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    • 1. 发明授权
    • Dynamic output buffer circuit
    • 动态输出缓冲电路
    • US07538573B2
    • 2009-05-26
    • US11705251
    • 2007-02-12
    • Jae-kwan KimJoo-sun Choi
    • Jae-kwan KimJoo-sun Choi
    • H03K17/16
    • H03K19/0005H04L25/0278H04L25/0288
    • A dynamic output buffer circuit performs an impedance matching function and a pre-emphasis function by using input and output signals, and consumes relatively less power, occupies a relatively smaller layout area, and dynamically varies an output impedance. The dynamic output buffer circuit dynamically matches an output impedance to the characteristic impedance of a metal line connected to an external circuit, pre-emphasizes at least one input signal, and includes a control circuit and an output circuit. The control circuit matches the output impedance of the dynamic output circuit to the characteristic impedance of the metal line in response to at least one output signal, and outputs a plurality of resistor control signals which are used to pre-emphasize at least one input signal in response to the input signal. The output circuit controls the output impedance and pre-emphasizes the input signal in response to the resistor control signals, and outputs the output signal.
    • 动态输出缓冲电路通过使用输入和输出信号来执行阻抗匹配功能和预加重功能,并且消耗相对较小的功率,占据相对较小的布局面积,并且动态地改变输出阻抗。 动态输出缓冲电路将输出阻抗与连接到外部电路的金属线的特性阻抗动态匹配,预先强调至少一个输入信号,并且包括控制电路和输出电路。 响应于至少一个输出信号,控制电路将动态输出电路的输出阻抗与金属线的特性阻抗相匹配,并输出多个电阻控制信号,用于预先强调至少一个输入信号 响应输入信号。 输出电路控制输出阻抗,并响应于电阻控制信号预加强输入信号,并输出输出信号。
    • 2. 发明申请
    • Dynamic output buffer circuit
    • 动态输出缓冲电路
    • US20070200592A1
    • 2007-08-30
    • US11705251
    • 2007-02-12
    • Jae-Kwan KimJoo-sun Choi
    • Jae-Kwan KimJoo-sun Choi
    • H03K19/003
    • H03K19/0005H04L25/0278H04L25/0288
    • A dynamic output buffer circuit performs an impedance matching function and a pre-emphasis function by using input and output signals, and consumes relatively less power, occupies a relatively smaller layout area, and dynamically varies an output impedance. The dynamic output buffer circuit dynamically matches an output impedance to the characteristic impedance of a metal line connected to an external circuit, pre-emphasizes at least one input signal, and includes a control circuit and an output circuit. The control circuit matches the output impedance of the dynamic output circuit to the characteristic impedance of the metal line in response to at least one output signal, and outputs a plurality of resistor control signals which are used to pre-emphasize at least one input signal in response to the input signal. The output circuit controls the output impedance and pre-emphasizes the input signal in response to the resistor control signals, and outputs the output signal.
    • 动态输出缓冲电路通过使用输入和输出信号来执行阻抗匹配功能和预加重功能,并且消耗相对较少的功率,占据相对较小的布局面积,并且动态地改变输出阻抗。 动态输出缓冲电路将输出阻抗与连接到外部电路的金属线的特性阻抗动态匹配,预先强调至少一个输入信号,并且包括控制电路和输出电路。 响应于至少一个输出信号,控制电路将动态输出电路的输出阻抗与金属线的特性阻抗相匹配,并输出多个电阻控制信号,用于预先强调至少一个输入信号 响应输入信号。 输出电路控制输出阻抗,并响应于电阻控制信号预加强输入信号,并输出输出信号。
    • 4. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US08885380B2
    • 2014-11-11
    • US13209026
    • 2011-08-12
    • Uk-song KangYoung-hyun JunJoo-sun Choi
    • Uk-song KangYoung-hyun JunJoo-sun Choi
    • G11C5/02H01L25/18G11C7/10
    • H01L25/18G11C5/02G11C7/10H01L2224/48091H01L2225/06544H01L2924/00014
    • A semiconductor package is disclosed. The semiconductor package includes a package interface, a stack of semiconductor chips, a plurality of stacks of through substrate vias, and an interface circuit. The package interface includes at least a first pair of terminals. Each stack of through substrate vias includes plural through substrate vias of respective ones of the semiconductor chips, each through substrate via electrically connected to a through substrate via of an immediately adjacent semiconductor chip. The interface circuit includes an input connected to the first pair of terminals to receive a differential signal providing first information, and includes an output to provide an output signal including the first information in a single-ended signal format to at least one of the plurality of stacks of through substrate vias.
