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1. 发明授权

US06381837B1 Method for making an electronic circuit assembly 失效
标题翻译：制造电子电路组件的方法
公开(公告)号：US06381837B1
公开(公告)日：2002-05-07
申请号：US09148061
申请日：1998-09-04
申请人： Jay DeAvis Baker , Edward McLeskey , Delin Li , Cuong Van Pham , Robert Edward Belke , Vivek Amir Jairazbhoy , Thomas B Krautheim , Mohan R. Paruchuri , Lakhi Nandlal Goenka , Jun Ming Hu
发明人： Jay DeAvis Baker , Edward McLeskey , Delin Li , Cuong Van Pham , Robert Edward Belke , Vivek Amir Jairazbhoy , Thomas B Krautheim , Mohan R. Paruchuri , Lakhi Nandlal Goenka , Jun Ming Hu
IPC分类号： H05K334
CPC分类号： H05K3/4685 , H05K1/111 , H05K3/062 , H05K3/303 , H05K3/328 , H05K3/3442 , H05K3/4007 , H05K2201/0361 , H05K2201/0367 , H05K2201/0373 , H05K2201/09781 , H05K2201/10636 , H05K2201/2036 , H05K2203/049 , Y02P70/611 , Y02P70/613 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49149 , Y10T29/49155 , Y10T29/49156
摘要： A method for producing an electronic circuit assembly (e.g., a circuit board) from an etched tri-metal-layer structure which provides air bridge crossovers and specially designed bumps etched from a middle layer of the tri-metal-layer structure. The bumps are formed at particular circuit locations in order to provide interconnects for (1) heavy wirebonding, (2) fine wirebonding, or (3) direct chip attachment; or, to provide (4) lifters for assuring a minimum solder joint standoff height or (5) barriers for retarding solder joint crack propagation.
摘要翻译：从蚀刻的三金属层结构制造电子电路组件（例如，电路板）的方法，其提供空气桥交叉和从三金属层结构的中间层蚀刻的特殊设计的凸起。凸起形成在特定的电路位置，以提供用于（1）重引线键合，（2）细线接合或（3）直接芯片附接的互连。或者提供（4）用于确保最小焊点间隙高度的提升器，或（5）阻止焊点裂纹扩展的障碍物。

2. 发明授权

US06475703B2 Method for constructing multilayer circuit boards having air bridges 失效
标题翻译：用于构造具有空气桥的多层电路板的方法
公开(公告)号：US06475703B2
公开(公告)日：2002-11-05
申请号：US09203148
申请日：1998-12-01
申请人： Delin Li , Achyuta Achari , Alice Dawn Zitzmann , Robert Edward Belke, Jr. , Brenda Joyce Nation , Edward McLeskey , Mohan R. Paruchuri , Lakhi Nandlal Goenka
发明人： Delin Li , Achyuta Achari , Alice Dawn Zitzmann , Robert Edward Belke, Jr. , Brenda Joyce Nation , Edward McLeskey , Mohan R. Paruchuri , Lakhi Nandlal Goenka
IPC分类号： G03C556
CPC分类号： H05K3/062 , H05K3/205 , H05K3/386 , H05K3/4685 , H05K2201/0361 , H05K2201/0394 , H05K2203/0369 , H05K2203/0376
摘要： A multilayer circuit board having air bridge crossover structures and an additive method for producing the same, wherein the circuit includes specially designed metallic fortifying layers to mechanically and/or electrically fortify the circuit.
摘要翻译：一种具有空气桥交叉结构的多层电路板及其制造方法，其特征在于，该电路包括专门设计的金属强化层，用于机械地和/或电气地加固电路。

3. 发明授权

US06571820B2 Concealed air vents 失效
标题翻译：隐蔽的通风口
公开(公告)号：US06571820B2
公开(公告)日：2003-06-03
申请号：US09904231
申请日：2001-07-12
申请人： Andrew Zachary Glovatsky , Robert Edward Belke , Jay DeAvis Baker , Joseph Mario Giachino , Lakhi Nandlal Goenka , Myron Lemecha
发明人： Andrew Zachary Glovatsky , Robert Edward Belke , Jay DeAvis Baker , Joseph Mario Giachino , Lakhi Nandlal Goenka , Myron Lemecha
IPC分类号： F61K100
CPC分类号： B60H1/3407 , Y10T137/6888
摘要： A vent assembly that can be concealed when in a closed configuration is provided in one embodiment, the vent assembly comprises a base member and a guide member secured to a mounting surface of a duct or other passageway. A flexible rod is fixedly attached to the base member and slideably disposed within a channel defined by the guide member. A panel is disposed on or around the flexible rod and between the base and guide members. An actuator is able to deform the rod such that the panel moves away from the terminal opening of the duct, thereby opening the vent. A fluid distribution system incorporating vent assemblies in accordance with the present invention is also provided.
摘要翻译：在一个实施例中，在闭合构造中可以隐藏的排气组件，排气组件包括固定到管道或其它通道的安装表面的基座构件和导向构件。柔性杆固定地附接到基座构件并且可滑动地设置在由引导构件限定的通道内。面板设置在柔性杆上或围绕柔性杆并且位于基部和引导构件之间。致动器能够使杆变形，使得面板移动远离管道的端子开口，从而打开排气口。还提供了包括根据本发明的通风组件的流体分配系统。

