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1. 发明授权

US09362303B2 Semiconductor memory devices including fine patterns and methods of fabricating the same 有权
标题翻译：包括精细图案的半导体存储器件及其制造方法
公开(公告)号：US09362303B2
公开(公告)日：2016-06-07
申请号：US14681505
申请日：2015-04-08
申请人： Jaegoo Lee , Youngwoo Park , Jaeduk Lee
发明人： Jaegoo Lee , Youngwoo Park , Jaeduk Lee
IPC分类号： H01L29/792 , H01L27/115 , H01L29/66 , H01L21/28 , H01L21/768 , H01L21/285
CPC分类号： H01L27/11582 , H01L21/28282 , H01L21/28518 , H01L21/76877 , H01L29/66833 , H01L29/7926
摘要： Semiconductor devices are provided including an active pillar protruding from a substrate; a first gate electrode and a second gate electrode adjacent to a sidewall of the active pillar and vertically overlapping with each other, the first and second gate electrodes being insulated from each other; a first intergate insulating layer covering a first surface of the first gate electrode; and a second intergate insulating layer covering a second surface, opposite the first surface, of the second gate electrode and spaced apart from the first intergate insulating layer. The first intergate insulating layer and the second intergate insulating layer define an air gap therebetween.
摘要翻译：提供半导体器件，其包括从基板突出的有源柱; 与所述有源柱的侧壁相邻并且彼此垂直重叠的第一栅电极和第二栅电极，所述第一栅电极和所述第二栅电极彼此绝缘; 覆盖所述第一栅电极的第一表面的第一隔间绝缘层; 以及覆盖所述第二栅电极的与所述第一表面相对的第二表面并与所述第一栅极绝缘层间隔开的第二栅极绝缘层。第一隔间绝缘层和第二隔间绝缘层在其间形成气隙。

2. 发明授权

US09183893B2 Semiconductor memory device 有权
标题翻译：半导体存储器件
公开(公告)号：US09183893B2
公开(公告)日：2015-11-10
申请号：US14037547
申请日：2013-09-26
申请人： Kohji Kanamori , Youngwoo Park , Jintaek Park , Kwang Soo Seol , Jaeduk Lee
发明人： Kohji Kanamori , Youngwoo Park , Jintaek Park , Kwang Soo Seol , Jaeduk Lee
IPC分类号： G11C5/06 , G11C13/00 , H01L45/00 , H01L27/22 , H01L27/24
CPC分类号： G11C5/06 , G11C5/063 , G11C13/0002 , G11C13/0023 , G11C2213/73 , H01L27/222 , H01L27/249 , H01L45/04 , H01L45/06 , H01L45/1226 , H01L45/143 , H01L45/144 , H01L45/146 , H01L45/147
摘要： According to example embodiments of inventive concepts, a semiconductor memory devices includes: a plurality of memory blocks that each include a plurality of stack structures, global bit lines connected in common to the plurality of memory blocks, block selection lines configured to control electrical connect between the global bit lines and one of the plurality of memory blocks, and vertical selection lines configured to control electrical connected between the global bit lines and one of the plurality of stack structures. Each of the plurality of stack structures includes a plurality of local bit lines, first vertical word lines and second vertical word lines crossing first sidewalls and second sidewalls respectfully of the plurality of stack structures, first variable resistive elements between the plurality of stack structures and the first vertical word lines, and second variable resistive elements between the plurality of stack structures and the second vertical word lines.
摘要翻译：根据本发明构思的示例性实施例，半导体存储器件包括：多个存储器块，每个存储块包括多个堆叠结构，共同连接到多个存储器块的全局位线，被配置为控制全局位线和多个存储器块中的一个以及垂直选择线，其被配置为控制连接在全局位线和多个堆叠结构中的一个之间的电连接。多个堆叠结构中的每一个包括多个局部位线，第一垂直字线和第二垂直字线，其横向于多个堆叠结构的第一侧壁和第二侧壁相交，多个堆叠结构之间的第一可变电阻元件和第一垂直字线和第二可变电阻元件在多个堆叠结构和第二垂直字线之间。

