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    • 1. 发明授权
    • Method and apparatus for self-regulated burn-in of an integrated circuit
    • 集成电路自调节老化的方法和装置
    • US08212576B1
    • 2012-07-03
    • US12606101
    • 2009-10-26
    • Jae ChoGlenn O'RourkeMichael M. MateraJongheon Jeong
    • Jae ChoGlenn O'RourkeMichael M. MateraJongheon Jeong
    • G01R31/00
    • G01R31/2856
    • Method and apparatus for self-regulated burn-in of an integrated circuit (IC) is described. One embodiment of a method of burn-in for the IC includes: configuring programmable resources of the IC device based on a burn-in pattern to implement a load controller, the load controller having a plurality of heat core circuits. The load controller is initialized with a number of enabled heat core circuits of the plurality of heat core circuits. A junction temperature is measured in the IC device after a measurement period has elapsed. The junction temperature is compared with a set-point temperature. The number of the enabled heat core circuits is increased if the junction temperature is less than the set-point temperature, or the number of the enabled heat core circuits is decreased if the junction temperature is greater than the set-point temperature.
    • 描述了用于集成电路(IC)的自调节老化的方法和装置。 IC的老化方法的一个实施例包括:基于老化模式配置IC器件的可编程资源以实现负载控制器,所述负载控制器具有多个热芯电路。 负载控制器通过多个加热芯电路的多个使能的加热芯电路进行初始化。 在测量周期过后,在IC器件中测量结温。 结温与设定点温度进行比较。 如果结温低于设定点温度,则可使加热芯电路的数量增加,或者如果结温高于设定点温度,则可使热芯电路的数量减少。
    • 6. 发明授权
    • Non-volatile memory array using gate breakdown structures
    • 使用门击穿结构的非易失性存储器阵列
    • US06522582B1
    • 2003-02-18
    • US09553571
    • 2000-04-19
    • Kameswara K. RaoMartin L. VoogelJames KarpShahin ToutounchiMichael J. HartDaniel GitlinKevin T. LookJongheon JeongRadko G. Bankras
    • Kameswara K. RaoMartin L. VoogelJames KarpShahin ToutounchiMichael J. HartDaniel GitlinKevin T. LookJongheon JeongRadko G. Bankras
    • G11C1400
    • G11C16/08
    • Memory cell structures and related circuitry for use in non-volatile memory devices are described. The cell structures can be fabricated utilizing standard CMOS processes, e.g. sub 0.35 micron or sub 0.25 micron processes. Preferably, the cell structures can be fabricated using 0.18 micron or 0.15 micron standard CMOS processes. Advantageously, the cell structures can be programmed so that a conductive path is formed between like type materials. For example, in certain cell structures a cell is programmed by applying a programming voltage in such a way as to form a conductive path between a p-type gate and a p-type source/drain region or an n-type gate and an n-type source/drain region. Programming cells in this manner advantageously provides a programmed cell having a low, linear resistance after programming. In addition, novel charge pump circuits are provided that, in a preferred embodiment, are located “on chip” with an array of memory cells. These charge pump circuits are preferably fabricated utilizing the same standard CMOS processing techniques that were utilized to form the memory cell structures and related circuitry.
    • 描述了用于非易失性存储器件的存储单元结构和相关电路。 可以使用标准CMOS工艺制造电池结构,例如 次0.35微米或次级0.25微米工艺。 优选地,可以使用0.18微米或0.15微米标准CMOS工艺制造电池结构。 有利地,电池结构可以被编程,使得在相似类型的材料之间形成导电路径。 例如,在某些单元结构中,通过施加编程电压来编程单元,以便在p型栅极和p型源极/漏极区域或n型栅极和n型栅极之间形成导电路径 型源极/漏极区域。 以这种方式编程单元有利地在编程之后提供具有低线性电阻的编程单元。 此外,提供了新颖的电荷泵电路,在优选实施例中,它们以“存储器”阵列位于芯片上。 这些电荷泵电路优选地利用用于形成存储器单元结构和相关电路的相同的标准CMOS处理技术来制造。