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1. 发明申请

US20070134834A1 Method of manufacturing vertical gallium nitride based light emitting diode 有权
标题翻译：制造垂直氮化镓基发光二极管的方法
公开(公告)号：US20070134834A1
公开(公告)日：2007-06-14
申请号：US11634106
申请日：2006-12-06
申请人： Jae Lee , Jung Lee , Hyun Cho , Dae Kim , Jae Ro
发明人： Jae Lee , Jung Lee , Hyun Cho , Dae Kim , Jae Ro
IPC分类号： H01L21/20
CPC分类号： H01L33/007 , H01L21/02381 , H01L21/02458 , H01L21/0254 , H01L33/22
摘要： A method of manufacturing a vertical GaN-based LED includes forming a nitride-based buffer layer on a silicon substrate; sequentially forming a p-type GaN layer, an active layer, and an n-type GaN layer on the nitride-based buffer layer; forming an n-electrode on the n-type GaN layer; forming a plating seed layer on the n-electrode; forming a structure supporting layer on the plating seed layer; removing the silicon substrate through wet etching and forming roughness on the surface of the p-type GaN layer through over-etching; and forming a p-electrode on the p-type GaN layer having the roughness formed.
摘要翻译：制造垂直GaN基LED的方法包括在硅衬底上形成氮化物基缓冲层; 在氮化物基缓冲层上依次形成p型GaN层，有源层和n型GaN层; 在n型GaN层上形成n电极; 在n电极上形成电镀种子层; 在电镀种子层上形成结构支撑层; 通过湿蚀刻去除硅衬底，并通过过蚀刻在p型GaN层的表面上形成粗糙度; 在形成有粗糙度的p型GaN层上形成p电极。

2. 发明申请

US20080058107A1 Tripod Type Constant Velocity Joint 有权
标题翻译：三脚架型恒速接头
公开(公告)号：US20080058107A1
公开(公告)日：2008-03-06
申请号：US11927601
申请日：2007-10-29
申请人： Jeong Hyun Cho , Dae Kim , In Lee , Joung Park , Sung An , Seung Shin , Hwan Kang
发明人： Jeong Hyun Cho , Dae Kim , In Lee , Joung Park , Sung An , Seung Shin , Hwan Kang
IPC分类号： F16D3/26
CPC分类号： F16D3/2055 , F16D2003/2026 , Y10S464/905
摘要： A tripod type constant velocity joint comprises a housing having three track grooves which are defined at trisected positions of the housing along a circumferential direction and extend in a radial direction; a spider having three polyhedral trunnions which are projectedly formed at trisected positions of the spider along the circumferential direction to be respectively inserted into the track grooves and each of which has at least two polygonal surfaces; inner rollers a circumferential inner surface of each of which has a curved contour for surrounding the polyhedral trunnion; a plurality of needle rollers assembled to a circumferential outer surface of each inner roller; and outer rollers each formed to be rotated through the needle rollers, to be moved in an axial direction of the inner roller, and to be moved in an axial direction of the track groove along a guide surface of the housing.
摘要翻译：三脚架式等速万向节包括具有三个轨道槽的壳体，其沿着圆周方向限定在壳体的三维位置处并沿径向方向延伸; 具有三个多面耳轴的蜘蛛，其沿着圆周方向突出地形成在所述蜘蛛的三分位置处，以分别插入到所述轨道槽中，并且每个具有至少两个多边形表面; 内滚子，其每个的周向内表面具有用于围绕多面耳轴的弯曲轮廓; 组装到每个内辊的周向外表面上的多个滚针; 以及外辊，每一个都形成为通过滚针旋转，沿着内辊的轴向移动，并且沿着壳体的引导表面在轨道槽的轴向方向上移动。

