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1. 发明申请

US20110017430A1 THERMAL MODULE 审中-公开
标题翻译：热模块
公开(公告)号：US20110017430A1
公开(公告)日：2011-01-27
申请号：US12566693
申请日：2009-09-25
申请人： ZHI-SHENG LIAN , JIN-BIAO LIU , GEN-PING DENG
发明人： ZHI-SHENG LIAN , JIN-BIAO LIU , GEN-PING DENG
IPC分类号： F28D15/04 , G06F1/20 , F28F7/00
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A thermal module includes a mounting plate, a centrifugal fan with a fin assembly arranged at an air outlet thereof, and a heat pipe connected the fin assembly with the heat mounting plate. The centrifugal fan includes a fan housing and an impeller rotatably received in the fan housing. The fan housing is disposed immediately neighboring to the mounting plate and mounted to a lateral side of the mounting plate via a securing structure formed between the fan housing and the mounting plate. The fan housing consists of a base and a cover. The base is made of a plastic material.
摘要翻译：热模块包括安装板，具有布置在其空气出口处的翅片组件的离心风扇和将翅片组件与热安装板连接的热管。离心风扇包括风扇壳体和可旋转地容纳在风扇壳体中的叶轮。所述风扇壳体与所述安装板紧邻配置，并经由所述风扇壳体与所述安装板之间形成的固定结构安装在所述安装板的侧面。风扇外壳由底座和盖组成。基座由塑料制成。

2. 发明申请

US20080130239A1 HEAT DISSIPATION DEVICE ASSEMBLY 失效
标题翻译：散热装置总成
公开(公告)号：US20080130239A1
公开(公告)日：2008-06-05
申请号：US11566015
申请日：2006-12-01
申请人： JIN-BIAO LIU , GUANG YU , SHIH-HSUN WUNG , CHUN-CHI CHEN
发明人： JIN-BIAO LIU , GUANG YU , SHIH-HSUN WUNG , CHUN-CHI CHEN
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L23/3672 , H01L23/427 , H01L2023/4056 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device assembly is mounted on a printed circuit board (80). First and second electronic components (82, 84) are mounted on the printed circuit board. The heat dissipation device assembly includes a first heat sink (10) in thermal contact with the first electronic component, and a second heat sink (20) in thermal contact with the second electronic component. A spring tab (24) is sandwiched between the first and second heat sinks for providing spring force between the first and second heat sinks thus securely mounting the second heat sink on the second electronic component.
摘要翻译：散热装置组件安装在印刷电路板（80）上。第一和第二电子部件（82,84）安装在印刷电路板上。散热装置组件包括与第一电子部件热接触的第一散热器（10）和与第二电子部件热接触的第二散热器（20）。在第一和第二散热器之间夹有弹簧片（24），用于在第一和第二散热器之间提供弹簧力，从而将第二散热器牢固地安装在第二电子部件上。

3. 发明申请

US20100053904A1 LOCKING DEVICE FOR HEAT SINK 失效
标题翻译：用于散热的锁定装置
公开(公告)号：US20100053904A1
公开(公告)日：2010-03-04
申请号：US12202391
申请日：2008-09-01
申请人： CHUN-CHI CHEN , HONG-CHENG YANG , JIN-BIAO LIU , HE-PING LIU
发明人： CHUN-CHI CHEN , HONG-CHENG YANG , JIN-BIAO LIU , HE-PING LIU
IPC分类号： H05K7/20 , H01R4/28
CPC分类号： H01L23/4093 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A locking device is used for securing a heat sink to an electronic device mounted on a first face of a printed circuit board which defines a first hole. The heat sink defines a second hole therein. The locking device has a fastener including a head portion located aside the heat sink, a foot portion located aside a second face of the printed circuit board, and a body portion extending through the holes of the heat sink and the printed circuit board and interconnecting the head portion and the foot portion. The foot portion includes a buckling part abutting against the second face of the printed circuit board, and a positioning part extending toward the head portion to a position above the buckling part. When the buckling part abuts against the printed circuit board, the positioning part has a portion thereof entering into the first hole.
摘要翻译：锁定装置用于将散热器固定到安装在限定第一孔的印刷电路板的第一面上的电子装置上。散热器在其中限定了第二个孔。锁定装置具有紧固件，该紧固件包括位于散热器的头部的部分，位于印刷电路板的第二面的脚部以及延伸穿过散热器和印刷电路板的孔的主体部分，头部和脚部。脚部包括抵靠印刷电路板的第二面的弯曲部，以及朝向头部延伸到屈曲部上方的位置的定位部。当屈曲部分抵靠印刷电路板时，定位部分的一部分进入第一孔。