3. 发明申请

US20140306279A1 SEMICONDUCTOR DEVICES INCLUDING WORD LINE INTERCONNECTING STRUCTURES 有权
标题翻译：包括字线互连结构的半导体器件
公开(公告)号：US20140306279A1
公开(公告)日：2014-10-16
申请号：US14191542
申请日：2014-02-27
申请人： Jintaek Park , Youngwoo Park , Jaeduk Lee
发明人： Jintaek Park , Youngwoo Park , Jaeduk Lee
IPC分类号： H01L23/00 , H01L27/115
CPC分类号： H01L27/11556 , H01L27/11582 , H01L29/7889 , H01L29/7926
摘要： A semiconductor memory device includes a substrate including a cell region and an interconnection region, adjacent first and second rows of vertical channels extending vertically from the substrate in the cell region, and layers of word lines stacked on the substrate. Each layer includes a first word line through which the first row of vertical channels passes and a second word line through which the second row of vertical channels passes, and the word lines include respective word line pads extending into the interconnection region. An isolation pattern separates the first and second word lines in the cell region and the interconnection region. First and second pluralities of contact plugs are disposed on opposite sides of the isolation pattern in the interconnection region and contact the word line pads.
摘要翻译：半导体存储器件包括：衬底，其包括单元区域和互连区域;相邻的从单元区域中的衬底垂直延伸的第一和第二排垂直沟道以及堆叠在衬底上的字线层。每层包括第一行垂直通道通过的第一字线和第二行垂直通道通过的第二字线，并且字线包括延伸到互连区域中的相应字线焊盘。隔离图案分离单元区域和互连区域中的第一和第二字线。第一和第二多个接触插塞设置在互连区域中的隔离图案的相对侧上，并与字线焊盘接触。

4. 发明授权

US09601204B2 Three-dimensional semiconductor devices and fabricating methods thereof 有权
公开(公告)号：US09601204B2
公开(公告)日：2017-03-21
申请号：US14523977
申请日：2014-10-27
申请人： Jintaek Park , Youngwoo Park , Jaeduk Lee
发明人： Jintaek Park , Youngwoo Park , Jaeduk Lee
IPC分类号： G11C5/02 , G11C16/04 , G11C16/10 , H01L27/115 , H01L27/06 , H01L27/092
CPC分类号： H01L27/11573 , G11C5/02 , G11C5/025 , G11C16/0466 , G11C16/0483 , G11C16/10 , H01L27/0688 , H01L27/092 , H01L27/1157 , H01L27/11575 , H01L27/11582
摘要： A three-dimensional (3D) semiconductor memory device includes a CMOS circuit structure including a plurality of column blocks each comprising a plurality of page buffer circuits, and a lower wiring structure and a memory structure sequentially stacked over the CMOS circuit structure. The memory structure overlaps a first circuit region of the CMOS circuit structure and does not overlap a second circuit region of the CMOS circuit structure, and the plurality of column blocks are contained within the first circuit region of the CMOS circuit structure.

5. 发明授权

US09875931B2 Semiconductor device having interconnection structure 有权
公开(公告)号：US09875931B2
公开(公告)日：2018-01-23
申请号：US15201922
申请日：2016-07-05
申请人： Dohyun Lee , Youngwoo Park , Junghoon Park , Jaeduk Lee
发明人： Dohyun Lee , Youngwoo Park , Junghoon Park , Jaeduk Lee
IPC分类号： H01L21/00 , H01L21/768 , H01L27/1157 , H01L27/11582 , H01L23/522 , H01L23/532
CPC分类号： H01L21/76877 , H01L21/76816 , H01L23/522 , H01L23/5226 , H01L23/5283 , H01L23/53266 , H01L23/53295 , H01L27/1157 , H01L27/11573 , H01L27/11575 , H01L27/11582
摘要： A semiconductor device includes a semiconductor pattern on a semiconductor substrate, a three-dimensional memory array on the semiconductor pattern, and a peripheral interconnection structure between the semiconductor pattern and the semiconductor substrate. The peripheral interconnection structure includes an upper interconnection structure on a lower interconnection structure. The upper interconnection structure includes an upper interconnection and an upper barrier layer. The lower interconnection structure includes a lower interconnection and a lower barrier layer. The upper barrier layer is under a bottom surface of the upper interconnection and does not cover side surfaces of the upper interconnection. The lower barrier layer is under a bottom surface of the lower interconnection and covers side surfaces of the lower interconnection.

