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    • 2. 发明授权
    • Heat dissipating assembly
    • 散热组件
    • US07283368B2
    • 2007-10-16
    • US11163516
    • 2005-10-21
    • Shih-Hsun WungGuang YuDa-Yuan ZhouChun-Chi Chen
    • Shih-Hsun WungGuang YuDa-Yuan ZhouChun-Chi Chen
    • H05K7/20F28F7/00H01L23/34
    • H01L23/4093H01L2924/0002H01L2924/00
    • A heat dissipating assembly includes a heat sink (10) having a chassis (12), a back plate (30) and a plurality of fasteners (40). Each fastener includes a screw cap (42), a spring (44) and a sleeve (46). The screw cap and the sleeve are movably connected together. The screw cap includes a head (420) and a tube (422) extending from the head. The tube includes a first cavity (424) and a second cavity (426). The back plate forms a plurality of posts (34) passing through the chassis and threadedly engaging in the first cavities of the tubes. A spring (44) is compressed between the first cavity of the tube and a bottom wall of the sleeve, for providing appropriate downwardly pressing force on the chassis of the heat sink against a CPU (22) mounted on a PCB (20).
    • 散热组件包括具有底盘(12),后板(30)和多个紧固件(40)的散热器(10)。 每个紧固件包括螺帽(42),弹簧(44)和套筒(46)。 螺帽和套筒可移动地连接在一起。 螺旋盖包括头部(420)和从头部延伸的管(422)。 管包括第一腔(424)和第二腔(426)。 后板形成穿过底盘并且螺纹地接合在管的第一腔中的多个柱(34)。 弹簧(44)在管的第一腔和套筒的底壁之间被压缩,用于在安装在PCB(20)上的CPU(22)的散热片的底盘上提供适当的向下按压力。