4. 发明申请

US20090165999A1 HEAT SINK 审中-公开
标题翻译：散热器
公开(公告)号：US20090165999A1
公开(公告)日：2009-07-02
申请号：US11964917
申请日：2007-12-27
申请人： JIN-BIAO LIU
发明人： JIN-BIAO LIU
IPC分类号： F28F7/00
CPC分类号： H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat sink includes a plurality of fins. Each of fins includes a body having two locking members at a top portion and a lower portion thereof respectively. Each of the locking members includes two parallel clasping plates. The two clasping plates of one of the fins clasp the main body of another fin adjacent said one fin, thereby interlocking the fins together.
摘要翻译：散热器包括多个翅片。每个翅片包括分别在其顶部和下部具有两个锁定构件的主体。每个锁定构件包括两个平行的夹紧板。其中一个翅片的两个扣板夹住与所述一个翅片相邻的另一个翅片的主体，从而将翅片互锁在一起。

5. 发明申请

US20070263363A1 FIXING APPARATUS FOR HEAT SINK 审中-公开
标题翻译：固定装置用于散热
公开(公告)号：US20070263363A1
公开(公告)日：2007-11-15
申请号：US11561324
申请日：2006-11-17
申请人： JIN-BIAO LIU , SHIH-HSUN WUNG , GUANG YU , CHUN-CHI CHEN
发明人： JIN-BIAO LIU , SHIH-HSUN WUNG , GUANG YU , CHUN-CHI CHEN
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A fixing apparatus adapted for attaching a heat sink to a circuit board on which an electronic component is mounted includes a fastener and a back plate. The fastener comprises an elongated pressing part holding the heat sink in contact with the electronic component and two latching legs extending downward from two opposite ends of the pressing part. The latching legs each have at least one hook extending inward from a distal end thereof. The back plate comprises a main body and a plurality of connecting members at two opposite ends of the main body for extending upwardly through the circuit board to engage with the hooks of the fastener.
摘要翻译：适于将散热器附接到其上安装电子部件的电路板的定影装置包括紧固件和背板。紧固件包括将散热器保持与电子部件接触的细长按压部分和从按压部分的两个相对端向下延伸的两个闩锁腿。所述闩锁腿各自具有从其远端向内延伸的至少一个钩。背板包括主体和在主体的两个相对端处的多个连接构件，用于向上延伸穿过电路板以与紧固件的钩接合。

6. 发明申请

US20100246127A1 HEAT DISSIPATION DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：散热装置及其制造方法
公开(公告)号：US20100246127A1
公开(公告)日：2010-09-30
申请号：US12500615
申请日：2009-07-10
申请人： XIN-LEI LIU , JIN-BIAO LIU , HONG-CHENG YANG , CHUN-CHI CHEN
发明人： XIN-LEI LIU , JIN-BIAO LIU , HONG-CHENG YANG , CHUN-CHI CHEN
IPC分类号： H05K7/20 , B23P11/00
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0266 , F28D15/0275 , H01L23/467 , H01L2924/0002 , Y10T29/49826 , H01L2924/00
摘要： A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a centrifugal fan located adjacent to the fin unit, a heat-conducting board attached to the electronic component and a heat pipe thermally connecting the fin unit and the electronic component. An engaging portion protrudes upwardly from a top face of the heat-conducting board. The heat pipe has an evaporating section extending through the engaging portion and being fixed to the top face of the heat-conducting board, and a condensing section attached to the fin unit.
摘要翻译：一种用于从安装在印刷电路板上的电子部件散热的散热装置，包括翅片单元，邻近翅片单元的离心风扇，附着在电子部件上的导热板，以及热连接翅片单元和电子部件。接合部从导热板的顶面向上突出。热管具有延伸穿过接合部分并且固定到导热板的顶面的蒸发部分和连接到散热片单元的冷凝部分。