3. 发明申请

US20050254310A1 Nonvolatile semiconductor memory device including ferroelectric semiconductor pattern and methods for writing data in and reading data from the same 审中-公开
标题翻译：包括铁电半导体图案的非易失性半导体存储器件以及用于将数据写入数据并从其读取数据的方法
公开(公告)号：US20050254310A1
公开(公告)日：2005-11-17
申请号：US11120499
申请日：2005-05-03
申请人： Jae Lee , De Fu , Tae Kang , Seung Lee , Yoo Heo , Dae Kim , Ju Lee , Dong Lee
发明人： Jae Lee , De Fu , Tae Kang , Seung Lee , Yoo Heo , Dae Kim , Ju Lee , Dong Lee
IPC分类号： H01L27/105 , G11C5/00 , G11C11/22
CPC分类号： G11C11/22
摘要： Provided are a nonvolatile semiconductor memory device including ferroelectric semiconductor patterns in respective memory cells and methods of writing and reading data. The device includes a substrate; a plurality of first conductive lines disposed in or on the substrate; a plurality of second conductive lines disposed in or on the substrate and having a different height from the first conductive lines, wherein the second conductive lines intersect the first conductive lines, respectively, to define a plurality of intersection regions; and a plurality of memory cells disposed on the substrate. Herein, the memory cells include ferroelectric semiconductor patterns, respectively, which are disposed between the first conductive lines and the second conductive lines that define the intersection regions.
摘要翻译：提供了在各个存储单元中包括铁电半导体图案的非易失性半导体存储器件以及写入和读取数据的方法。该装置包括基板; 设置在所述基板中或所述基板上的多个第一导线; 多个第二导电线设置在基板中或基板上，并且具有与第一导线不同的高度，其中第二导线分别与第一导线相交以限定多个交叉区域; 以及设置在基板上的多个存储单元。这里，存储单元包括分别设置在限定交叉区域的第一导线和第二导线之间的铁电半导体图案。

4. 发明申请

US20060154531A1 Crosstalk canceling pattern for high-speed communications and modular jack having the same 有权
标题翻译：具有相同的高速通信和模块化插座的串扰消除模式
公开(公告)号：US20060154531A1
公开(公告)日：2006-07-13
申请号：US11327897
申请日：2006-01-09
申请人： Dae Kim , Jung Kim , Jung Lee , Su Jong Kim
发明人： Dae Kim , Jung Kim , Jung Lee , Su Jong Kim
IPC分类号： H01R13/66 , H01R24/00
CPC分类号： H01R13/6466 , H01R13/6473 , H01R13/6658 , H01R24/64 , H05K1/0228 , H05K1/162 , H05K2201/09236 , H05K2201/10189 , Y10S439/941
摘要： Disclosed herein are a crosstalk canceling pattern for high-speed communications and a modular jack having the same, which includes a compensating capacitor on a transmission line to cancel crosstalk due to parasitic capacitance generated between neighboring insert pins, and includes a second compensating capacitor to correct phase mismatch due to parasitic inductance generated in insert pins and transmission lines, when a high-frequency signal is applied. The modular jack having the crosstalk canceling pattern for high-speed communications includes a housing, a printed circuit board, a lower contact block, and an upper contact block. The hosing includes a plug insert hole, an insert pin locking plate, and a coupling guide part. The printed circuit board is a multi-layered structure having a plurality of compensating capacitors. The lower contact block is mounted to the lower surface of the printed circuit board. The upper contact block is mounted to the upper portion of the lower contact block, and divides UTP cable wires to be connected to IDC terminals.
摘要翻译：本文公开了一种用于高速通信的串扰消除模式和具有该串扰消除模式的模块插座，其包括在传输线上的补偿电容器，以消除由于相邻插入引脚之间产生的寄生电容引起的串扰，并且包括用于校正的第二补偿电容器当施加高频信号时，由插入引脚和传输线中产生的寄生电感引起的相位失配。具有用于高速通信的串扰消除模式的模块化插座包括壳体，印刷电路板，下接触块和上接触块。该套筒包括插头插入孔，插入销锁定板和联接引导件。印刷电路板是具有多个补偿电容器的多层结构。下接触块安装到印刷电路板的下表面。上接触块安装到下接触块的上部，并将UTP电缆线分成要连接到IDC端子。

