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1. 发明授权

US06747261B1 Image sensor having shortened wires 失效
标题翻译：图像传感器具有缩短的电线
公开(公告)号：US06747261B1
公开(公告)日：2004-06-08
申请号：US10340333
申请日：2003-01-09
申请人： Jackson Hsieh , Jichen Wu , Bruce Chen , Jack Chuang
发明人： Jackson Hsieh , Jichen Wu , Bruce Chen , Jack Chuang
IPC分类号： H01L2348
CPC分类号： H01L31/0203 , H01L23/49861 , H01L27/14601 , H01L2224/16245
摘要： An image sensor having shortened wires. The image sensor includes a substrate composed of metal sheets arranged in a matrix, a photosensitive chip, bonding pads on the chip, a frame layer, wires and a transparent layer placed on the frame layer. Each metal sheet has a first board and a second board. A chamber is defined under the substrate to accommodate the chip. Each pad is arranged between first boards. The frame layer is formed on a periphery and the bottom surface to encapsulate the chip. The bottom faces of the second boards are electrically connected to a printed circuit board. Each wire has a first terminal and a second terminal. The first terminals are electrically connected to the pads, and the second terminals are electrically connected to the first boards, respectively.
摘要翻译：具有缩短电线的图像传感器。图像传感器包括由矩阵状的金属板构成的基板，感光芯片，芯片上的接合焊盘，框架层，布线和布置在框架层上的透明层。每个金属板具有第一板和第二板。在基底下方限定一个腔室以容纳芯片。每个垫布置在第一板之间。框架层形成在周边和底面上以封装芯片。第二板的底面电连接到印刷电路板。每条线具有第一端子和第二端子。第一端子电连接到焊盘，并且第二端子分别电连接到第一板。

2. 发明申请

US20050077607A1 Small memory card 有权
标题翻译：小存储卡
公开(公告)号：US20050077607A1
公开(公告)日：2005-04-14
申请号：US10683837
申请日：2003-10-09
申请人： Jackson Hsieh , Jichen Wu , Worrell Tsai , Bruce Chen
发明人： Jackson Hsieh , Jichen Wu , Worrell Tsai , Bruce Chen
IPC分类号： H01L23/13 , H01L23/31 , H01L25/065 , H01L23/02 , H01L23/34
CPC分类号： H01L23/3107 , H01L23/13 , H01L24/48 , H01L25/0655 , H01L2224/06136 , H01L2224/48091 , H01L2224/4824 , H01L2924/00014 , H01L2924/14 , H01L2924/18165 , H01L2924/19041 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A small memory card includes a substrate, a plurality of memory chips, a plurality of wires, and a glue layer, the substrate is formed with a plurality of through slots, then the plurality of memory chips be mounted on the substrate, so that the plurality of bounding pads of the memory chip from through slot may be revealed, and use a plurality of wires electrically connecting to the substrate, finally use the glue layer encapsulating a plurality of memory chips at the same time. Thus, the small memory card of present invention has small packed volume, and the manufacturing processes may be convenient.
摘要翻译：小型存储卡包括基板，多个存储芯片，多根导线和胶合层，基板形成有多个通孔，然后将多个存储芯片安装在基板上，可以显示从通槽的存储芯片的多个边界焊盘，并且使用电连接到基板的多根电线，最后同时使用封装多个存储芯片的胶层。因此，本发明的小存储卡具有小的封装体积，并且制造工艺可以是方便的。

3. 发明授权

US06680525B1 Stacked structure of an image sensor 失效
标题翻译：图像传感器的堆叠结构
公开(公告)号：US06680525B1
公开(公告)日：2004-01-20
申请号：US10340251
申请日：2003-01-09
申请人： Jackson Hsieh , Jichen Wu , Bruce Chen
发明人： Jackson Hsieh , Jichen Wu , Bruce Chen
IPC分类号： H01L2302
CPC分类号： H01L31/0203 , H01L27/14618 , H01L2224/48247 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014
摘要： An image sensor to be mounted to a printed circuit board. The module includes a substrate, an integrated circuit, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate is composed of metal sheets arranged in a matrix, and a middle board positioned in a central region surrounded by the metal sheets. Each metal sheet has a first board and a second board connected to the printed circuit board. A slot is formed under the substrate. The integrated circuit is arranged within the slot and electrically connected to the substrate. The chip is placed on the middle board. The wires electrically connect the first boards, to the chip. The transparent layer is placed on the frame layer to cover the chip.
摘要翻译：要安装到印刷电路板的图像传感器。该模块包括基板，集成电路，框架层，感光芯片，多根导线和透明层。基板由布置成矩阵状的金属板和位于由金属板包围的中央区域的中间板构成。每个金属片具有连接到印刷电路板的第一板和第二板。在基底下方形成槽。集成电路布置在槽内并与衬底电连接。芯片放在中间板上。电线将第一板电连接到芯片。透明层被放置在框架层上以覆盖芯片。