4. 发明授权

US06658731B1 Method for fabricating connectors for interconnecting etched tri-metal circuit structures 失效
标题翻译：制造用于互连蚀刻的三金属电路结构的连接器的方法
公开(公告)号：US06658731B1
公开(公告)日：2003-12-09
申请号：US09703554
申请日：2000-11-01
申请人： Lakhi Nandlal Goenka , Mohan R. Paruchuri , Thomas B Krautheim
发明人： Lakhi Nandlal Goenka , Mohan R. Paruchuri , Thomas B Krautheim
IPC分类号： H05K302
CPC分类号： H05K3/4007 , H05K3/062 , H05K3/363 , H05K2201/0361 , H05K2201/0367 , H05K2201/09745 , H05K2201/209 , H05K2203/0152 , H05K2203/0376 , H05K2203/1184 , Y10S439/943 , Y10T29/49117 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155
摘要： In conventional ETM circuit structures a pin connector in which the pin is etched from the ETM substrate and the mating cavity is etched from the ETM substrate to be mated. The connector utilizes the subtractive ETM structure processing to define any one of several pin-cavity configurations. The pin serves as an anchor with the metallurgical bonds with solder in the cavity that forms on the copper surfaces of the ETM circuit structure to give good mechanical strength to the connection. In particular four different configurations of interconnections are shown and described.
摘要翻译：在传统的ETM电路结构中，一个引脚连接器，其中从ETM基板蚀刻引脚，并且从ETM基板蚀刻配合腔以进行配合。连接器利用减法ETM结构处理来定义几个引脚腔配置中的任何一个。该引脚用作锚固件，其中在空腔中与焊料的冶金结合形成在ETM电路结构的铜表面上，以为连接提供良好的机械强度。特别地示出和描述了四种不同的互连配置。

5. 发明授权

US06655504B2 Braking assembly and system 失效
标题翻译：制动装配和系统
公开(公告)号：US06655504B2
公开(公告)日：2003-12-02
申请号：US09904408
申请日：2001-07-12
申请人： Andrew Zachary Glovatsky , Robert Edward Belke , Jay DeAvis Baker , Joseph Mario Giachino , Lakhi Nandlal Goenka , Myron Lemecha
发明人： Andrew Zachary Glovatsky , Robert Edward Belke , Jay DeAvis Baker , Joseph Mario Giachino , Lakhi Nandlal Goenka , Myron Lemecha
IPC分类号： F16D5508
CPC分类号： F16D51/10 , F16D65/18 , F16D2121/02 , F16D2121/14 , F16D2121/24 , F16D2125/58
摘要： A braking unit is provided. In one embodiment, the braking unit comprises a base member, a guide member, a flexible rod, an actuator adapted to induce deformation of the rod, and a brake pad. One end of the flexible rod is fixedly attached to the base member while another end is slideably disposed within a passageway defined by the guide member. The brake pad is positioned adjacent the flexible rod such that deformation of the rod causes lateral movement of the brake pad. The braking unit can be incorporated into disc and drum-type braking assemblies and systems.
摘要翻译：提供制动单元。在一个实施例中，制动单元包括基座构件，引导构件，柔性杆，适于引起杆的变形的致动器和制动衬块。柔性杆的一端固定地附接到基部构件，而另一端可滑动地设置在由引导构件限定的通道内。制动衬块位于柔性杆附近，使得杆的变形引起制动衬块的横向移动。制动单元可以结合到盘式和鼓式制动组件和系统中。