5. 发明申请

US20070082813A1 Catalyst for preparation of pentafluoroethane and preparation method thereof 有权
标题翻译：五氟乙烷制备催化剂及其制备方法
公开(公告)号：US20070082813A1
公开(公告)日：2007-04-12
申请号：US11288486
申请日：2005-11-30
申请人： Hyang Jang , Dae Kim , Cheol Kim , Young Cho , Jung Lee , Young Kim , Yuichi Iikubo
发明人： Hyang Jang , Dae Kim , Cheol Kim , Young Cho , Jung Lee , Young Kim , Yuichi Iikubo
IPC分类号： B01J23/00
CPC分类号： B01J23/26 , B01J23/28 , B01J23/862 , B01J37/08 , B01J37/26 , C07C17/206 , C07C17/21 , C07C19/08
摘要： The method of preparing a chromium oxide catalyst for preparation of pentafluoroethane using a chloroethane compound includes heat treating chromium hydroxide powder at a temperature not higher than 300° C. to obtain chromium oxide powder, heat treating metal hydroxide, at a temperature not higher than 300° C. to obtain metal oxide powder, mixing 85-99.5 wt % of the chromium oxide powder with 0.5-15 wt % of the metal oxide powder to obtain a mixture, forming the mixture into a pellet, calcining the pellet at 200-300° C. using nitrogen gas, and fluorinating the pellet at 300-320° C. using a gas mixture including N2 and HF, and then at 320-380° C. using HF gas. The fluorination catalyst prepared using the method of this invention can be effectively used to prepare pentafluoroethane at a high yield using a chloroethane compound.
摘要翻译：使用氯乙烷化合物制备五氟乙烷的氧化铬催化剂的方法包括在不高于300℃的温度下热处理氢氧化铬粉末，得到不高于300℃的氧化铬粉末，热处理金属氢氧化物 ℃，得到金属氧化物粉末，将85-99.5重量％的氧化铬粉末与0.5-15重量％的金属氧化物粉末混合以获得混合物，将混合物形成颗粒，在200-300℃下煅烧沉淀 ℃，并使用包含N 2 H 2和HF的气体混合物，然后在320-380℃下使用HF气体在300-320℃氟化颗粒。使用本发明的方法制备的氟化催化剂可以有效地用于使用氯乙烷化合物以高产率制备五氟乙烷。

6. 发明申请

US20060151716A1 Micro-column electron beam apparatus 失效
标题翻译：微柱电子束装置
公开(公告)号：US20060151716A1
公开(公告)日：2006-07-13
申请号：US11257244
申请日：2005-10-24
申请人： Sang Choi , Dae Kim , Jin Jeong , Dae Kim
发明人： Sang Choi , Dae Kim , Jin Jeong , Dae Kim
IPC分类号： G21G5/00
CPC分类号： H01J37/067 , B82Y10/00 , B82Y40/00 , H01J37/3177 , H01J2237/1205 , H01J2237/1502 , H01J2237/2818
摘要： Provided is a micro-column electron beam apparatus including: a base; an electron lens bracket on which an electron lens modulate can be fixed, mounted in a central portion of the base; an electron beam source tip module vertically disposed on the electron lens module; a pan spring plate stage module that is mounted over the base, supports the electron beam source tip module at a central portion thereof, and includes a three-coupling pan spring plate portion including first through third spring units that are coupled to the electron beam source tip module in three directions on a plane perpendicular to the vertical axis, which vertically passes the center of the electron beam source tip module, to elastically support the electron beam source tip module in three directions; a first piezoelectric actuator coupled to the pan spring plate stage module to move the electron beam source tip module along a first axis perpendicular to the vertical axis; and a second piezoelectric actuator coupled to the pan spring plate stage module to move the electron beam source tip module along a second axis perpendicular to the vertical axis and the first axis.
摘要翻译：本发明提供一种微柱电子束装置，包括：基底; 可以固定电子透镜调制的电子透镜支架，安装在基座的中心部分; 垂直设置在电子透镜模块上的电子束源头模块; 安装在基座上方的平板弹簧板台模块在其中心部分处支撑电子束源头模块，并且包括三联盘盘弹簧板部分，其包括耦合到电子束源的第一至第三弹簧单元尖端模块在垂直于垂直轴线的平面上垂直通过电子束源头模块的中心，在三个方向弹性支撑电子束源头模块; 第一压电致动器，其联接到所述盘簧板模块以沿着垂直于所述垂直轴线的第一轴线移动所述电子束源尖端模块; 以及耦合到盘簧级模块的第二压电致动器，用于沿垂直于垂直轴线和第一轴线的第二轴线移动电子束源尖端模块。

