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1. 发明申请

US20110017430A1 THERMAL MODULE 审中-公开
标题翻译：热模块
公开(公告)号：US20110017430A1
公开(公告)日：2011-01-27
申请号：US12566693
申请日：2009-09-25
申请人： ZHI-SHENG LIAN , JIN-BIAO LIU , GEN-PING DENG
发明人： ZHI-SHENG LIAN , JIN-BIAO LIU , GEN-PING DENG
IPC分类号： F28D15/04 , G06F1/20 , F28F7/00
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A thermal module includes a mounting plate, a centrifugal fan with a fin assembly arranged at an air outlet thereof, and a heat pipe connected the fin assembly with the heat mounting plate. The centrifugal fan includes a fan housing and an impeller rotatably received in the fan housing. The fan housing is disposed immediately neighboring to the mounting plate and mounted to a lateral side of the mounting plate via a securing structure formed between the fan housing and the mounting plate. The fan housing consists of a base and a cover. The base is made of a plastic material.
摘要翻译：热模块包括安装板，具有布置在其空气出口处的翅片组件的离心风扇和将翅片组件与热安装板连接的热管。离心风扇包括风扇壳体和可旋转地容纳在风扇壳体中的叶轮。所述风扇壳体与所述安装板紧邻配置，并经由所述风扇壳体与所述安装板之间形成的固定结构安装在所述安装板的侧面。风扇外壳由底座和盖组成。基座由塑料制成。

2. 发明申请

US20100000716A1 HEAT DISSIPATION DEVICE HAVING A CLIP 失效
标题翻译：具有夹子的散热装置
公开(公告)号：US20100000716A1
公开(公告)日：2010-01-07
申请号：US12409502
申请日：2009-03-24
申请人： ZHI-SHENG LIAN , GEN-PING DENG , CHUN-CHI CHEN
发明人： ZHI-SHENG LIAN , GEN-PING DENG , CHUN-CHI CHEN
IPC分类号： F28F7/00
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/3672 , H01L23/4006 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device removing heat from a heat generating electronic device on a printed circuit board includes a base, a plurality of fins attached to the base and a clip for mounting the base and the fins onto the heat generating electronic device. Each of the fins defines a closed through hole therein. The holes of the fins cooperatively define a channel. The clip includes a locking beam extending through the channel of the fins and two fasteners engaging the locking beam mounting the base and the fins onto the heat generating electronic device.
摘要翻译：从印刷电路板上的发热电子装置中除去热的散热装置包括底座，安装在基座上的多个翅片以及用于将基座和翅片安装在发热电子设备上的夹子。每个翅片在其中限定了一个封闭的通孔。翅片的孔协同地限定通道。夹具包括延伸穿过翅片的通道的锁定梁和两个紧固件，其接合将基座和翅片安装到发热电子设备上的锁定梁。

3. 发明申请

US20110114301A1 HEAT DISSIPATION APPARATUS AND METHOD FOR MANUFACTURING THE SAME 失效
标题翻译：散热装置及其制造方法
公开(公告)号：US20110114301A1
公开(公告)日：2011-05-19
申请号：US12775498
申请日：2010-05-07
申请人： ZHI-SHENG LIAN , GEN-PING DENG
发明人： ZHI-SHENG LIAN , GEN-PING DENG
IPC分类号： F28F7/00 , B21D53/02
CPC分类号： H01L23/467 , H01L23/3672 , H01L23/4006 , H01L23/427 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat dissipation apparatus includes fins each including a body and blades extending radially outwardly from the body. The blades define cutouts therebetween. The fins are stacked together in such a manner that the cutouts of the fins cooperatively form airflow guiding channels each extending spirally from top to bottom.
摘要翻译：散热装置包括翅片，每个散热片包括主体和从主体径向向外延伸的叶片。叶片在它们之间限定切口。翅片以这样的方式堆叠在一起，使得翅片的切口协同地形成每个从顶部到底部螺旋地延伸的气流引导通道。

4. 发明申请

US20110051353A1 HEAT DISSIPATION DEVICE FOR MEMORY MODULE 失效
标题翻译：用于存储器模块的散热装置
公开(公告)号：US20110051353A1
公开(公告)日：2011-03-03
申请号：US12629899
申请日：2009-12-03
申请人： ZHI-SHENG LIAN , GEN-PING DENG
发明人： ZHI-SHENG LIAN , GEN-PING DENG
IPC分类号： H05K5/02
CPC分类号： G06F1/20 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device removing heat from a memory module includes two conducting plate clipping the memory module and an elastic member. Each conducting plate includes a lower part and an upper part. The two lower parts of the two conducting plates abut against two opposite sides of the memory module, respectively. The two upper parts of the two conducting plates are pivotably connected together and located above the memory module. The elastic member is located between the two upper parts and urges the two lower parts towards the memory module. The upper part of each conducting plate is slantwise at an obtuse angle to the lower part to make the two upper parts of the two conducting plates splay upwardly.
摘要翻译：从存储模块移除热量的散热装置包括夹持存储器模块和弹性构件的两个导电板。每个导电板包括下部和上部。两个导电板的两个下部分别抵靠存储器模块的两个相对侧。两个导电板的两个上部可枢转地连接在一起并位于存储器模块的上方。弹性构件位于两个上部之间，并且将两个下部部分推向存储器模块。每个导电板的上部与下部呈钝角倾斜，以使两个导电板的两个上部向上张开。