    • 公开了半导体封装。 半导体封装包括封装接口,半导体芯片堆叠,多个通过衬底通孔的堆叠以及接口电路。 封装接口包括至少第一对端子。 每个通过衬底通孔的堆叠包括相应的半导体芯片的多个通过衬底通孔,每个穿过衬底经由电连接到直接相邻的半导体芯片的贯穿衬底通孔。 接口电路包括连接到第一对终端的输入端,以接收提供第一信息的差分信号,并且包括输出,以将包括单端信号格式的第一信息的输出信号提供给多个 通过衬底通孔的堆叠。
    • 5. 发明授权
    • Input/output (IO) interface and method of transmitting IO data
    • 输入/输出(IO)接口和传输IO数据的方法
    • US07986251B2
    • 2011-07-26
    • US12547204
    • 2009-08-25
    • Seung-jun BaeYoung-hyun JunJoo-sun ChoiKwang-il ParkSang-hyup Kwak
    • Seung-jun BaeYoung-hyun JunJoo-sun ChoiKwang-il ParkSang-hyup Kwak
    • H03M5/00
    • H03M5/06G11C7/1006
    • An input/output (IO) interface includes a data encoder which encodes each of a plurality of pieces of parallel data having different timings and generates a plurality of pieces of encoded data, and an alternating current (AC) coupling transmission unit which transmits the plurality of encoded data in an AC coupling method. The data encoder compares first parallel data with second parallel data from among the plurality of pieces of parallel data on a bit-by-bit basis and obtains the number of bits whose logic states have transited between the first parallel data and the second parallel data. When the number of bits whose logic states have transited is greater than or equal to a reference number of bits, the data encoder inverts bit values of the second parallel data to generate the encoded data. When the number of bits whose logic states have transited is less than the reference number of bits, the data encoder maintains the bit values of the second parallel data to generate the encoded data.
    • 输入/输出(IO)接口包括数据编码器,其对具有不同定时的多条并行数据中的每一条进行编码并产生多条编码数据;以及交流(AC)耦合传输单元,其传输多个 的交流耦合方法中的编码数据。 数据编码器在逐位的基础上将第一并行数据与多条并行数据中的第二并行数据进行比较,并且获得其逻辑状态已经在第一并行数据和第二并行数据之间转移的位数。 当逻辑状态已经转移的位数大于或等于参考位数时,数据编码器反转第二并行数据的位值,以产生编码数据。 当逻辑状态已经转移的位数小于参考位数时,数据编码器维持第二并行数据的位值以产生编码数据。
    • 8. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20120059984A1
    • 2012-03-08
    • US13209026
    • 2011-08-12
    • Uk-song KangYoung-hyun JunJoo-sun Choi
    • Uk-song KangYoung-hyun JunJoo-sun Choi
    • G06F12/10G11C7/00H01L23/48
    • H01L25/18G11C5/02G11C7/10H01L2224/48091H01L2225/06544H01L2924/00014
    • A semiconductor package is disclosed. The semiconductor package includes a package interface, a stack of semiconductor chips, a plurality of stacks of through substrate vias, and an interface circuit. The package interface includes at least a first pair of terminals. Each stack of through substrate vias includes plural through substrate vias of respective ones of the semiconductor chips, each through substrate via electrically connected to a through substrate via of an immediately adjacent semiconductor chip. The interface circuit includes an input connected to the first pair of terminals to receive a differential signal providing first information, and includes an output to provide an output signal including the first information in a single-ended signal format to at least one of the plurality of stacks of through substrate vias.
    • 公开了半导体封装。 半导体封装包括封装接口,半导体芯片堆叠,多个通过衬底通孔的堆叠以及接口电路。 封装接口包括至少第一对端子。 每个通过衬底通孔的堆叠包括相应的半导体芯片的多个通过衬底通孔,每个穿过衬底经由电连接到直接相邻的半导体芯片的贯穿衬底通孔。 接口电路包括连接到第一对终端的输入端,以接收提供第一信息的差分信号,并且包括输出,以将包括单端信号格式的第一信息的输出信号提供给多个 通过衬底通孔的堆叠。