6. 发明授权

US06547117B2 Container holder that utilizes moldline structures 失效
公开(公告)号：US06547117B2
公开(公告)日：2003-04-15
申请号：US09904346
申请日：2001-07-12
申请人： Andrew Zachary Glovatsky , Robert Edward Belke , Jay DeAvis Baker , Joseph Mario Giachino , Lakhi Nandlal Goenka , Myron Lemecha
发明人： Andrew Zachary Glovatsky , Robert Edward Belke , Jay DeAvis Baker , Joseph Mario Giachino , Lakhi Nandlal Goenka , Myron Lemecha
IPC分类号： B60R700
CPC分类号： B60N3/108 , B60H1/00271 , B60N3/102 , B60N3/104 , B60N3/106 , Y10S224/926
摘要： A container holder for receiving and securing a container is provided. In a preferred embodiment, the container holder comprises a base surface, at least one moldline structure unit, and a sensor. The sensor detects the presence of the container in the holder and induces deformation in the moldline structure unit such that the container is secured in the holder.

7. 发明授权

US06320128B1 Environmentally-sealed electronic assembly and method of making same 失效
标题翻译：环保密封电子组件及其制造方法
公开(公告)号：US06320128B1
公开(公告)日：2001-11-20
申请号：US09578394
申请日：2000-05-25
申请人： Andrew Zachary Glovatsky , Brenda Joyce Nation , Charles Frederick Schweitzer , Daniel Phillip Dailey , Delin Li , Jay DeAvis Baker , Lakhi Nandlal Goenka , Lawrence LeRoy Kneisel , Myron Lemecha
发明人： Andrew Zachary Glovatsky , Brenda Joyce Nation , Charles Frederick Schweitzer , Daniel Phillip Dailey , Delin Li , Jay DeAvis Baker , Lakhi Nandlal Goenka , Lawrence LeRoy Kneisel , Myron Lemecha
IPC分类号： H01L2328
CPC分类号： H05K3/284 , H01L23/5387 , H01L2924/0002 , H05K1/189 , H05K5/0095 , H01L2924/00
摘要： An electronic assembly includes a flexible multilayer substrate having integral electrically-conductive traces that also includes, as a lowermost layer, a metal foil. A plurality of uppermost layers, likewise including a metal foil, form a thin barrier member that is sealingly attached to the substrate's other layers. In this manner, a plurality of electronic components, mounted on the substrate's other layers so as to be electrically interconnected with the traces before sealingly attaching the barrier member, are encapsulated within metal foil to provide an environmentally-sealed assembly featuring improved resistance to moisture diffusion and penetration/permeation of other substances characteristic of the assembly's service environment into the assembly. A filler material, also encapsulated within the metal foil, is operative to neutralize a predetermined amount of a penetrant, further improving the operability and service life of the assembly. Preferably, a relatively-rigid polymeric material is formed in touching contact with the substrate, as by overmolding the plastic material on the environmentally-sealed assembly, to thereby provide a plastic part incorporating the assembly.
摘要翻译：电子组件包括具有整体导电迹线的柔性多层基板，其还包括作为最下层的金属箔。同样包括金属箔的多个最上层形成密封地附接到基底的其它层的薄的阻挡构件。以这种方式，将多个电子部件安装在基板的其它层上，以便在密封地附接阻挡构件之前与迹线电互连，被封装在金属箔内以提供环境密封的组件，其特征在于具有改进的抗潮湿扩散性以及组装服务环境特征的其他物质的渗透/渗透。还封装在金属箔内的填充材料可操作以中和预定量的渗透剂，进一步提高组件的可操作性和使用寿命。优选地，相对刚性的聚合物材料形成为与基底接触接触，如通过将环境密封的组件上的塑料材料包覆成型，从而提供结合该组件的塑料部件。

8. 发明授权

US5794859A Matrix array spray head 失效
标题翻译：矩阵阵列喷头
公开(公告)号：US5794859A
公开(公告)日：1998-08-18
申请号：US757354
申请日：1996-11-27
申请人： Lakhi Nandlal Goenka , Jay DeAvis Baker , Hossein Nivi
发明人： Lakhi Nandlal Goenka , Jay DeAvis Baker , Hossein Nivi
IPC分类号： B05B1/30 , B05B7/04 , B05B7/08 , B05B1/14
CPC分类号： B05B1/30 , B05B1/3013 , B05B7/0483 , B05B7/0884
摘要： A matrix array spray head including a valve section for controlling nozzles is disclosed. The spray head is formed by a series of alternately stacked plates having channels formed in alternate plates for supplying either pressurized gaseous propellant or a composition to be applied by the spray head. Compositions appropriate for spraying with the spray head include paint powder, liquid paint, conformal coatings, flux, water and other materials and fluids which may be atomized when combined with a high pressure gaseous stream. Flow of the composition and gaseous stream may be controlled in the valve section by means of memory metal valves having memory metal valve elements that move in response to the application of electrical current controlled by a logic control. The computer logic control of the valves provides a spray head having a computer-addressable array of tiny spray nozzles.
摘要翻译：公开了一种包括用于控制喷嘴的阀部分的矩阵阵列喷头。喷头由一系列交替堆叠的板形成，该板具有形成在交替板中的通道，用于供应加压气态推进剂或由喷头施加的组合物。适用于喷头喷涂的组合物包括涂料粉末，液体涂料，保形涂料，助熔剂，水和其它材料和流体，当与高压气流组合时可能被雾化。组合物和气流的流动可以通过具有记忆金属阀元件的记忆金属阀控制在阀部分中，该记忆金属阀响应于由逻辑控制控制的电流的施加而移动。阀的计算机逻辑控制提供了具有计算机可寻址的微小喷嘴阵列的喷头。

