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1. 发明申请

US20050129357A1 Light guide apparatus for enhancing light source utilization efficiency 有权
标题翻译：用于提高光源利用效率的导光装置
公开(公告)号：US20050129357A1
公开(公告)日：2005-06-16
申请号：US10810666
申请日：2004-03-29
申请人： Jauh-Jung Yang , Jian-Shian Lin , Po-Hung Yao , Jyh-Chun Chang
发明人： Jauh-Jung Yang , Jian-Shian Lin , Po-Hung Yao , Jyh-Chun Chang
IPC分类号： F21V8/00 , G02B6/26
CPC分类号： G02B6/0021 , G02B6/0038
摘要： A light guide apparatus for enhancing light source utilization efficiency includes a light guide sheet, a light coupling structure and a light emerging structure. The light coupling structure is arranged on a surface of the light guide sheet and opposite to a light source. The light emerging structure is disposed on a surface of light guide sheet. Lights emitted by the light source enters into the light guide sheet via the light coupling structure and evenly emitted to outer environment via said light emerging structure, thereby enhancing light source utilization efficiency.
摘要翻译：用于提高光源利用效率的导光装置包括导光片，光耦合结构和光出射结构。光耦合结构布置在导光片的表面上并与光源相对。光出射结构设置在导光片的表面上。由光源发出的光通过光耦合结构进入导光板，并通过所述出光结构均匀地发射到外部环境，从而提高光源利用效率。

2. 发明授权

US07033059B2 Light guide apparatus for enhancing light source utilization efficiency 有权
标题翻译：用于提高光源利用效率的导光装置
公开(公告)号：US07033059B2
公开(公告)日：2006-04-25
申请号：US10810666
申请日：2004-03-29
申请人： Jauh-Jung Yang , Jian-Shian Lin , Po-Hung Yao , Jyh-Chun Chang
发明人： Jauh-Jung Yang , Jian-Shian Lin , Po-Hung Yao , Jyh-Chun Chang
IPC分类号： B29D11/00 , F21V5/00 , G02B6/00
CPC分类号： G02B6/0021 , G02B6/0038
摘要： A light guide apparatus for enhancing light source utilization efficiency includes a light guide sheet, a light coupling structure and a light emerging structure. The light coupling structure is arranged on a surface of the light guide sheet and opposite to a light source. The light emerging structure is disposed on a surface of light guide sheet. Lights emitted by the light source enters into the light guide sheet via the light coupling structure and evenly emitted to outer environment via said light emerging structure, thereby enhancing light source utilization efficiency.
摘要翻译：用于提高光源利用效率的导光装置包括导光片，光耦合结构和光出射结构。光耦合结构布置在导光片的表面上并与光源相对。光出射结构设置在导光片的表面上。由光源发出的光通过光耦合结构进入导光板，并通过所述出光结构均匀地发射到外部环境，从而提高光源利用效率。

3. 发明授权

US07575344B2 Lamp fixture 有权
标题翻译：灯具
公开(公告)号：US07575344B2
公开(公告)日：2009-08-18
申请号：US11774561
申请日：2007-07-07
申请人： Jian-Shian Lin , Chieh-Lung Lai , Jen-Hui Tsai , Tung-Chuan Wu
发明人： Jian-Shian Lin , Chieh-Lung Lai , Jen-Hui Tsai , Tung-Chuan Wu
IPC分类号： F21V5/02
CPC分类号： F21S13/12 , F21S6/003 , F21V5/04 , F21V5/045 , F21Y2103/00
摘要： An improved lamp fixture with anti-glare function is disclosed, which comprises: a lamp; a light source; and a light-control unit, composed of a semi-Fresnel microstructure and a light-control microstructure; wherein the light source and the light-control unit are mounted on the lamp; and the semi-Fresnel microstructure is used for diffusing/collimating light of the light source while the light-control microstructure is used for controlling the resulting lighting angle. With the aforesaid lamp fixture, not only glare can be prevented, but also uniformity of the lamp fixture is improved.
摘要翻译：公开了一种具有防眩光功能的改进的灯具，其包括：灯; 光源; 以及由半菲涅耳微结构和光控微结构组成的光控单元; 其中所述光源和所述光控制单元安装在所述灯上; 并且半菲涅尔微结构用于扩散/准直光源的光，而光控微结构用于控制所得的照明角度。利用上述灯具，不仅可以防止眩光，还能提高灯具的均匀性。

