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    • 4. 发明专利
    • Electron source
    • 电子源
    • JP2011216348A
    • 2011-10-27
    • JP2010083780
    • 2010-03-31
    • Nissin Electric Co LtdPanasonic CorpPanasonic Electric Works Co Ltdパナソニック株式会社パナソニック電工株式会社日新電機株式会社
    • ICHIHARA TSUTOMUHATAI TAKASHIKOGA KEISUKEYAMAMOTO TOSHIYOSHIMIYATA EMINAGAMACHI MANABUKATO KENJIINAMI HIROSHIHAYASHI TSUKASA
    • H01J1/312
    • PROBLEM TO BE SOLVED: To provide an electron source improved in the electron discharge characteristics, in comparison with those of conventional ones.SOLUTION: An electron passing layer 6 is provided between a lower electrode 2 and a surface electrode 7. The electron passing layer 6 includes a first electron passing part 6a on a lower electrode 2 side; and a second electron passing part 6b on a surface electrode 7 side. The second electron passing part 6b includes multiple second grains 32a formed along the thickness direction of the lower electrode 2; a first insulating thin film 35 formed in the surface of each of the second grains 32a; multiple nanometer-order fine crystalline semiconductors 33, interposed between the second grains 32a adjacent to each other; and a second insulating thick film 34 formed in the surface of each of the fine crystalline semiconductors 33 and formed smaller in the crystal grain diameter than the fine crystalline semiconductor 33. A region 36 of the second electron passing part 6b, in which the second grains 32a are formed in the thickness direction, and the first electron passing part 6a are mutually different in the crystal orientation, and the second grain 32a is higher than the first grain in the columnar structure.
    • 要解决的问题:提供与传统电子放电特性相比改善的电子源。解决方案:在下电极2和表面电极7之间设置电子通过层6.电子通过层6 包括在下电极2侧的第一电子通过部分6a; 和表面电极7侧的第二电子通过部6b。 第二电子通过部分6b包括沿下电极2的厚度方向形成的多个第二晶粒32a; 形成在每个第二晶粒32a的表面中的第一绝缘薄膜35; 介于彼此相邻的第二晶粒32a之间的多个纳米级微晶半导体33; 以及形成在每个细晶半导体33的表面中并且形成为比微晶半导体33更小的晶粒直径的第二绝缘厚膜34.第二电子通过部6b的区域36,其中第二晶粒 32a形成在厚度方向上,第一电子通过部6a在晶体取向上相互不同,第二晶粒32a比柱状结构中的第一晶粒高。
    • 5. 发明专利
    • Apparatus for forming silicon dots
    • 形成硅胶的装置
    • JP2009071328A
    • 2009-04-02
    • JP2008310111
    • 2008-12-04
    • Nissin Electric Co Ltd日新電機株式会社
    • TAKAHASHI EIJIMIKAMI TAKASHIKISHIDA SHIGEAKIKATO KENJITOMYO ATSUSHIHAYASHI TSUKASAOGATA KIYOSHI
    • H01L21/203C23C14/14C23C16/24H01L21/205H01L29/06
    • C23C16/24H01L21/02381H01L21/02488H01L21/02532H01L21/02601H01L21/02631
    • PROBLEM TO BE SOLVED: To provide an apparatus for forming silicon dots of the same diameter at uniform density distribution directly on a substrate at a low temperature. SOLUTION: A silicon dot forming apparatus (A) includes: a chamber 1 including a holder 2 of a substrate S; a hydrogen gas supplying device 5 connected to the chamber; a silane-based gas supplying device 6 connected to the chamber; and an exhaust 7 connected to the chamber; a first high-frequency power supply which generates plasma for forming a silicon film on the inner wall of the chamber with gases supplied by the gas supplying devices 5 and 6; a second high-frequency power supply which generates plasma for performing chemical sputtering on the silicon film; and a plasma emission spectrometer 8 which determines ratio [Si (288 nm)/Hβ] of emission intensity of silicon atom at wave length of 288 nm Si (288 nm) to that of hydrogen atom at 484 nm Hβ of plasma emission in the chamber. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供一种在低温下直接在基板上以均匀的密度分布形成相同直径的硅点的装置。 < P>解决方案:一种硅点形成装置(A)包括:包括基板S的保持架2的室1; 连接到所述室的氢气供给装置5; 连接到所述室的硅烷类气体供给装置6; 以及连接到所述室的排气7; 第一高频电源,其由气体供应装置5和6供应的气体产生在室的内壁上形成硅膜的等离子体; 产生用于在硅膜上进行化学溅射的等离子体的第二高频电源; 以及等离子体发射光谱仪8,其确定在波长288nm Si(288nm)处的硅原子的发射强度与腔室中等离子体发射的484nmHβ处的氢原子的发射强度的比[Si(288nm)/Hβ] 。 版权所有(C)2009,JPO&INPIT
    • 9. 发明专利
    • FORMATION OF POLYCRYSTALLINE SILICON FILM
    • JPH0641748A
    • 1994-02-15
    • JP19871892
    • 1992-07-24
    • NISSIN ELECTRIC CO LTD
    • MURAKAMI HIROSHIKIRIMURA HIROYAHAYASHI TSUKASA
    • C23C16/24H01L21/205
    • PURPOSE:To enable film formation on a base body without heating the base body by supplying tetramethylsilane or tetraethylsilane to the base body, exposing the base body to hydrogen plasma and irradiating the base body with hydrogen ions. CONSTITUTION:The base body 10 installed on an electrode 3 is maintained at a temp. lower than the b.p. of a raw material G1 by a cooler 4. While a prescribed vacuum degree is maintained in a film forming chamber 1, gaseous hydrogen G is introduced from a gas introducing part 7 into the chamber and a high-frequency voltage is impressed between the electrodes 3 and 30 to convert the gaseous hydrogen G2 to plasma. The gaseous tetramethylsilane or tetraethylsilane G1 is blown from a gaseous raw material supply nozzle 5 onto the surface of the base body 10. The gas G1 is adsorbed and deposited on the base body 10 and is cracked by the plasma. The gaseous hydrogen G3 is simultaneously introduced to an ion source 6 and an ion beam is drawn out. The base body 10 is irradiated with the ion beam. The adsorbed raw material is cracked and the desired polycrystalline silicon film 10a is formed on the base body 10.