7. 发明申请

US20090279251A1 HEAT DISSIPATION DEVICE WITH HEAT PIPE 失效
标题翻译：热管散热装置
公开(公告)号：US20090279251A1
公开(公告)日：2009-11-12
申请号：US12118757
申请日：2008-05-12
申请人： JIN-BIAO LIU , HONG-CHENG YANG , CHUN-CHI CHEN
发明人： JIN-BIAO LIU , HONG-CHENG YANG , CHUN-CHI CHEN
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H05K7/20336
摘要： A heat dissipation device is used for removing heat from at least two adjacent first and second electronic devices in a computer enclosure. The heat dissipation device includes a first heat sink mounted on the first electronic device and a second heat sink mounted on the second electronic device. The first heat sink includes a base, a first fin unit mounted on the base and two heat pipes extending from the base outwardly. Second and third fin units engage with the two heat pipes, respectively. The first, second and third fin units are located adjacent to first, second and third openings of the computer enclosure, respectively. The second heat sink is located among the first, second and third fin units of the first heat sink.
摘要翻译：散热装置用于从计算机外壳中的至少两个相邻的第一和第二电子装置移除热量。散热装置包括安装在第一电子装置上的第一散热器和安装在第二电子装置上的第二散热器。第一散热器包括底座，安装在基座上的第一翅片单元和从底座向外延伸的两根热管。第二和第三鳍单元分别与两根热管接合。第一，第二和第三鳍单元分别位于计算机机箱的第一，第二和第三开口附近。第二散热器位于第一散热器的第一，第二和第三散热片之间。

8. 发明申请

US20090161314A1 HEAT DISSIPATION DEVICE HAVING A FAN HOLDER FOR ATTACHMENT OF A FAN 有权
标题翻译：具有风扇附件的散热装置的散热装置
公开(公告)号：US20090161314A1
公开(公告)日：2009-06-25
申请号：US11961375
申请日：2007-12-20
申请人： JIN-BIAO LIU
发明人： JIN-BIAO LIU
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/4093 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat sink, a fan and a fan holder locking the fan on the heat sink. The heat sink defines two slots in two opposite lateral sides thereof. The fan holder includes two opposite first beams and another two opposite second beams. Each of the first beams has a latching leg extending downwardly therefrom and two locking tabs extending upwardly therefrom. The two latching legs are engaged into the two slots of the heat sink. The locking tabs are fastened to two lateral sides of the fan.
摘要翻译：散热装置包括散热器，风扇和将风扇锁定在散热器上的风扇架。散热片在其两个相对的侧面限定了两个槽。风扇架包括两个相对的第一梁和另外两个相对的第二梁。每个第一梁具有从其向下延伸的闩锁腿和从其向上延伸的两个锁定突舌。两个锁定腿接合到散热器的两个槽中。锁定片固定在风扇的两侧。

9. 发明申请

US20070247819A1 MEMORY MODULE ASSEMBLY INCLUDING HEAT DISSIPATING MEMBERS 审中-公开
标题翻译：存储模块组件，其中包括热消耗器件
公开(公告)号：US20070247819A1
公开(公告)日：2007-10-25
申请号：US11308701
申请日：2006-04-24
申请人： CHUN-CHI CHEN , SHIH-HSUN WUNG , GUANG YU , DA-YUAN ZHOU , JIN-BIAO LIU
发明人： CHUN-CHI CHEN , SHIH-HSUN WUNG , GUANG YU , DA-YUAN ZHOU , JIN-BIAO LIU
IPC分类号： H05K7/00
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A memory module assembly includes a memory card having a circuit board and a plurality of electronic components mounted on the circuit board. A pair of shells covers two faces of the memory card for dissipating heat generated by the electronic components of the memory card. A pair of clips each clamps the pair of shells and memory card. Each of the pair of clips has a pair of abutting pieces being pivotably connected together and resilient pressing the pair of shells toward the electronic components of the memory card. The abutting pieces of the pair of clips are detachably engaged with the pair of shells, and form protrusions thereon engaging in indentations defined in the shells.
摘要翻译：存储器模块组件包括具有电路板和安装在电路板上的多个电子部件的存储卡。一对外壳覆盖存储卡的两个面，用于散发由存储卡的电子部件产生的热量。一对夹子夹住一对壳和存储卡。一对夹具中的每一个具有一对可枢转地连接在一起的邻接件，并且弹性地将该对外壳按压到存储卡的电子部件。一对夹子的抵接件可拆卸地与该对外壳接合，并在其上形成突起，其上形成有限定在壳中的凹陷。

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