4. 发明申请

US20130005055A1 LED MODULE AND PACKAGING METHOD THEREOF 审中-公开
标题翻译： LED模块及其封装方法
公开(公告)号：US20130005055A1
公开(公告)日：2013-01-03
申请号：US13543418
申请日：2012-07-06
申请人： Jian-Shian Lin , Chieh-Lung Lai , Hsiu-Jen Lin , Weng-Jung Lu , Yi-Ping Huang , Ya-Chun Tu
发明人： Jian-Shian Lin , Chieh-Lung Lai , Hsiu-Jen Lin , Weng-Jung Lu , Yi-Ping Huang , Ya-Chun Tu
IPC分类号： H01L33/62
CPC分类号： F21V19/02 , F21K9/00 , F21Y2107/50 , F21Y2115/10 , H01L25/0753 , H01L33/62 , H01L2224/29339 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2924/01047 , H01L2924/01322 , H01L2924/00014 , H01L2924/00 , H01L2924/01014
摘要： A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.
摘要翻译：一种发光二极管（LED）模块和一种LED封装方法。由于LED模块在考虑到烛光分布的情况下被封装，所以封装在LED模块中的LED芯片的每个引线框架被弯曲以使LED芯片以不同的角度倾斜以呈现各种照明效果。同时，在LED封装方法中，可以通过一次操作快速地将多个LED芯片加载在一起，从而导致烛光分布曲线的偏差较小。

5. 发明申请

US20120168950A1 DIE STRUCTURE, MANUFACTURING METHOD AND SUBSTRATE THEREOF 有权
标题翻译： DIE结构，制造方法及其基板
公开(公告)号：US20120168950A1
公开(公告)日：2012-07-05
申请号：US13186411
申请日：2011-07-19
申请人： Meng-Chi Huang , Han-Ping Yang , Min-Chieh Chou , Tune-Hune Kao , Jung-Kang Peng , Cheng-Hsuan Lin , Jian-Shian Lin
发明人： Meng-Chi Huang , Han-Ping Yang , Min-Chieh Chou , Tune-Hune Kao , Jung-Kang Peng , Cheng-Hsuan Lin , Jian-Shian Lin
IPC分类号： H01L23/48 , H01L21/50
CPC分类号： H01L33/0079 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2933/0041 , H01L2933/0075 , H01L2924/00014
摘要： A die structure, a manufacturing method and a substrate, wherein the die structure is constituted by a chip on wafer (COW) and the substrate, and the substrate is formed by stacking and then cutting a plurality of thermal and electrical conductive poles and a plurality of insulating material layers. Moreover, the fabricating of the die structure comprises a plurality of COWs carried on a carrier board is bonded on the substrate, the plurality of COWs are in contact with the plurality of thermal and electrical conductive poles on the substrate, and then the carrier board is removed. After that, a phosphor plate is adhered on the plurality of COWs so as to form a stacked structure. Thereafter, the stacked structure is cut, thus forming a plurality of die structures having at least one COW.
摘要翻译：模具结构，制造方法和基板，其中，所述模具结构由晶片上的芯片（COW）和所述基板构成，所述基板通过层叠形成，然后切割多个导热极和多个导电极的绝缘材料层。此外，模具结构的制造包括承载在载体板上的多个COW结合在基板上，多个COW与基板上的多个热导电极接触，然后载板是删除。之后，在多个COW上粘接荧光体板，形成层叠结构。此后，切割堆叠结构，从而形成具有至少一个COW的多个模具结构。

6. 发明授权

US07636502B2 Optical waveguide bio-sensing device 有权
标题翻译：光波导生物传感器
公开(公告)号：US07636502B2
公开(公告)日：2009-12-22
申请号：US11540972
申请日：2006-10-02
申请人： Yen-Chieh Mao , Jian-Shian Lin , Lai-Sheng Chen , Wei-Han Wang
发明人： Yen-Chieh Mao , Jian-Shian Lin , Lai-Sheng Chen , Wei-Han Wang
IPC分类号： G02B6/00 , G02B6/34
CPC分类号： G01N21/7703 , G01N21/553 , G01N2021/7773
摘要： An optical waveguide bio-sensing device, comprising: a monochromatic light source, a beam splitter, a grating chip with a sub-wavelength grating structure and a sensor. Moreover, in order to enhance the sensitivity of the system using the optical waveguide bio-sensing device, a light concentrating element or a quarter waveplate (¼λ) is arranged in the optical path during detection. When the grating chip is not coated with a layer of biochemical substance corresponding to a monochrome light emitted from the monochromatic light source, a reflected light of a specific narrow wavelength is reflected by a specific angle as a surface plasmon resonant effect caused by waveguide coupling is excited by the incidence of the monochrome light to the grating chip through the beam splitter; otherwise, there will be little or no reflection. Accordingly, the optical waveguide bio-sensing device can detect bio-molecular interactions, reaction rate and/or molecular dynamics without any labeling in real time. Optical systems using the present invention are simplified and capable of being portable. Thus a high sensitivity detection technique is achieved.
摘要翻译：一种光波导生物感测装置，包括：单色光源，分束器，具有亚波长光栅结构的光栅芯片和传感器。此外，为了提高使用光波导生物感测装置的系统的灵敏度，在检测期间在光路中布置光聚集元件或四分之一波片（λ-λ）。当光栅芯片没有涂覆与从单色光源发射的单色光相对应的生物化学物质层时，由于波导耦合引起的表面等离子体共振效应，特定窄波长的反射光被反射特定角度由单色光通过分束器激发到光栅芯片; 否则，会有很少或没有反映。因此，光波导生物传感装置可以实时检测生物分子相互作用，反应速率和/或分子动力学，而无需任何标记。使用本发明的光学系统被简化并能够便携。因此实现了高灵敏度检测技术。

