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    • 5. 发明授权
    • Fused aromatic structures and methods for photolithographic applications
    • 熔融芳族结构和光刻应用的方法
    • US08029975B2
    • 2011-10-04
    • US12508652
    • 2009-07-24
    • James J. BucchignanoWu-Song HuangPushkara R. VaranasiRoy R. Yu
    • James J. BucchignanoWu-Song HuangPushkara R. VaranasiRoy R. Yu
    • G03F7/004G03F7/039G03F7/20G03F7/30G03F7/38
    • G03F7/0045G03F7/0392Y10S430/12Y10S430/122Y10S430/126Y10S430/143
    • A resist composition and a method for forming a patterned feature on a substrate. The composition comprises a molecular glass having at least one fused polycyclic moiety and at least one base soluble functional group protected with an acid labile protecting group, and a photosensitive acid generator. The method includes providing a composition including a photosensitive acid generator and a molecular glass having at least one fused polycyclic moiety and at least one base soluble functional group protected with an acid labile protecting group, forming a film of the composition on the substrate, patternwise imaging the film, wherein at least one region of the film is exposed to radiation or a beam of particles, resulting in production of an acid catalyst in the exposed region, baking the film, developing the film, resulting in removal of base-soluble exposed regions, wherein a patterned feature from the film remains following the removal.
    • 抗蚀剂组合物和在基材上形成图案化特征的方法。 该组合物包含具有至少一个稠合多环部分和至少一个被酸不稳定保护基团保护的碱溶性官能团的分子玻璃和光敏酸产生剂。 该方法包括提供包含光敏酸产生剂和具有至少一个稠合多环部分的分子玻璃和至少一个被酸不稳定保护基团保护的碱可溶官能团的组合物,在该基质上形成该组合物的膜,图案成像 所述膜,其中所述膜的至少一个区域暴露于辐射或颗粒束,导致在所述暴露区域中产生酸催化剂,烘烤所述膜,显影所述膜,导致去除可溶于碱的暴露区域 ,其中来自膜的图案化特征在去除之后保持不变。
    • 7. 发明申请
    • FUSED AROMATIC STRUCTURES AND METHODS FOR PHOTOLITHOGRAPHIC APPLICATIONS
    • 用于光刻应用的熔融芳构结构和方法
    • US20090286180A1
    • 2009-11-19
    • US12508652
    • 2009-07-24
    • James J. BucchignanoWu-Song HuangPushkara R. VaranasiRoy R. Yu
    • James J. BucchignanoWu-Song HuangPushkara R. VaranasiRoy R. Yu
    • G03F7/20G03F7/004
    • G03F7/0045G03F7/0392Y10S430/12Y10S430/122Y10S430/126Y10S430/143
    • A resist composition and a method for forming a patterned feature on a substrate. The composition comprises a molecular glass having at least one fused polycyclic moiety and at least one base soluble functional group protected with an acid labile protecting group, and a photosensitive acid generator. The method includes providing a composition including a photosensitive acid generator and a molecular glass having at least one fused polycyclic moiety and at least one base soluble functional group protected with an acid labile protecting group, forming a film of the composition on the substrate, patternwise imaging the film, wherein at least one region of the film is exposed to radiation or a beam of particles, resulting in production of an acid catalyst in the exposed region, baking the film, developing the film, resulting in removal of base-soluble exposed regions, wherein a patterned feature from the film remains following the removal.
    • 抗蚀剂组合物和在基材上形成图案化特征的方法。 该组合物包含具有至少一个稠合多环部分和至少一个被酸不稳定保护基团保护的碱溶性官能团的分子玻璃和光敏酸产生剂。 该方法包括提供包含光敏酸产生剂和具有至少一个稠合多环部分的分子玻璃和至少一个被酸不稳定保护基团保护的碱可溶官能团的组合物,在该基质上形成该组合物的膜,图案成像 所述膜,其中所述膜的至少一个区域暴露于辐射或颗粒束,导致在所述暴露区域中产生酸催化剂,烘烤所述膜,显影所述膜,导致去除可溶于碱的暴露区域 ,其中来自膜的图案化特征在去除之后保持不变。
    • 8. 发明授权
    • Fused aromatic structures and methods for photolithographic applications
    • 熔融芳族结构和光刻应用的方法
    • US07566527B2
    • 2009-07-28
    • US11769089
    • 2007-06-27
    • James J. BucchignanoWu-Song HuangPushkara R. VaranasiRoy R. Yu
    • James J. BucchignanoWu-Song HuangPushkara R. VaranasiRoy R. Yu
    • G03F7/039G03F7/20G03F7/30G03F7/36G03F7/38
    • G03F7/0045G03F7/0392Y10S430/12Y10S430/122Y10S430/126Y10S430/143
    • A resist composition and a method for forming a patterned feature on a substrate. The composition comprises a molecular glass having at least one fused polycyclic moiety and at least one base soluble functional group protected with an acid labile protecting group, and a photosensitive acid generator. The method includes providing a composition including a photosensitive acid generator and a molecular glass having at least one fused polycyclic moiety and at least one base soluble functional group protected with an acid labile protecting group, forming a film of the composition on the substrate, patternwise imaging the film, wherein at least one region of the film is exposed to radiation or a beam of particles, resulting in production of an acid catalyst in the exposed region, baking the film, developing the film, resulting in removal of base-soluble exposed regions, wherein a patterned feature from the film remains following the removal.