5. 发明申请

US20110032675A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20110032675A1
公开(公告)日：2011-02-10
申请号：US12577736
申请日：2009-10-13
申请人： ZHI-SHENG LIAN , GEN-PING DENG
发明人： ZHI-SHENG LIAN , GEN-PING DENG
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for dissipating heat generated by a heat-generating component mounted on a printed circuit board, includes a heat absorbing board with a bottom thereof attached to the heat-generating component, two heat sinks, two heat pipes respectively connecting the heat absorbing board and the two heat sinks, two centrifugal fans and two clips. Each of the centrifugal fans is located at a lateral side of a corresponding heat sink. Each of the clips includes an engaging portion riveting with the heat absorbing board and two locking portions extending from two ends of the engaging portion and locked onto the printed circuit board to thereby secure the heat absorbing board on the heat-generating component.
摘要翻译：一种散热装置，用于散发由安装在印刷电路板上的发热元件产生的热量，包括一个吸热板，其底部附着在发热元件上，两个散热片，两个热管，分别连接吸热板板和两个散热片，两个离心风扇和两个夹子。每个离心式风扇位于相应散热器的侧面。每个夹子包括与吸热板铆接的接合部分和从接合部分的两端延伸并锁定在印刷电路板上的两个锁定部分，从而将吸热板固定在发热部件上。

6. 发明申请

US20100139892A1 HEAT DISSIPATION DEVICE 审中-公开
标题翻译：散热装置
公开(公告)号：US20100139892A1
公开(公告)日：2010-06-10
申请号：US12398972
申请日：2009-03-05
申请人： ZHI-SHENG LIAN , GEN-PING DENG , CHUN-CHI CHEN
发明人： ZHI-SHENG LIAN , GEN-PING DENG , CHUN-CHI CHEN
IPC分类号： F28D15/02 , F28D21/00
CPC分类号： F28D15/0275 , H01L23/3672 , H01L23/4006 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base, first and second fin units, two heat pipes, and a fan. The first fin unit is located on the base, and the second fin unit is located on the first fin unit. Each fin unit comprises a plurality of parallel fins with a plurality of channels defined therebetween. Each fin comprises an inlet section, an outlet section and a neck section interconnecting the inlet and outlet sections. A height of the neck section reduces gradually from the inlet section to the outlet section. Each heat pipe comprises an evaporating portion connecting with the base and a condensing portion inserting into a corresponding one of the outlet sections of the first and second fin units. The fan is located above the base and mounted onto the inlet sections of the first and second fin units.
摘要翻译：散热装置包括基座，第一和第二翅片单元，两个热管和风扇。第一翅片单元位于基座上，第二翅片单元位于第一翅片单元上。每个翅片单元包括多个平行翅片，其间限定有多个通道。每个翅片包括入口部分，出口部分和将入口部分和出口部分互连的颈部部分。颈部的高度从入口部分逐渐减小到出口部分。每个热管包括与基座连接的蒸发部分和插入第一和第二翅片单元的相应一个出口部分的冷凝部分。风扇位于基座上方并安装在第一和第二鳍片单元的入口部分上。

7. 发明申请

US20100307728A1 HEAT DISSIPATION DEVICE 审中-公开
标题翻译：散热装置
公开(公告)号：US20100307728A1
公开(公告)日：2010-12-09
申请号：US12549386
申请日：2009-08-28
申请人： ZHI-SHENG LIAN , GEN-PING DENG , CHUN-CHI CHEN
发明人： ZHI-SHENG LIAN , GEN-PING DENG , CHUN-CHI CHEN
IPC分类号： F28F7/00
CPC分类号： H01L23/427 , H01L23/3672 , H01L23/4006 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for removing heat from heat-generating components includes a fin unit. The fin unit includes a plurality of fins stacked together. Each fin is wave-shaped in profile and comprises a plurality of wave crests and wave troughs alternately arranged with each other. The wave crests of one of the fins respectively engage the wave troughs of a neighboring upper one of the fins. The wave troughs of the one of the fins are separated from and located below the corresponding wave crests of the upper one of the fins.
摘要翻译：用于从发热部件除去热量的散热装置包括散热片单元。翅片单元包括堆叠在一起的多个翅片。每个翅片的轮廓是波形的，并且包括彼此交替布置的多个波峰和波谷。其中一个翅片的波峰分别接合相邻的上部翅片的波谷。翅片中的一个的波谷与上部翼片的相应波峰分离并位于其下方。