7. 发明申请

US20090135599A1 LIGHT SOURCE DEVICE 有权
标题翻译：光源设备
公开(公告)号：US20090135599A1
公开(公告)日：2009-05-28
申请号：US11964627
申请日：2007-12-26
申请人： Jian-Shian Lin , Chieh-Lung Lai
发明人： Jian-Shian Lin , Chieh-Lung Lai
IPC分类号： F21V21/00
CPC分类号： H05K3/301 , F21K9/00 , F21Y2107/50 , F21Y2115/10 , H05K2201/10106 , H05K2201/10484 , H05K2201/10606
摘要： A light source device is disclosed, which involves forming a plurality of carrier planes on a substrate with at least one of the carrier planes forming an angle relative to the substrate, and respectively mounting LEDs on the carrier planes and electrically connecting the LEDs with the carrier planes so as to obtain a preferred light distribution effect, thereby eliminating the need of additional light control element in the prior art and enhancing light emitting efficiency of the light source device.
摘要翻译：公开了一种光源装置，其涉及在基板上形成多个载体平面，其中至少一个载体平面相对于基板形成一角度，并且分别将LED安装在载体平面上并将LED与载体电连接平面，从而获得优选的配光效果，从而消除了现有技术中额外的光控制元件的需要，并提高了光源装置的发光效率。

8. 发明申请

US20060139933A1 Reflector with negative focal length 有权
标题翻译：反焦器具有负焦距
公开(公告)号：US20060139933A1
公开(公告)日：2006-06-29
申请号：US11088792
申请日：2005-03-25
申请人： Jian-Shian Lin , Hsiu-Chen Hsu , Min-Lung Hsieh
发明人： Jian-Shian Lin , Hsiu-Chen Hsu , Min-Lung Hsieh
IPC分类号： F21V7/00
CPC分类号： F21V7/09 , F21V7/005 , F21V13/04 , F21Y2103/00 , F21Y2115/10
摘要： A luminaire with reflector of negative focal length is disclosed, which comprises a light source and a luminaire screen having a reflector of negative focal length, a side screen and a plate; wherein the reflector of negative focal length is capable of reflecting the upward-incident rays emitting from the light source; and the side screen is capable of reflecting the sideward-incident rays emitting from the light source and the reflected rays of the reflector; and the plate being disposed at the lower portion of the luminaire screen beneath the light source has a plurality of micro-structures arrange thereon and is capable of accepting the rays of the downward incident area along with both the reflected rays of the reflector and the side screen so as to diffuse the same for discharging. By the luminaire screen of the invention, the rays emitting from the light source of the luminaire are reflected and directed to a preferred discharging area so as to enable the rays to be discharge out of the luminaire by large angles for reducing glare, in addition, the height of the luminaire can be reduced.
摘要翻译：公开了一种具有负焦距反射器的照明装置，其包括光源和具有负焦距反射器，侧屏和板的照明屏幕; 其中负焦距的反射器能够反射从光源发射的向上入射的光线; 并且侧面屏幕能够反射从光源发射的侧射入射线和反射器的反射光线; 并且设置在光源下方的灯具屏幕的下部的板具有布置在其上的多个微结构，并且能够接收向下入射区域的光线以及反射器的反射光线和侧面的反射光线屏幕，以便扩散相同的放电。通过本发明的照明器屏幕，从照明器的光源发射的光线被反射并且被引导到优选的放电区域，以便使光线能够以大角度从灯具中排出以减少眩光，此外，可以降低灯具的高度。

