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1. 发明授权

US06475703B2 Method for constructing multilayer circuit boards having air bridges 失效
标题翻译：用于构造具有空气桥的多层电路板的方法
公开(公告)号：US06475703B2
公开(公告)日：2002-11-05
申请号：US09203148
申请日：1998-12-01
申请人： Delin Li , Achyuta Achari , Alice Dawn Zitzmann , Robert Edward Belke, Jr. , Brenda Joyce Nation , Edward McLeskey , Mohan R. Paruchuri , Lakhi Nandlal Goenka
发明人： Delin Li , Achyuta Achari , Alice Dawn Zitzmann , Robert Edward Belke, Jr. , Brenda Joyce Nation , Edward McLeskey , Mohan R. Paruchuri , Lakhi Nandlal Goenka
IPC分类号： G03C556
CPC分类号： H05K3/062 , H05K3/205 , H05K3/386 , H05K3/4685 , H05K2201/0361 , H05K2201/0394 , H05K2203/0369 , H05K2203/0376
摘要： A multilayer circuit board having air bridge crossover structures and an additive method for producing the same, wherein the circuit includes specially designed metallic fortifying layers to mechanically and/or electrically fortify the circuit.
摘要翻译：一种具有空气桥交叉结构的多层电路板及其制造方法，其特征在于，该电路包括专门设计的金属强化层，用于机械地和/或电气地加固电路。

2. 发明授权

US06381837B1 Method for making an electronic circuit assembly 失效
标题翻译：制造电子电路组件的方法
公开(公告)号：US06381837B1
公开(公告)日：2002-05-07
申请号：US09148061
申请日：1998-09-04
申请人： Jay DeAvis Baker , Edward McLeskey , Delin Li , Cuong Van Pham , Robert Edward Belke , Vivek Amir Jairazbhoy , Thomas B Krautheim , Mohan R. Paruchuri , Lakhi Nandlal Goenka , Jun Ming Hu
发明人： Jay DeAvis Baker , Edward McLeskey , Delin Li , Cuong Van Pham , Robert Edward Belke , Vivek Amir Jairazbhoy , Thomas B Krautheim , Mohan R. Paruchuri , Lakhi Nandlal Goenka , Jun Ming Hu
IPC分类号： H05K334
CPC分类号： H05K3/4685 , H05K1/111 , H05K3/062 , H05K3/303 , H05K3/328 , H05K3/3442 , H05K3/4007 , H05K2201/0361 , H05K2201/0367 , H05K2201/0373 , H05K2201/09781 , H05K2201/10636 , H05K2201/2036 , H05K2203/049 , Y02P70/611 , Y02P70/613 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49149 , Y10T29/49155 , Y10T29/49156
摘要： A method for producing an electronic circuit assembly (e.g., a circuit board) from an etched tri-metal-layer structure which provides air bridge crossovers and specially designed bumps etched from a middle layer of the tri-metal-layer structure. The bumps are formed at particular circuit locations in order to provide interconnects for (1) heavy wirebonding, (2) fine wirebonding, or (3) direct chip attachment; or, to provide (4) lifters for assuring a minimum solder joint standoff height or (5) barriers for retarding solder joint crack propagation.
摘要翻译：从蚀刻的三金属层结构制造电子电路组件（例如，电路板）的方法，其提供空气桥交叉和从三金属层结构的中间层蚀刻的特殊设计的凸起。凸起形成在特定的电路位置，以提供用于（1）重引线键合，（2）细线接合或（3）直接芯片附接的互连。或者提供（4）用于确保最小焊点间隙高度的提升器，或（5）阻止焊点裂纹扩展的障碍物。

