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1. 发明申请

US20050077607A1 Small memory card 有权
标题翻译：小存储卡
公开(公告)号：US20050077607A1
公开(公告)日：2005-04-14
申请号：US10683837
申请日：2003-10-09
申请人： Jackson Hsieh , Jichen Wu , Worrell Tsai , Bruce Chen
发明人： Jackson Hsieh , Jichen Wu , Worrell Tsai , Bruce Chen
IPC分类号： H01L23/13 , H01L23/31 , H01L25/065 , H01L23/02 , H01L23/34
CPC分类号： H01L23/3107 , H01L23/13 , H01L24/48 , H01L25/0655 , H01L2224/06136 , H01L2224/48091 , H01L2224/4824 , H01L2924/00014 , H01L2924/14 , H01L2924/18165 , H01L2924/19041 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A small memory card includes a substrate, a plurality of memory chips, a plurality of wires, and a glue layer, the substrate is formed with a plurality of through slots, then the plurality of memory chips be mounted on the substrate, so that the plurality of bounding pads of the memory chip from through slot may be revealed, and use a plurality of wires electrically connecting to the substrate, finally use the glue layer encapsulating a plurality of memory chips at the same time. Thus, the small memory card of present invention has small packed volume, and the manufacturing processes may be convenient.
摘要翻译：小型存储卡包括基板，多个存储芯片，多根导线和胶合层，基板形成有多个通孔，然后将多个存储芯片安装在基板上，可以显示从通槽的存储芯片的多个边界焊盘，并且使用电连接到基板的多根电线，最后同时使用封装多个存储芯片的胶层。因此，本发明的小存储卡具有小的封装体积，并且制造工艺可以是方便的。

2. 发明授权

US07126219B2 Small memory card 有权
标题翻译：小存储卡
公开(公告)号：US07126219B2
公开(公告)日：2006-10-24
申请号：US10683837
申请日：2003-10-09
申请人： Jackson Hsieh , Jichen Wu , Worrell Tsai , Bruce Chen
发明人： Jackson Hsieh , Jichen Wu , Worrell Tsai , Bruce Chen
IPC分类号： H01L23/02
CPC分类号： H01L23/3107 , H01L23/13 , H01L24/48 , H01L25/0655 , H01L2224/06136 , H01L2224/48091 , H01L2224/4824 , H01L2924/00014 , H01L2924/14 , H01L2924/18165 , H01L2924/19041 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A small memory card includes a substrate, a plurality of memory chips, a plurality of wires, and a glue layer, the substrate is formed with a plurality of through slots of the substrate, then the plurality of memory chips are mounted on the substrate, so that the plurality of bounding pads of the memory chip are exposed from through slot, the plurality of wires are electrically connected to the substrate, the glue layer is encapsulated the plurality of memory chips at the same time. Thus, the small memory card of present invention has small packed volume, and the manufacturing processes may be convenient.
摘要翻译：小型存储卡包括基板，多个存储芯片，多根导线和胶合层，基板形成有基板的多个通孔，然后将多个存储芯片安装在基板上，使得存储芯片的多个边界焊盘从通孔露出，多条电线电连接到基板上，胶层同时封装多个存储芯片。因此，本发明的小存储卡具有小的封装体积，并且制造工艺可以是方便的。

3. 发明授权

US06878917B2 Injection molded image sensor and a method for manufacturing the same 失效
标题翻译：注射成型图像传感器及其制造方法
公开(公告)号：US06878917B2
公开(公告)日：2005-04-12
申请号：US10321926
申请日：2002-12-16
申请人： Jackson Hsieh , Jichen Wu , Bruce Chen , Worrell Tsai
发明人： Jackson Hsieh , Jichen Wu , Bruce Chen , Worrell Tsai
IPC分类号： H01L27/00 , H01L27/146
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board and a third board to form a -shaped structure. The molded structure encapsulates the metal sheets by way of injection molding and has a first molded body and a second molded body. The injection molded structure has a U-shaped structure and is formed with a cavity. The first boards are partially encapsulated by the first molded body. The second and third boards are exposed from bottom and side surfaces of the first molded body. The chip is mounted within the cavity. The pads are formed on the chip. The wires electrically connect the pads to input terminals of the first boards. The transparent layer covers over the first molded body to encapsulate the chip.
摘要翻译：注塑图像传感器包括以矩阵形式布置的金属片，注射成型结构，感光芯片，接合焊盘，电线和透明层。每个金属片具有第一板，第二板和第三板以形成形结构。模制结构体通过注射成型封装金属片，并具有第一成型体和第二成型体。注塑结构具有U形结构并且形成有空腔。第一板被第一成型体部分封装。第二和第三板从第一成型体的底表面和侧表面露出。芯片安装在腔内。焊盘形成在芯片上。电线将焊盘电连接到第一板的输入端。透明层覆盖第一成型体上以封装芯片。