4. 发明授权

US07126219B2 Small memory card 有权
标题翻译：小存储卡
公开(公告)号：US07126219B2
公开(公告)日：2006-10-24
申请号：US10683837
申请日：2003-10-09
申请人： Jackson Hsieh , Jichen Wu , Worrell Tsai , Bruce Chen
发明人： Jackson Hsieh , Jichen Wu , Worrell Tsai , Bruce Chen
IPC分类号： H01L23/02
CPC分类号： H01L23/3107 , H01L23/13 , H01L24/48 , H01L25/0655 , H01L2224/06136 , H01L2224/48091 , H01L2224/4824 , H01L2924/00014 , H01L2924/14 , H01L2924/18165 , H01L2924/19041 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A small memory card includes a substrate, a plurality of memory chips, a plurality of wires, and a glue layer, the substrate is formed with a plurality of through slots of the substrate, then the plurality of memory chips are mounted on the substrate, so that the plurality of bounding pads of the memory chip are exposed from through slot, the plurality of wires are electrically connected to the substrate, the glue layer is encapsulated the plurality of memory chips at the same time. Thus, the small memory card of present invention has small packed volume, and the manufacturing processes may be convenient.
摘要翻译：小型存储卡包括基板，多个存储芯片，多根导线和胶合层，基板形成有基板的多个通孔，然后将多个存储芯片安装在基板上，使得存储芯片的多个边界焊盘从通孔露出，多条电线电连接到基板上，胶层同时封装多个存储芯片。因此，本发明的小存储卡具有小的封装体积，并且制造工艺可以是方便的。

5. 发明授权

US06878917B2 Injection molded image sensor and a method for manufacturing the same 失效
标题翻译：注射成型图像传感器及其制造方法
公开(公告)号：US06878917B2
公开(公告)日：2005-04-12
申请号：US10321926
申请日：2002-12-16
申请人： Jackson Hsieh , Jichen Wu , Bruce Chen , Worrell Tsai
发明人： Jackson Hsieh , Jichen Wu , Bruce Chen , Worrell Tsai
IPC分类号： H01L27/00 , H01L27/146
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board and a third board to form a -shaped structure. The molded structure encapsulates the metal sheets by way of injection molding and has a first molded body and a second molded body. The injection molded structure has a U-shaped structure and is formed with a cavity. The first boards are partially encapsulated by the first molded body. The second and third boards are exposed from bottom and side surfaces of the first molded body. The chip is mounted within the cavity. The pads are formed on the chip. The wires electrically connect the pads to input terminals of the first boards. The transparent layer covers over the first molded body to encapsulate the chip.
摘要翻译：注塑图像传感器包括以矩阵形式布置的金属片，注射成型结构，感光芯片，接合焊盘，电线和透明层。每个金属片具有第一板，第二板和第三板以形成形结构。模制结构体通过注射成型封装金属片，并具有第一成型体和第二成型体。注塑结构具有U形结构并且形成有空腔。第一板被第一成型体部分封装。第二和第三板从第一成型体的底表面和侧表面露出。芯片安装在腔内。焊盘形成在芯片上。电线将焊盘电连接到第一板的输入端。透明层覆盖第一成型体上以封装芯片。

