Chainer , John P. Karidis , Dennis G. Manzer , Christopher L. Tessler
发明人： Glen N. Biggs , Timothy J. Chainer , John P. Karidis , Dennis G. Manzer , Christopher L. Tessler
IPC分类号： B23K31/02 , B22D35/00
CPC分类号： B23K3/0623
摘要： An air bearing gap control arrangement for injection molded solder filler heads. Also provided is a method of providing for a gap control for injection molded solder filler heads utilizing an air bearing arrangement. Provided is a C-ring seal, at the lower or dispensing region of the solder filler head structure, wherein the C-shape is open at the leading edge thereof. Hereby, a prevalent leading edge gap is tightly controlled by means of pressurized air in order to form an air bearing. Downstream of this leading edge is the molten solder, which is contained within a very narrow gap height between the solder filler head and the mold. As the solder fills the pits or recesses which are formed in the mold surface, air will rush out or be displaced from the pits towards the air bearing and is then expelled, while the deposited solder remains in place.
摘要翻译：用于注射成型焊料填充头的空气轴承间隙控制装置。还提供了一种利用空气轴承装置为注射成型的焊料填充头提供间隙控制的方法。提供了在焊料填充头结构的下部或分配区域处的C形环密封件，其中C形在其前缘处是敞开的。因此，为了形成空气轴承，通过加压空气严格控制流行的前缘间隙。该前沿的下游是熔融焊料，其被包含在焊料填充头和模具之间的非常窄的间隙高度内。当焊料填充形成在模具表面中的凹坑或凹槽时，空气将从凹坑向空气轴承移出或移出，然后排出，同时沉积的焊料保持在适当的位置。

6. 发明授权

US07401637B2 Pressure-only molten metal valving apparatus and method 失效
标题翻译：仅压力熔融金属阀门装置及方法
公开(公告)号：US07401637B2
公开(公告)日：2008-07-22
申请号：US11495966
申请日：2006-07-28
申请人： Glen N. Biggs , John J. Garant , Peter A. Gruber , Bouwe W. Leenstra , Christopher L. Tessler , Thomas Weiss
发明人： Glen N. Biggs , John J. Garant , Peter A. Gruber , Bouwe W. Leenstra , Christopher L. Tessler , Thomas Weiss
IPC分类号： B22D18/00
CPC分类号： B23K3/0638
摘要： A new pressure-only molten metal valving apparatus and method is provided. This novel approach to controlling the flow of liquids eliminates the need for active, moving valve components. Using the natural surface tension properties of liquids, the gas pressure either activates liquid flow when a threshold is overcome or retains the liquid in a head, even when lifted.
摘要翻译：提供了一种新的仅压力熔融金属阀装置和方法。这种控制液体流动的新方法消除了对活动的，移动的阀部件的需要。使用液体的天然表面张力特性，当克服阈值或者将液体保持在头部时，气体压力也可以激活液体流动，即使在抬起时也是如此。

7. 发明申请

US20080023526A1 Pressure-only molten metal valving apparatus and method 失效
公开(公告)号：US20080023526A1
公开(公告)日：2008-01-31
申请号：US11495966
申请日：2006-07-28
申请人： Glen N. Biggs , John J. Garant , Peter A. Gruber , Bouwe W. Leenstra , Christopher L. Tessler , Thomas Weiss
发明人： Glen N. Biggs , John J. Garant , Peter A. Gruber , Bouwe W. Leenstra , Christopher L. Tessler , Thomas Weiss
IPC分类号： B23K1/00 , B22D18/04
CPC分类号： B23K3/0638
摘要： A new pressure-only molten metal valving apparatus and method is provided. This novel approach to controlling the flow of liquids eliminates the need for active, moving valve components. Using the natural surface tension properties of liquids, the gas pressure either activates liquid flow when a threshold is overcome or retains the liquid in a head, even when lifted.