9. 发明授权

US5901908A Spray nozzle for fluid deposition 失效
标题翻译：用于流体沉积的喷嘴
公开(公告)号：US5901908A
公开(公告)日：1999-05-11
申请号：US757360
申请日：1996-11-27
申请人： Lakhi Nandlal Goenka , Jay DeAvis Baker
发明人： Lakhi Nandlal Goenka , Jay DeAvis Baker
IPC分类号： B05B7/04 , B05B7/08
CPC分类号： B05B7/0884 , B05B7/0483
摘要： A fluid spray nozzle that mixes a pressurized gaseous propellant and paint composition prior to being applied to a workpiece. The nozzle includes an upstream section for receiving the pressurized gaseous propellant. The nozzle directs the gaseous propellant and the fluid composition into a recirculation cavity. The gaseous propellant and fluid composition are received in a downstream section after mixing in the recirculation cavity. The recirculation cavity has lobes on opposite sides of a flow path defined in a region in the recirculation cavity between an inlet opening and the recirculation cavity. The recirculation cavity is formed by silicon micromachining the upstream section, fluid injection section, recirculation cavity and downstream section. The gaseous propellant may be accelerated to supersonic speeds prior to entering the recirculation cavity. The gaseous propellant and fluid composition are decelerated to subsonic speeds prior to exiting the downstream section, thereby resulting in the formation of a shock wave at the transition from supersonic to subsonic speeds which causes further atomization of the fluid composition.
摘要翻译：流体喷嘴，其在施加到工件之前将加压的气体推进剂和涂料组合物混合。喷嘴包括用于接收加压气体推进剂的上游部分。喷嘴将气体推进剂和流体组合物引导到再循环腔中。气体推进剂和流体组合物在再循环空腔中混合后被接收在下游部分中。再循环腔在限定在再循环空腔中的入口开口和再循环腔之间的区域中的流路的相对侧上具有凸角。再循环腔通过硅微加工上游部分，流体注入部分，再循环腔和下游部分形成。在进入再循环空腔之前，气体推进剂可以被加速到超音速。气体推进剂和流体组合物在离开下游段之前减速至亚音速，从而导致在从超音速到亚音速转变的过程中形成冲击波，这导致流体组合物的进一步雾化。

10. 发明授权

US06271481B1 Pad configurations for improved etching of multilayer circuit assemblies 失效
标题翻译：垫片配置，用于改进多层电路组件的蚀刻
公开(公告)号：US06271481B1
公开(公告)日：2001-08-07
申请号：US09146514
申请日：1998-09-03
申请人： Lakhi Nandlal Goenka , Jay DeAvis Baker
发明人： Lakhi Nandlal Goenka , Jay DeAvis Baker
IPC分类号： H01R909
CPC分类号： H05K1/111 , H05K3/062 , H05K3/205 , H05K3/4685 , H05K2201/0361 , H05K2201/0394 , H05K2201/09381 , H05K2203/0376 , Y02P70/611
摘要： There is disclosed herein a tri-metal-layer precircuit 50 which may be selectively etched to provide a multilayer electronic circuit 60 having air bridge crossovers 49. The enlarged ends 44 of the upper air bridge elements 42, and/or the top pads 41 of the tower elements 43, are specially designed such that undercutting of the ends 44 and/or top pads 41 is minimized, thereby minimizing the risk of air bridge/top pad delamination.
摘要翻译：这里公开了三金属层预热电路50，其可以被选择性地蚀刻以提供具有空气桥接器49的多层电子电路60.上部空气桥接元件42的扩大端部44和/或上部空气桥接元件42的顶部焊盘41 塔元件43被特别设计成使端部44和/或顶部焊盘41的底切最小化，从而最小化空气桥/顶垫分层的风险。

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