6. 发明授权

US09299707B2 Three-dimensional semiconductor devices with current path selection structure 有权
标题翻译：具有电流路径选择结构的三维半导体器件
公开(公告)号：US09299707B2
公开(公告)日：2016-03-29
申请号：US14150452
申请日：2014-01-08
申请人： Jaeduk Lee , Youngwoo Park , Jintaek Park , Dohyun Lee , Kohji Kanamori
发明人： Jaeduk Lee , Youngwoo Park , Jintaek Park , Dohyun Lee , Kohji Kanamori
IPC分类号： H01L27/108 , H01L27/105 , H01L27/115 , G11C16/10 , G11C16/14
CPC分类号： H01L27/1052 , G11C16/10 , G11C16/14 , H01L27/11524 , H01L27/11556
摘要： Provided are three-dimensional semiconductor devices and methods of operating the same. The three-dimensional semiconductor devices may include active patterns arranged on a substrate to have a multi-layered and multi-column structure and drain patterns connected to respective columns of the active patterns. The methods may include a layer-selection step connecting a selected one of layers of the active patterns selectively to the drain patterns. For example, the layer-selection step may be performed in such a way that widths of depletion regions to be formed in end-portions of the active patterns are differently controlled depending on to a height from the substrate.
摘要翻译：提供三维半导体器件及其操作方法。三维半导体器件可以包括布置在衬底上的有源图案，以具有连接到有源图案的相应列的多层和多列结构以及漏极图案。所述方法可以包括选择性地将有源图案的层中所选择的一个层连接到漏极图案的层选择步骤。例如，层选择步骤可以以这样的方式执行，使得在有源图案的端部中形成的耗尽区的宽度根据与基板的高度不同地被控制。

7. 发明申请

US20150294980A1 Semiconductor Memory Devices Including Fine Patterns and Methods of Fabricatring the Same 有权
标题翻译：包括精细图案的半导体存储器件及其制造方法
公开(公告)号：US20150294980A1
公开(公告)日：2015-10-15
申请号：US14681505
申请日：2015-04-08
申请人： Jaegoo Lee , Youngwoo Park , Jaeduk Lee
发明人： Jaegoo Lee , Youngwoo Park , Jaeduk Lee
IPC分类号： H01L27/115 , H01L29/66 , H01L21/285 , H01L21/28 , H01L21/768 , H01L29/792 , H01L29/423
CPC分类号： H01L27/11582 , H01L21/28282 , H01L21/28518 , H01L21/76877 , H01L29/66833 , H01L29/7926
摘要： Semiconductor devices are provided including an active pillar protruding from a substrate; a first gate electrode and a second gate electrode adjacent to a sidewall of the active pillar and vertically overlapping with each other, the first and second gate electrodes being insulated from each other; a first intergate insulating layer covering a first surface of the first gate electrode; and a second intergate insulating layer covering a second surface, opposite the first surface, of the second gate electrode and spaced apart from the first intergate insulating layer. The first intergate insulating layer and the second intergate insulating layer define an air gap therebetween.
摘要翻译：提供半导体器件，其包括从基板突出的有源柱; 与所述有源柱的侧壁相邻并且彼此垂直重叠的第一栅电极和第二栅电极，所述第一栅电极和所述第二栅电极彼此绝缘; 覆盖所述第一栅电极的第一表面的第一隔间绝缘层; 以及覆盖所述第二栅电极的与所述第一表面相对的第二表面并与所述第一栅极绝缘层间隔开的第二栅极绝缘层。第一隔间绝缘层和第二隔间绝缘层在其间形成气隙。