8. 发明申请

US20100172088A1 HEAT DISSIPATION DEVICE FOR MEMORY MODULE 有权
标题翻译：用于存储器模块的散热装置
公开(公告)号：US20100172088A1
公开(公告)日：2010-07-08
申请号：US12537265
申请日：2009-08-07
申请人： ZHI-SHENG LIAN , GEN-PING DENG , CHUN-CHI CHEN
发明人： ZHI-SHENG LIAN , GEN-PING DENG , CHUN-CHI CHEN
IPC分类号： G06F1/20 , F28D15/04 , F28F7/00
CPC分类号： F28D15/0275 , G06F1/20
摘要： A heat dissipation device configured for dissipating heat of a memory module includes two fin assemblies pivotally assembled together through a pivot, two heat spreaders adapted for being arranged at two opposite side surfaces of the memory module, and two heat pipes. Each of the two heat pipes includes an evaporation section and a condensation section formed at two opposite ends thereof. The condensation sections of the heat pipes are respectively attached to the fin assemblies, and the evaporation sections of the heat pipes are respectively and thermally attached to the heat spreaders, whereby the heat of the memory module is transferred by the heat pipes from the heat spreaders to the fin assemblies for dissipation.
摘要翻译：构造成消耗存储器模块的热量的散热装置包括通过枢轴枢转地组装在一起的两个翅片组件，适于布置在存储器模块的两个相对侧表面处的两个散热器和两个热管。两个热管中的每一个包括形成在其两个相对端的蒸发部和冷凝部。热管的冷凝部分分别安装在翅片组件上，热管的蒸发部分分别热连接到散热器上，由此，存储器模块的热量通过散热器的热管传递到散热片组件进行散热。

9. 发明申请

US20110048678A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20110048678A1
公开(公告)日：2011-03-03
申请号：US12581175
申请日：2009-10-19
申请人： ZHI-SHENG LIAN , GEN-PING DENG
发明人： ZHI-SHENG LIAN , GEN-PING DENG
IPC分类号： F28D15/04 , F28F7/00 , H05K7/20
CPC分类号： H01L23/467 , H01L23/3672 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat sink, a fan having a flange and a plurality of brackets mounting the fan on the heat sink. Each of the brackets includes two pair of spaced buckles extending from a top thereof toward the fan. A bottom of each bracket is fixed on a bottom of the heat sink. The two pair of buckles of the bracket are buckled on the flange of the fan.
摘要翻译：散热装置包括散热器，具有凸缘的风扇和将风扇安装在散热器上的多个支架。每个托架包括从其顶部朝向风扇延伸的两对间隔的带扣。每个支架的底部固定在散热器的底部。支架的两对扣环在风扇的法兰上弯曲。

10. 发明申请

US20100096107A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20100096107A1
公开(公告)日：2010-04-22
申请号：US12391170
申请日：2009-02-23
申请人： ZHI-SHENG LIAN , GEN-PING DENG , CHUN-CHI CHEN
发明人： ZHI-SHENG LIAN , GEN-PING DENG , CHUN-CHI CHEN
IPC分类号： F28F7/00
CPC分类号： F28D15/0233 , F28D15/0275 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for removing heat from an electronic device and electronic components, includes a base plate in contact with the electronic device, a first fin set and a second fin set mounted on the base plate. The first fin set includes a plurality of first fins perpendicularly arranged on the base plate. The second fin set includes a plurality of second fins attached to a lateral side of the first fin set and perpendicular to both the first fins and the base plate. A fan is mounted on tops of the first fin set and the second fin set to cover both of them. Air generated by the fan flows through the first and second fin sets to cool the electronic components mounted on orthogonally neighboring sides of the heat dissipation device.
摘要翻译：一种用于从电子设备和电子部件移除热量的散热装置，包括与电子设备接触的基板，安装在基板上的第一散热片组和第二散热片组。第一翅片组包括垂直布置在基板上的多个第一翅片。第二翅片组包括附接到第一翅片组的横向侧并垂直于第一翅片和底板的多个第二翅片。风扇安装在第一散热片组的顶部上，第二散热片设置成覆盖它们。由风扇产生的空气流过第一和第二翅片组，以冷却安装在散热装置正交相邻侧面上的电子部件。

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