6. 发明授权

US06649834B1 Injection molded image sensor and a method for manufacturing the same 有权
标题翻译：注射成型图像传感器及其制造方法
公开(公告)号：US06649834B1
公开(公告)日：2003-11-18
申请号：US10321917
申请日：2002-12-16
申请人： Jackson Hsieh , Jichen Wu , Bruce Chen , Kevin Chang
发明人： Jackson Hsieh , Jichen Wu , Bruce Chen , Kevin Chang
IPC分类号： H01L2302
CPC分类号： H01L31/0203 , H01L23/057 , H01L24/48 , H01L27/14618 , H01L2224/05599 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/16195 , H01L2924/181 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board and a third board to form a -shaped structure. The injection molded structure encapsulates the metal sheets by way of injection molding and has a first molded body and a second molded body. The injection molded structure has a U-shaped structure and is formed with a cavity. The first, second, and third boards are exposed from top, bottom, side surfaces of the first molded body. The photosensitive chip is mounted within the cavity. The bonding pads are formed on the photosensitive chip. The wires electrically connect the bonding pads to signal input terminals of the first boards. The transparent layer covers over the first molded body to encapsulate the photosensitive chip.
摘要翻译：注塑图像传感器包括以矩阵形式布置的金属片，注射成型结构，感光芯片，接合焊盘，电线和透明层。每个金属片具有第一板，第二板和第三板以形成形结构。注塑结构体通过注射成型封装金属片，并具有第一成型体和第二成型体。注塑结构具有U形结构并且形成有空腔。第一，第二和第三板从第一成型体的顶部，底部和侧面露出。感光芯片安装在腔内。接合焊盘形成在感光芯片上。导线将接合焊盘电连接到第一板的信号输入端子。透明层覆盖在第一成型体上以封装感光芯片。

7. 发明申请

US20050012025A1 Image sensor and method for packaging the same 审中-公开
标题翻译：图像传感器和包装方法
公开(公告)号：US20050012025A1
公开(公告)日：2005-01-20
申请号：US10621986
申请日：2003-07-16
申请人： Jackson Hsieh , Jichen Wu , Bruce Chen , Abnet Chen
发明人： Jackson Hsieh , Jichen Wu , Bruce Chen , Abnet Chen
IPC分类号： H01L27/00 , H01L31/00 , H01L31/0203
CPC分类号： H01L31/0203 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/16195 , H01L2924/00014 , H01L2924/00
摘要： An image sensor includes lower and upper metal sheet sets, an encapsulant, a photosensitive chip, wires, and a transparent layer. The lower metal sheet set includes plural lower metal sheets and a middle board among and flush with the lower metal sheets. The upper metal sheet set includes plural upper metal sheets stacked on the lower metal sheets, respectively. The encapsulant encapsulates the upper and lower metal sheets and the middle board with upper surfaces of the upper sheets, lower surfaces of the lower sheets, and upper and lower surfaces of the middle board exposed from the encapsulant, and with a frame layer formed around the upper sheets to define a chamber. The chip is mounted to the middle board and located within the chamber. The wires electrically connect the chip to the upper metal sheets. The transparent layer is arranged on the frame layer to cover the chip.
摘要翻译：图像传感器包括下部和上部金属片组，密封剂，感光芯片，导线和透明层。下金属片组包括多个下金属片和中间板，并与下金属片齐平。上部金属片组分别包括堆叠在下部金属片上的多个上部金属片。密封剂封装上，下金属片和中间板，上板的上表面，下片的下表面，以及从密封剂暴露的中间板的上表面和下表面，以及围绕上部板材定义一个室。芯片安装在中间板并位于腔室内。电线将芯片电连接到上金属片。透明层布置在框架层上以覆盖芯片。

8. 发明申请

US20050077362A1 STACKED SMALL MEMORY CARD 失效
标题翻译：堆叠的小存储卡
公开(公告)号：US20050077362A1
公开(公告)日：2005-04-14
申请号：US10683838
申请日：2003-10-09
申请人： Jackson Hsieh , Jichen Wu , Abnet Chen
发明人： Jackson Hsieh , Jichen Wu , Abnet Chen
IPC分类号： G06K19/02 , G06K19/077 , H05K1/02 , H05K1/14 , H05K3/28 , G06K19/06
CPC分类号： G06K19/0773 , G06K19/02 , G06K19/077 , H01L2224/48091 , H01L2224/48227 , H05K1/0206 , H05K1/144 , H05K3/0061 , H05K3/284 , H05K2201/043 , H01L2924/00014
摘要： A stacked small memory card includes an upper memory card and a lower memory card, the upper memory card and the lower memory card respectively formed a first heat sink and a second heat sink, the first heat sink and the second heat sink are stacked together, so that, the heat of the upper memory card and the lower memory card may be dispersed via the first heat sink and the second heat sink. Thus, the stacked small memory card of present invention having high function of disperses heat to promote its durability and lifetime effectively.
摘要翻译：堆叠式小存储卡包括上存储卡和下存储卡，上存储卡和下存储卡分别形成第一散热器和第二散热器，第一散热器和第二散热器堆叠在一起，使得上存储卡和下存储卡的热量可以经由第一散热器和第二散热器分散。因此，本发明的堆叠式小型存储卡具有高散热功能，有效地提高了其耐久性和寿命。