7. 发明申请

US20060131752A1 Micro column electron beam apparatus formed in low temperature co-fired ceramic substrate 失效
标题翻译：微柱电子束装置形成于低温共烧陶瓷基片中
公开(公告)号：US20060131752A1
公开(公告)日：2006-06-22
申请号：US11260025
申请日：2005-10-24
申请人： Dae Kim , Jin Jeong , Sang Choi , Dae Kim , Ho Kim
发明人： Dae Kim , Jin Jeong , Sang Choi , Dae Kim , Ho Kim
IPC分类号： H01L23/52
CPC分类号： H01J37/3177 , B82Y10/00 , B82Y40/00 , H01J37/1477 , H01J2237/03 , H01J2237/1205
摘要： A micro column electron beam apparatus having a reduced number of interconnections is provided. The micro column electron beam apparatus includes: a low temperature co-fired ceramic (LTCC) substrate; a plurality of deflector electrodes attached to a predetermined top portion of the LTCC substrate; a pad electrode placed at a top edge of the LTCC substrate and transmitting an external signal to the deflector electrodes; and a connection unit placed in the LTCC substrate and electrically connecting the deflector electrode and the pad electrode.
摘要翻译：提供了具有减少数量的互连的微型列电子束装置。微柱电子束装置包括：低温共烧陶瓷（LTCC）基板; 多个偏转器电极，附着到LTCC衬底的预定顶部; 放置在LTCC衬底的顶部边缘处并将外部信号传输到偏转器电极的焊盘电极; 以及连接单元，其放置在LTCC基板中并电连接偏转器电极和焊盘电极。

8. 发明申请

US20060131996A1 Micro stage using piezoelectric element 有权
标题翻译：微电极采用压电元件
公开(公告)号：US20060131996A1
公开(公告)日：2006-06-22
申请号：US11231471
申请日：2005-09-20
申请人： Sang Choi , Dae Kim , Jin Jeong , Dae Kim
发明人： Sang Choi , Dae Kim , Jin Jeong , Dae Kim
IPC分类号： H02N2/00
CPC分类号： H02N2/028 , H01J2237/20264
摘要： Provided is a micro stage comprising: a body having a vertically perforated through-hole passing through a central portion thereof; a bobbin including a tip portion with an electron emission tip embedded in the center thereof, and passing through the through-hole of the body to be moved in the through-hole along a first axis perpendicular to a vertical direction; a first piezoelectric element disposed on the body and lengthened when a voltage is applied thereto to push the bobbin in one direction along the first axis; a second piezoelectric element disposed on the body and lengthened when a voltage is applied thereto to push the bobbin in the other direction along the first axis; and an upper cover that is coupled to an upper portion of the body and has a through-hole, through which the bobbin passes and communicates with the through-hole of the body, wherein the bobbin can be positioned as desired along the first axis by adjusting the voltages applied to the first piezoelectric element and the second piezoelectric element. Accordingly, the emission tip can be exactly and stably positioned using only the movable piezoelectric elements.
摘要翻译：提供了一种微型台，包括：主体，其具有穿过其中心部分的垂直穿孔的通孔; 线轴，其包括具有嵌入其中心的电子发射尖端的尖端部分，并沿着垂直于垂直方向的第一轴线穿过所述通孔的待通孔; 第一压电元件，其设置在所述主体上，并且当施加电压时被延长以沿着所述第一轴线沿一个方向推动所述线轴; 第二压电元件，其设置在所述主体上并且当施加电压时被延长以沿着所述第一轴线沿另一方向推动所述线轴; 以及上盖，其联接到所述主体的上部并且具有通孔，所述筒管通过所述通孔，所述通孔与所述主体的所述通孔连通，其中所述线轴可根据需要沿着所述第一轴由调整施加到第一压电元件和第二压电元件的电压。因此，可以仅使用可动压电元件来精确且稳定地定位发射尖端。