8. 发明授权

US10418278B2 Semiconductor device having interconnection structure 有权
公开(公告)号：US10418278B2
公开(公告)日：2019-09-17
申请号：US15857961
申请日：2017-12-29
申请人： Dohyun Lee , Youngwoo Park , Junghoon Park , Jaeduk Lee
发明人： Dohyun Lee , Youngwoo Park , Junghoon Park , Jaeduk Lee
IPC分类号： H01L21/00 , H01L21/768 , H01L27/1157 , H01L27/11582 , H01L23/522 , H01L23/532 , H01L27/11573 , H01L27/11575 , H01L23/528
摘要： A semiconductor device includes a semiconductor pattern on a semiconductor substrate, a three-dimensional memory array on the semiconductor pattern, and a peripheral interconnection structure between the semiconductor pattern and the semiconductor substrate. The peripheral interconnection structure includes an upper interconnection structure on a lower interconnection structure. The upper interconnection structure includes an upper interconnection and an upper barrier layer. The lower interconnection structure includes a lower interconnection and a lower barrier layer. The upper barrier layer is under a bottom surface of the upper interconnection and does not cover side surfaces of the upper interconnection. The lower barrier layer is under a bottom surface of the lower interconnection and covers side surfaces of the lower interconnection.

9. 发明授权

US10056404B2 Semiconductor memory devices having closely spaced bit lines 有权
公开(公告)号：US10056404B2
公开(公告)日：2018-08-21
申请号：US14989955
申请日：2016-01-07
申请人： Jaeduk Lee , Youngwoo Park
发明人： Jaeduk Lee , Youngwoo Park
IPC分类号： H01L29/792 , H01L27/11582 , H01L27/11573 , H01L27/06
CPC分类号： H01L27/11582 , H01L27/0688 , H01L27/11573
摘要： The inventive concepts relate to a semiconductor memory device. The semiconductor memory device includes a substrate including a circuit region and first and second connection regions respectively disposed at both sides of the circuit region opposite to each other, a logic structure including a logic circuit disposed on the circuit region and a lower insulating layer covering the logic circuit, and a memory structure on the logic structure. The logic circuit includes a first page buffer disposed adjacently to the first connection region and a second page buffer disposed adjacently to the second connection region. The memory structure includes bit lines extending onto at least one of the first and second connection regions.

10. 发明申请

US20170011996A1 SEMICONDUCTOR DEVICE HAVING INTERCONNECTION STRUCTURE 有权
标题翻译：具有互连结构的半导体器件
公开(公告)号：US20170011996A1
公开(公告)日：2017-01-12
申请号：US15201922
申请日：2016-07-05
申请人： Dohyun LEE , Youngwoo Park , Junghoon Park , Jaeduk Lee
发明人： Dohyun LEE , Youngwoo Park , Junghoon Park , Jaeduk Lee
IPC分类号： H01L23/528 , H01L23/522 , H01L21/768 , H01L27/115
CPC分类号： H01L21/76877 , H01L21/76816 , H01L23/522 , H01L23/5226 , H01L23/5283 , H01L23/53266 , H01L23/53295 , H01L27/1157 , H01L27/11573 , H01L27/11575 , H01L27/11582
摘要： A semiconductor device includes a semiconductor pattern on a semiconductor substrate, a three-dimensional memory array on the semiconductor pattern, and a peripheral interconnection structure between the semiconductor pattern and the semiconductor substrate. The peripheral interconnection structure includes an upper interconnection structure on a lower interconnection structure. The upper interconnection structure includes an upper interconnection and an upper barrier layer. The lower interconnection structure includes a lower interconnection and a lower barrier layer. The upper barrier layer is under a bottom surface of the upper interconnection and does not cover side surfaces of the upper interconnection. The lower barrier layer is under a bottom surface of the lower interconnection and covers side surfaces of the lower interconnection.
摘要翻译：半导体器件包括在半导体衬底上的半导体图案，半导体图案上的三维存储器阵列以及半导体图案和半导体衬底之间的外围互连结构。外围互连结构包括在较低互连结构上的上互连结构。上互连结构包括上互连和上阻挡层。下部互连结构包括下部互连和下部阻挡层。上阻挡层在上互连的底表面下方并且不覆盖上互连的侧表面。下阻挡层在下互连的底表面下方并且覆盖下互连的侧表面。

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