会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 9. 发明申请
    • SOLDER ALLOYS
    • 焊接合金
    • US20070292072A1
    • 2007-12-20
    • US11424412
    • 2006-06-15
    • Ainissa Gweneth RamirezRoger Sinta
    • Ainissa Gweneth RamirezRoger Sinta
    • G02B6/12
    • B23K35/262B23K35/3013C22C5/02C22C13/00C22C28/00H01L51/5246
    • Lead-free solder compositions for bonding and sealing flat panel displays, CCD's, solar cells, light emitting diodes, and other optoelectronic devices are disclosed. The solders are based on alloys of Sn, Au, Ag, and Cu and one or more rare earth metals chosen from the following, Y, La, Ce, Pr, Sc, Sm, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu. Optionally, the compositions may comprise In, Bi, or Zn. The solder compositions exhibit superior bonding capability in joining dissimilar surfaces such as those present in both the flat panel display and light emitting devices. Additionally the solders provide a strong barrier to the diffusion of both water and oxygen into these devices thus promoting longer device life times.
    • 公开了用于粘合和密封平板显示器,CCD,太阳能电池,发光二极管和其它光电子器件的无铅焊料组合物。 焊料基于Sn,Au,Ag和Cu的合金以及一种或多种稀土金属,其选自以下Y,La,Ce,Pr,Sc,Sm,Gd,Tb,Dy,Ho,Er,Tm ,Yb和Lu。 任选地,组合物可以包含In,Bi或Zn。 焊料组合物在接合不同的表面(例如平板显示器和发光器件中存在的那些表面)中表现出优异的接合能力。 此外,焊料为水和氧气扩散到这些器件中提供了强大的屏障,从而延长了器件寿命。