    • 抗蚀剂组合物和在基材上形成图案化特征的方法。 该组合物包含具有至少一个稠合多环部分和至少一个被酸不稳定保护基团保护的碱溶性官能团的分子玻璃和光敏酸产生剂。 该方法包括提供包含光敏酸产生剂和具有至少一个稠合多环部分的分子玻璃和至少一个被酸不稳定保护基团保护的碱可溶官能团的组合物,在该基质上形成该组合物的膜,图案成像 所述膜,其中所述膜的至少一个区域暴露于辐射或颗粒束,导致在所述暴露区域中产生酸催化剂,烘烤所述膜,显影所述膜,导致去除可溶于碱的暴露区域 ,其中来自膜的图案化特征在去除之后保持不变。
    • 9. 发明授权
    • Structures and methods for low-k or ultra low-k interlayer dielectric pattern transfer
    • 低k或超低k层间电介质图案转移的结构和方法
    • US07695897B2
    • 2010-04-13
    • US11429709
    • 2006-05-08
    • James J. BucchignanoGerald W. GibsonMary B. RothwellRoy R. Yu
    • James J. BucchignanoGerald W. GibsonMary B. RothwellRoy R. Yu
    • G03F7/00G03F7/26
    • H01L21/31144H01L21/76802H01L21/76813
    • The present invention relates to improved methods and structures for forming interconnect patterns in low-k or ultra low-k (i.e., having a dielectric constant ranging from about 1.5 to about 3.5) interlevel dielectric (ILD) materials. Specifically, reduced lithographic critical dimensions (CDs) (i.e., in comparison with target CDs) are initially used for forming a patterned resist layer with an increased thickness, which in turn allows use of a simple hard mask stack comprising a lower nitride mask layer and an upper oxide mask layer for subsequent pattern transfer. The hard mask stack is next patterned by a first reactive ion etching (RIE) process using an oxygen-containing chemistry to form hard mask openings with restored CDs that are substantially the same as the target CDs. The ILD materials are then patterned by a second RIE process using a nitrogen-containing chemistry to form the interconnect pattern with the target CDs.
    • 本发明涉及用于形成低k或超低k(即介电常数范围为约1.5至约3.5)层间电介质(ILD)材料的互连图案的改进方法和结构。 具体地说,减小的光刻关键尺寸(CD)(即与目标CD相比)最初用于形成具有增加的厚度的图案化抗蚀剂层,其又允许使用包括下部氮化物掩模层的简单硬掩模层, 用于随后的图案转印的上氧化物掩模层。 接下来通过使用含氧化学物质的第一反应离子蚀刻(RIE)工艺来形成硬掩模叠层,以形成具有与目标CD基本相同的恢复的CD的硬掩模开口。 然后通过使用含氮化学物质的第二RIE方法将ILD材料图案化,以形成与目标CD的互连图案。
    • 10. 发明申请
    • STRUCTURES AND METHODS FOR LOW-K OR ULTRA LOW-K INTERLAYER DIELECTRIC PATTERN TRANSFER
    • 低K或超低介电常数介质转移的结构与方法
    • US20100196806A1
    • 2010-08-05
    • US12758431
    • 2010-04-12
    • James J. BucchignanoGerald W. GibsonMary B. RothwellRoy R. Yu
    • James J. BucchignanoGerald W. GibsonMary B. RothwellRoy R. Yu
    • G03F1/00
    • H01L21/31144H01L21/76802H01L21/76813
    • The present invention relates to improved methods and structures for forming interconnect patterns in low-k or ultra low-k (i.e., having a dielectric constant ranging from about 1.5 to about 3.5) interlevel dielectric (ILD) materials. Specifically, reduced lithographic critical dimensions (CDs) (i.e., in comparison with target CDs) are initially used for forming a patterned resist layer with an increased thickness, which in turn allows use of a simple hard mask stack comprising a lower nitride mask layer and an upper oxide mask layer for subsequent pattern transfer. The hard mask stack is next patterned by a first reactive ion etching (RIE) process using an oxygen-containing chemistry to form hard mask openings with restored CDs that are substantially the same as the target CDs. The ILD materials are then patterned by a second RIE process using a nitrogen-containing chemistry to form the interconnect pattern with the target CDs.
    • 本发明涉及用于形成低k或超低k(即介电常数范围为约1.5至约3.5)层间电介质(ILD)材料的互连图案的改进方法和结构。 具体地说,减小的光刻关键尺寸(CD)(即与目标CD相比)最初用于形成具有增加的厚度的图案化抗蚀剂层,其又允许使用包括下部氮化物掩模层的简单硬掩模层, 用于随后的图案转印的上氧化物掩模层。 接下来通过使用含氧化学物质的第一反应离子蚀刻(RIE)工艺来形成硬掩模叠层,以形成具有与目标CD基本相同的恢复的CD的硬掩模开口。 然后通过使用含氮化学物质的第二RIE方法将ILD材料图案化,以形成与目标CD的互连图案。