9. 发明申请

US20130334561A1 METHOD FOR BONDING LED WAFER, METHOD FOR MANUFACTURING LED CHIP AND BONDING STRUCTURE 审中-公开
标题翻译：用于连接LED波形的方法，制造LED芯片和结合结构的方法
公开(公告)号：US20130334561A1
公开(公告)日：2013-12-19
申请号：US13527318
申请日：2012-06-19
申请人： Hsiu-Jen LIN , Jian-Shian Lin , Shau-Yi Chen , Jen-Hui Tsai
发明人： Hsiu-Jen LIN , Jian-Shian Lin , Shau-Yi Chen , Jen-Hui Tsai
IPC分类号： H01L33/48 , H01L33/62
CPC分类号： H01L33/0079 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L33/0095 , H01L2224/2745 , H01L2224/27462 , H01L2224/29109 , H01L2224/29113 , H01L2224/83097 , H01L2224/83191 , H01L2224/83207 , H01L2224/8381 , H01L2224/83825 , H01L2224/8383 , H01L2224/94 , H01L2924/12041 , H01L2924/12042 , H01L2924/351 , H01L2924/01083 , H01L2924/0105 , H01L2924/0103 , H01L2924/01049 , H01L2924/00014 , H01L2224/83 , H01L2224/27 , H01L2924/00
摘要： A method for bonding an LED wafer, a method for manufacturing an LED chip, and a bonding structure are provided. The method for bonding an LED wafer includes the following steps. A first metal film is formed on an LED wafer. A second metal film is formed on a substrate. A bonding material layer whose melting point is lower than or equal to about 110° C. is formed on the surface of the first metal film. The LED wafer is placed on the substrate. The bonding material layer is heated at a pre-solid reaction temperature for a pre-solid time to perform a pre-solid reaction. The bonding material layer is heated at a diffusion reaction temperature for a diffusing time to perform a diffusion reaction, wherein the melting points of the first and the second inter-metallic layers after diffusion reaction are higher than about 110° C.
摘要翻译：提供一种用于结合LED晶片的方法，制造LED芯片的方法和接合结构。用于结合LED晶片的方法包括以下步骤。在LED晶片上形成第一金属膜。在基板上形成第二金属膜。在第一金属膜的表面上形成熔点低于或等于约110℃的接合材料层。将LED晶片放置在基板上。将接合材料层在预固体反应温度下加热预固化时间以进行预固体反应。接合材料层在扩散反应温度下加热扩散时间以进行扩散反应，其中扩散反应后第一和第二金属间层的熔点高于约110℃。

10. 发明授权

US08236687B2 Die-bonding method of LED chip and LED manufactured by the same 有权
标题翻译： LED芯片和LED芯片的贴合方法
公开(公告)号：US08236687B2
公开(公告)日：2012-08-07
申请号：US12854278
申请日：2010-08-11
申请人： Hsiu-Jen Lin , Jian-Shian Lin , Shau-Yi Chen , Chieh-Lung Lai
发明人： Hsiu-Jen Lin , Jian-Shian Lin , Shau-Yi Chen , Chieh-Lung Lai
IPC分类号： H01L21/44
CPC分类号： H01L23/53247 , H01L24/29 , H01L24/83 , H01L33/0079 , H01L33/0095 , H01L33/30 , H01L33/40 , H01L33/486 , H01L33/62 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/83193 , H01L2224/83207 , H01L2224/8382 , H01L2224/83825 , H01L2224/8383 , H01L2224/83948 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/15724 , H01L2924/15738 , H01L2924/15747 , H01L2924/1576 , H01L2924/15787 , H01L2924/351 , H01L2933/0066 , H01L2924/00 , H01L2924/01028 , H01L2924/01083 , H01L2924/00014
摘要： A die-bonding method is suitable for die-bonding a LED chip having a first metal thin-film layer to a substrate. The method includes forming a second metal thin film layer on a surface of the substrate; forming a die-bonding material layer on the second metal thin film layer; placing the LED chip on the die-bonding material layer with the first metal thin film layer contacting the die-bonding material layer; heating the die-bonding material layer at a liquid -solid reaction temperature for a pre-curing time, so as to form a first intermetallic layer and a second intermetallic layer; and heating the die-bonding material layer at a solid-solid reaction temperature for a curing time for performing a solid-solid reaction. The liquid-solid reaction temperature and the solid-solid reaction temperature are both lower than 110° C., and a melting point of the first and second intermetallic layers after the solid-solid reaction is higher than 200° C.
摘要翻译：芯片接合方法适合于将具有第一金属薄膜层的LED芯片芯片接合到基板上。该方法包括在基板的表面上形成第二金属薄膜层; 在所述第二金属薄膜层上形成芯片接合材料层; 将第一金属薄膜层与芯片接合材料层接触，将LED芯片放置在芯片接合材料层上; 在液固固化反应温度下加热芯片接合材料层达预固化时间，以形成第一金属间层和第二金属间层; 并在固 - 固反应温度下加热芯片接合材料层进行固 - 固反应的固化时间。液固反应温度和固 - 固反应温度均低于110℃，固 - 固反应后第一和第二金属间化合物的熔点高于200℃。

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