4. 发明申请

US20050098865A1 Image sensor package 审中-公开
标题翻译：图像传感器封装
公开(公告)号：US20050098865A1
公开(公告)日：2005-05-12
申请号：US10705377
申请日：2003-11-10
申请人： Jackson Hsieh , Jichen Wu , Worrell Tsai , Abnet Chen
发明人： Jackson Hsieh , Jichen Wu , Worrell Tsai , Abnet Chen
IPC分类号： H01L23/02 , H01L23/48 , H01L31/0203
CPC分类号： H01L31/0203 , H01L2224/48091 , H01L2924/00014
摘要： An image sensor package includes plural lower metal sheets, plural upper metal sheets stacked on the lower metal sheets, and an encapsulant for encapsulating the lower and upper metal sheets. The lower metal formed with a first hole, the upper metal sheets formed a second hole penetrated from the upper surface to the lower surface. Wherein the encapsulant filled into the second hole and first hole to tighten the upper metal sheets and the lower metal sheets. A photosensitive chip arranged within the chamber, plural wires for electrically connecting the chip to the upper surfaces of the lower metal sheets, and a transparent layer arranged on the frame layer to cover the chip.
摘要翻译：图像传感器封装包括多个下金属片，堆叠在下金属片上的多个上金属片，以及用于封装下金属片和上金属片的密封剂。形成有第一孔的下部金属，上部金属板形成从上表面向下表面贯穿的第二孔。其中密封剂填充到第二孔和第一孔中以收紧上金属片和下金属片。布置在室内的感光芯片，用于将芯片电连接到下金属片的上表面的多根电线以及布置在框架层上以覆盖芯片的透明层。

5. 发明申请

US20050012026A1 Image sensor and method for packaging the same 审中-公开
标题翻译：图像传感器和包装方法
公开(公告)号：US20050012026A1
公开(公告)日：2005-01-20
申请号：US10621990
申请日：2003-07-16
申请人： Jackson Hsieh , Jichen Wu , Shuen Yang , Worrell Tsai
发明人： Jackson Hsieh , Jichen Wu , Shuen Yang , Worrell Tsai
IPC分类号： H01L27/00 , H01L27/146 , H01L31/00 , H01L31/0203
CPC分类号： H01L27/14618 , H01L31/0203 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/16195 , H01L2924/00014 , H01L2924/00
摘要： An image sensor includes a lower metal sheet set, an upper metal sheet set, an encapsulant, a photosensitive chip, plural wires, and a transparent layer. The lower metal sheet set includes plural lower metal sheets and a lower middle board arranged among and flush with the lower metal sheets. The upper metal sheet set includes plural upper metal sheets and an upper middle board arranged among and flush with the upper metal sheets. The encapsulant encapsulates the lower metal sheets, lower middle board, upper metal sheets and upper middle board with the upper metal sheets, lower metal sheets, lower middle board, and upper middle board exposed from the encapsulant, and with a frame layer formed around the upper metal sheets to define a chamber. The photosensitive chip is arranged on the upper surface of the upper middle board and located within the chamber.
摘要翻译：图像传感器包括下金属片组，上金属片组，密封剂，感光芯片，多根线和透明层。下部金属板组包括多个下部金属片和布置在下部金属片中并与之相齐平的下部中间板。上金属片组包括多个上金属片和布置在上金属片中并与之齐平的上中间板。密封剂用从密封剂露出的上金属片，下金属片，下中间板和上中间板封装下金属片，下中间板，上金属片和上中间板，并且围绕上部金属板来限定一个室。感光芯片布置在上中间板的上表面上并位于室内。

6. 发明授权

US07064404B1 Image sensor structure 有权
标题翻译：图像传感器结构
公开(公告)号：US07064404B1
公开(公告)日：2006-06-20
申请号：US11052990
申请日：2005-02-07
申请人： Chung Hsien Hsin , Tony Wang , Worrell Tsai , Figo Hsieh , Wei Chang , Jun Jie Yen
发明人： Chung Hsien Hsin , Tony Wang , Worrell Tsai , Figo Hsieh , Wei Chang , Jun Jie Yen
IPC分类号： H01L31/0203
CPC分类号： H01L31/0203 , H01L23/10 , H01L24/48 , H01L24/49 , H01L24/73 , H01L27/14618 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/16195 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An image sensor structure includes a substrate, four posts, a photosensitive chip, a plurality of wires, a glue layer, and a transparent layer. The substrate has an upper surface on which first electrodes are formed, and a lower surface on which second electrodes are formed. The four posts are arranged on the four angle of the upper surface of the substrate individually. The photosensitive chip is mounted on the upper surface of the substrate. The plurality of wires are electrically connected the photosensitive chip to the first electrodes of the substrate. The glue layer is surrounded to the periphery of the upper surface of the substrate for surrounding the photosensitive chip, and covered the part of the wires. The transparent layer is arranged onto the four posts and the glue layer to cover the photosensitive chip.
摘要翻译：图像传感器结构包括基板，四个柱，感光芯片，多个导线，胶层和透明层。基板具有形成有第一电极的上表面和形成有第二电极的下表面。四个柱分别布置在基板的上表面的四个角度上。感光芯片安装在基板的上表面上。多个导线将感光芯片电连接到基板的第一电极。胶层被包围在基片的上表面周围，用于包围感光芯片，并覆盖电线的一部分。透明层布置在四个柱和胶层上以覆盖感光芯片。

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