8. 发明授权

US06241868B1 Method for electroplating a film onto a substrate 失效
标题翻译：将膜电镀到基板上的方法
公开(公告)号：US06241868B1
公开(公告)日：2001-06-05
申请号：US09541018
申请日：2000-03-31
申请人： Glen N. Biggs , Donald M. Brewer , James E. Fluegel , Suryanarayana Kaja , Ashwani K. Malhotra , Phillip W. Palmatier
发明人： Glen N. Biggs , Donald M. Brewer , James E. Fluegel , Suryanarayana Kaja , Ashwani K. Malhotra , Phillip W. Palmatier
IPC分类号： C25D502
CPC分类号： C25D7/123 , C25D17/004 , C25D17/005 , H05K3/242 , H05K2203/1147 , H05K2203/1572 , H05K2203/1581
摘要： A method for electroplating a film onto a substrate. Electrical power is supplied to the plating surface through electrical contact made to contact pads on the underside of the substrate. Contact to the contact pads is made within a liquid-tight region. The contact pads are connected to the plating surface through the substrate. Because the contact scheme is provided within a liquid-tight region on the underside of the substrate, the contacts do not erode or become plated, nor do they consume an area of the plating surface.
摘要翻译：一种将膜电镀到基底上的方法。通过与衬底底面上的接触焊盘的电接触将电力提供给电镀表面。接触垫的接触在液密区域内进行。接触垫通过基板连接到电镀表面。由于接触方案设置在基板下侧的液密区域内，触点不会腐蚀或变成电镀，也不消耗电镀表面的区域。

9. 发明申请

US20130062209A1 WORKING ELECTRODE DESIGN FOR ELECTROCHEMICAL PROCESSING OF ELECTRONIC COMPONENTS 有权
标题翻译：电子元器件电化学处理工作电极设计
公开(公告)号：US20130062209A1
公开(公告)日：2013-03-14
申请号：US13612661
申请日：2012-09-12
申请人： Charles L. Arvin , Raschid J. Bezama , Glen N. Biggs , Hariklia Deligianni , Tracy A. Tong
发明人： Charles L. Arvin , Raschid J. Bezama , Glen N. Biggs , Hariklia Deligianni , Tracy A. Tong
IPC分类号： C25D17/02 , C25D21/12 , C25D17/12
CPC分类号： C25D17/001 , C25D5/04 , C25D7/123 , C25D17/004 , C25D17/02 , C25D17/12
摘要： An electroplating apparatus including a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.
摘要翻译：一种电镀设备，包括用于容纳电镀电解质的电镀槽。对电极，例如阳极，存在于镀槽的第一部分中。阴极系统存在于镀槽的第二部分中。阴极系统包括工作电极和小偷电极。小电极存在于工作电极和对电极之间。防窃电极包括与电镀电解质接触的外表面，其与工作电极的电镀表面偏移。在一个实施例中，窃电电极围绕工作电极的周边重叠一部分工作电极。在一个实施例中，提供了使用提供镀层厚度增加的均匀性的上述电镀设备的方法。

10. 发明授权

US08926820B2 Working electrode design for electrochemical processing of electronic components 有权
标题翻译：电子元器件电化学处理工作电极设计
公开(公告)号：US08926820B2
公开(公告)日：2015-01-06
申请号：US13612661
申请日：2012-09-12
申请人： Charles L. Arvin , Raschid J. Bezama , Glen N. Biggs , Hariklia Deligianni , Tracy A. Tong
发明人： Charles L. Arvin , Raschid J. Bezama , Glen N. Biggs , Hariklia Deligianni , Tracy A. Tong
IPC分类号： C25D21/00 , C25D17/02 , C25D17/12 , C25D7/12 , C25D5/04 , C25D17/00
CPC分类号： C25D17/001 , C25D5/04 , C25D7/123 , C25D17/004 , C25D17/02 , C25D17/12
摘要： An electroplating apparatus including a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.
摘要翻译：一种电镀设备，包括用于容纳电镀电解质的电镀槽。对电极，例如阳极，存在于镀槽的第一部分中。阴极系统存在于镀槽的第二部分中。阴极系统包括工作电极和小偷电极。小电极存在于工作电极和对电极之间。防窃电极包括与电镀电解质接触的外表面，其与工作电极的电镀表面偏移。在一个实施例中，窃电电极围绕工作电极的周边重叠一部分工作电极。在一个实施例中，提供了使用提供镀层厚度增加的均匀性的上述电镀设备的方法。

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