9. 发明申请

US20060131698A1 Wafer-scale microcolumn array using low temperature co-fired ceramic substrate 失效
公开(公告)号：US20060131698A1
公开(公告)日：2006-06-22
申请号：US11259959
申请日：2005-10-24
申请人： Jin Jeong , Dae Kim , Sang Choi , Dae Kim , Ho Kim
发明人： Jin Jeong , Dae Kim , Sang Choi , Dae Kim , Ho Kim
IPC分类号： H01L23/544
CPC分类号： H01J37/3177 , B82Y10/00 , B82Y40/00 , H01J37/04 , H01J2237/0492 , H01J2237/1205 , H01J2237/1518
摘要： Provided is a wafer-scale microcolumn array using a low temperature co-fired ceramic (LTCC) substrate. The microcolumn array includes a LTCC substrate having wirings and wafer-scale beam deflector arrays, which are attached to at least one side of the LTCC substrate and has an array of deflection devices deflecting electron beams. The wafer-scale microcolumn array using the LTCC substrate makes it possible to significantly increase the throughput of semiconductor wafers, simplify its manufacturing process, and lower its production cost.

10. 发明申请

US20080026695A1 Method and system for transmitting voice data by using wireless LAN and bluetooth 审中-公开
标题翻译：使用无线局域网和蓝牙传输语音数据的方法和系统
公开(公告)号：US20080026695A1
公开(公告)日：2008-01-31
申请号：US11878938
申请日：2007-07-27
申请人： Hyo Choi , Jin Jeon , Dae Kim , Kyeongho Lee , Sang Shim , Won Song
发明人： Hyo Choi , Jin Jeon , Dae Kim , Kyeongho Lee , Sang Shim , Won Song
IPC分类号： H04B7/00 , H04Q7/20
CPC分类号： H04W16/14 , H04W88/06 , H04W88/10
摘要： Embodiments of methods and systems of the application can transmit data (e.g., voice) using a wireless LAN and a Bluetooth. One system embodiment can include a terminal device, an AP (access point) for communicating with the terminal device according to a first (e.g., wireless LAN) protocol by using a first frequency band among multiple frequency bands of a prescribed frequency band (e.g., ISM frequency band) and a headset for communicating with the terminal device according to a second (e.g., Bluetooth) protocol by using at least one frequency band of remaining frequency bands by excepting the first frequency band.
摘要翻译：应用的方法和系统的实施例可以使用无线LAN和蓝牙传输数据（例如，语音）。一个系统实施例可以包括终端设备，用于根据第一（例如无线LAN）协议与终端设备进行通信的AP（接入点），该协议通过使用规定频带的多个频带中的第一频带（例如， ISM频带）和耳机，用于通过除了第一频带之外使用剩余频带的至少一个频带，根据第二（例如，蓝牙）协议与终端设备进行通信。

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