9. 发明授权

US07250324B2 Method for manufacturing an image sensor 有权
标题翻译：图像传感器的制造方法
公开(公告)号：US07250324B2
公开(公告)日：2007-07-31
申请号：US10386067
申请日：2003-03-10
申请人： Jackson Hsieh , Jichen Wu
发明人： Jackson Hsieh , Jichen Wu
IPC分类号： H01L21/00
CPC分类号： H04N5/2253
摘要： A method for manufacturing an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer on the upper surface of the substrate to form a cavity together with the substrate; mounting a photosensitive chip, which is formed with a plurality of bonding pads, to the upper surface of the substrate, the photosensitive chip being located within the cavity; providing a plurality of wires to electrically connect the bonding pads of the photosensitive chip to the substrate; supplying an adhesive medium to the cavity; placing a transparent layer on the frame layer to cover the photosensitive chip so as to form the image sensor; and rotating the image sensor to make the adhesive medium be uniformly distributed over the upper surface of the substrate so that particles within the cavity are adhered to the adhesive medium.
摘要翻译：一种用于制造图像传感器的方法包括以下步骤：提供具有上表面和下表面的基板; 在所述基板的上表面上安装框架层以与所述基板一起形成空腔; 将形成有多个接合焊盘的感光芯片安装到基板的上表面，感光芯片位于空腔内; 提供多条电线以将感光芯片的接合焊盘电连接到基板上; 向所述空腔供应粘合剂介质; 在框架层上放置透明层以覆盖感光芯片，以形成图像传感器; 并且旋转图像传感器以使粘合剂介质均匀地分布在基板的上表面上，使得空腔内的颗粒粘附到粘合剂介质上。

10. 发明授权

US06906397B2 Image sensor having an improved transparent layer 有权
标题翻译：图像传感器具有改进的透明层
公开(公告)号：US06906397B2
公开(公告)日：2005-06-14
申请号：US10621992
申请日：2003-07-16
申请人： Jackson Hsieh , Jichen Wu , Channing Wel , Bird Lin
发明人： Jackson Hsieh , Jichen Wu , Channing Wel , Bird Lin
IPC分类号： H01L31/0203 , H01L31/0232
CPC分类号： H01L31/0203 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： An image sensor having an improved transparent layer includes a substrate, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate has an upper surface formed with a plurality of first connected points. The frame layer is arranged on the upper surface of the substrate so as to form a cavity together with the substrate. The photosensitive chip is mounted on the upper surface of the substrate and within the cavity. The plurality of wires are electrically connected the photosensitive chip to the first connected point of the substrate. The transparent layer is covered on the frame layer for covering the photosensitive chip so that the photosensitive chip may receive optical signals passing through the transparent layer, respectively, at the peripheries of the transparent layer are formed with cut—corners. Therefore, the transparent layer may be decreased collision and may be increased the cleanness of the transparent layer, therefore, simplifying the manufacturing processes and decreasing the manufacturing cost.
摘要翻译：具有改进的透明层的图像传感器包括基板，框架层，感光芯片，多根导线和透明层。基板具有形成有多个第一连接点的上表面。框架层布置在基板的上表面上，以与基板一起形成空腔。感光芯片安装在基板的上表面和腔内。多根导线将感光芯片电连接到基板的第一连接点。透明层被覆盖在框架层上，用于覆盖感光芯片，使得感光芯片可以分别在透明层的周边处接收通过透明层的光信号，并且形成有切角。因此，透明层可以减少碰撞，并且可以提高透明层的清洁度，因此简化制造工艺并降低制造成本。

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