3. 发明授权

US5789121A High density template: materials and processes for the application of conductive pastes 失效
标题翻译：高密度图案模板
公开(公告)号：US5789121A
公开(公告)日：1998-08-04
申请号：US879470
申请日：1997-06-20
申请人： Douglas Adam Cywar , Charles Robert Davis , Thomas Patrick Duffy , Frank Daniel Egitto , Paul Joseph Hart , Gerald Walter Jones , Edward McLeskey
发明人： Douglas Adam Cywar , Charles Robert Davis , Thomas Patrick Duffy , Frank Daniel Egitto , Paul Joseph Hart , Gerald Walter Jones , Edward McLeskey
IPC分类号： G03F7/00 , H05K1/09 , H05K3/00 , H05K3/10 , H05K3/12 , H05K3/40 , H05K3/46 , G03C3/00
CPC分类号： G03F7/00 , H05K3/0032 , H05K3/1258 , H05K3/4069 , H05K1/095 , H05K2201/015 , H05K2201/0209 , H05K2203/0191 , H05K2203/0568 , H05K2203/0769 , H05K2203/0783 , H05K2203/1383 , H05K3/0035 , H05K3/107 , H05K3/4664 , Y10S428/901 , Y10S430/146 , Y10T428/24917
摘要： The present invention provides a method of ablative photodecomposition and forming metal pattern which attains high resolution, is convenient, and employs non-halogenated solvents. The present invention is directed to a process for forming a metal pattern, preferably circuitization on an organic substrate, preferably on a circuit board or component thereof, which comprises coating the substrate with an ablatively-removable coating comprising a polymer resin preferably an acrylate polymer resin and preferably an ultraviolet absorber. A pattern is formed in the polymer coating corresponding to the desired metal pattern by irradiating at least a portion of the polymer coating with a sufficient amount of ultraviolet radiation to thereby ablatively remove the irradiated portion of the polymer coating. Next the patterned substrate is coated with a conductive metal paste to define the metal pattern, and the conductive metal paste is cured. The remaining polymer coating is removed by solvent stripping with nonhalogenated solvents. The present invention further includes patterning electronic structures comprising multilayer circuitry using the above method. An excimer laser is used to form vias or through holes in the electronic structure while simultaneously patterning the polymer coating. This results in perfect alignment between the pattern formed in the polymer coating and the vias or through holes. High resolution circuitry is thus attainable when the electronic structure is subsequently metallized with a conductive metal paste.
摘要翻译：本发明提供了一种烧蚀光分解和形成金属图案的方法，其获得高分辨率，方便并采用非卤化溶剂。本发明涉及一种用于形成金属图案的方法，优选在有机基板上，优选在电路板或其组件上进行电路化，该方法包括用可剥离涂层涂覆基材，该涂层包含聚合物树脂，优选丙烯酸酯聚合物树脂优选紫外线吸收剂。通过用足够量的紫外线照射至少一部分聚合物涂层，形成对应于所需金属图案的聚合物涂层中的图案，从而消除聚合物涂层的照射部分。接下来，用导电金属膏涂覆图案化衬底以限定金属图案，并且导电金属膏被固化。用非卤化溶剂通过溶剂汽提除去剩余的聚合物涂层。本发明还包括使用上述方法图案化包括多层电路的电子结构。准分子激光器用于在电子结构中形成通孔或通孔，同时构图聚合物涂层。这导致在聚合物涂层中形成的图案与通孔或通孔之间完美对准。因此，当电子结构随后用导电金属膏进行金属化时，可实现高分辨率电路。

4. 发明授权

US5460921A High density pattern template: materials and processes for the application of conductive pastes 失效
标题翻译：高密度图案模板：应用导电浆料的材料和工艺
公开(公告)号：US5460921A
公开(公告)日：1995-10-24
申请号：US118010
申请日：1993-09-08
申请人： Douglas A. Cywar , Charles R. Davis , Thomas P. Duffy , Frank D. Egitto , Paul J. Hart , Gerald W. Jones , Edward McLeskey
发明人： Douglas A. Cywar , Charles R. Davis , Thomas P. Duffy , Frank D. Egitto , Paul J. Hart , Gerald W. Jones , Edward McLeskey
IPC分类号： G03F7/00 , H05K1/09 , H05K3/00 , H05K3/10 , H05K3/12 , H05K3/40 , H05K3/46 , G03C5/00
CPC分类号： G03F7/00 , H05K3/0032 , H05K3/1258 , H05K3/4069 , H05K1/095 , H05K2201/015 , H05K2201/0209 , H05K2203/0191 , H05K2203/0568 , H05K2203/0769 , H05K2203/0783 , H05K2203/1383 , H05K3/0035 , H05K3/107 , H05K3/4664 , Y10S428/901 , Y10S430/146 , Y10T428/24917
摘要： The present invention provides a method of ablative photodecomposition and forming metal pattern which attains high resolution, is convenient, and employs non-halogenated solvents. The present invention is directed to a process for forming a metal pattern, preferably circuitization on an organic substrate, preferably on a circuit board or component thereof, which comprises coating the substrate with an ablatively-removable coating comprising a polymer resin preferably an acrylate polymer resin and preferably an ultraviolet absorber. A pattern is formed in the polymer coating corresponding to the desired metal pattern by irradiating at least a portion of the polymer coating with a sufficient amount of ultraviolet radiation to thereby ablatively remove the irradiated portion of the polymer coating. Next the patterned substrate is coated with a conductive metal paste to define the metal pattern, and the conductive metal paste is cured. The remaining polymer coating is removed by solvent stripping with non-halogenated solvents. The present invention further includes patterning electronic structures comprising multilayer circuitry using the above method. An excimer laser is used to form vias or through holes in the electronic structure while simultaneously patterning the polymer coating. This results in perfect alignment between the pattern formed in the polymer coating and the vias or through holes. High resolution circuitry is thus attainable when the electronic structure is subsequently metallized with a conductive metal paste.
摘要翻译：本发明提供了一种烧蚀光分解和形成金属图案的方法，其获得高分辨率，方便并采用非卤化溶剂。本发明涉及一种用于形成金属图案的方法，优选在有机基板上，优选在电路板或其组件上进行电路化，该方法包括用可剥离涂层涂覆基材，该涂层包含聚合物树脂，优选丙烯酸酯聚合物树脂优选紫外线吸收剂。通过用足够量的紫外线照射至少一部分聚合物涂层，形成对应于所需金属图案的聚合物涂层中的图案，从而消除聚合物涂层的照射部分。接下来，用导电金属膏涂覆图案化衬底以限定金属图案，并且导电金属膏被固化。通过用非卤化溶剂的溶剂汽提除去剩余的聚合物涂层。本发明还包括使用上述方法图案化包括多层电路的电子结构。准分子激光器用于在电子结构中形成通孔或通孔，同时构图聚合物涂层。这导致在聚合物涂层中形成的图案与通孔或通孔之间完美对准。因此，当电子结构随后用导电金属膏进行金属化时，可实现高分辨率电路。

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