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1. 发明申请

US20030178190A1 Foil heat sink and a method for fabricating same 失效
标题翻译：箔散热器及其制造方法
公开(公告)号：US20030178190A1
公开(公告)日：2003-09-25
申请号：US10105698
申请日：2002-03-25
申请人： International Business Machines Corporation
发明人： Michael J. Ellsworth JR. , Egidio Marotta , Budy D. Notohardjono , Roger R. Schmidt , Prabjit Singh
IPC分类号： F28F007/00
CPC分类号： F28F21/02 , F28F3/02 , H01L23/3672 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A design and method for fabricating a foil heat sink including a fm body, wherein the fin body includes a plurality of heat sink fins having a fin head and a fin foot and wherein the plurality of heat sink fins are disposed in a parallel fashion so as to form a plurality of horizontal channels between the plurality of heat sink fins, a fin support, wherein the fin support includes a plurality of fin support structures disposed between the plurality of heat sink fins so as to separate the plurality of heat sink fins and wherein the plurality of fin support structures are disposed adjacent to the fin head so as to form a plurality of vertical channels between the plurality of heat sink fins, and a fin base, wherein the fin base includes a plurality of fin spacers disposed between the plurality of heat sink fins so as to separate the plurality of heat sink fins and wherein the plurality of fin spacers are disposed so as to be adjacent to the fin foot.
摘要翻译：一种用于制造包括fm主体的箔散热器的设计和方法，其中所述鳍体包括多个散热鳍片，散热鳍片具有翅片头和鳍脚，并且其中所述多个散热鳍片以平行方式设置，以在所述多个散热鳍片之间形成多个水平通道，翅片支撑件，其中所述翅片支撑件包括设置在所述多个散热鳍片之间的多个翅片支撑结构，以分离所述多个散热鳍片，并且其中所述多个翅片支撑结构设置成与所述翅片头相邻，以便在所述多个散热鳍片之间形成多个垂直通道，以及翅片基座，其中所述翅片基座包括多个翅片间隔件，散热翅片以分离多个散热鳍片，并且其中所述多个翅片间隔件设置成与鳍脚相邻。

2. 发明申请

US20040190247A1 Method for combined air and liquid cooling of stacked electronics components 有权
标题翻译：堆叠电子元件组合空气和液体冷却方法
公开(公告)号：US20040190247A1
公开(公告)日：2004-09-30
申请号：US10812694
申请日：2004-03-30
申请人： International Business Machines Corporation
发明人： Richard C. Chu , Michael J. Ellsworth JR. , Edward Furey , Roger R. Schmidt , Robert E. Simons
IPC分类号： G06F001/20 , H05K005/00
CPC分类号： H05K7/20754
摘要： An enclosure apparatus provides for combined air and liquid cooling of rack mounted stacked electronic components. A heat exchanger is mounted on the side of the stacked electronics and air flows side to side within the enclosure, impelled by air-moving devices mounted behind the electronics. Auxiliary air-moving devices may be mounted within the enclosure to increase the air flow. In an alternative embodiment, air-to-liquid heat exchangers are provided across the front and back of the enclosure, and a closed air flow loop is created by a converging supply plenum, electronics drawers through which air is directed by air-moving devices, diverging return plenum, and a connecting duct in the bottom. In a variant of this embodiment, connecting ducts are in both top and bottom, and supply and return ducts are doubly convergent and doubly divergent, respectively. Auxiliary blowers may be added to increase total system air flow. The enclosure also may be provided with automatically opening vent panels to allow room air to circulate and cool in the event of an over-temperature condition. The design of the enclosure permits it to be constructed apart from the rack-mounted apparatus and subsequently attached to the rack, if desired, at the facility at which the rack had been previously operating.
摘要翻译：机壳设备提供机架安装的堆叠式电子部件的组合的空气和液体冷却。热交换器安装在堆叠的电子设备的侧面上，空气在壳体内侧向流动，由安装在电子设备后面的气动装置推动。辅助气动装置可以安装在外壳内以增加气流。在替代实施例中，空气到液体的热交换器跨过外壳的前部和后部设置，并且封闭的空气流动回路由会聚的供气室，电子抽屉产生，空气通过空气移动装置引导，发散的回风室，底部有一个连接管。在该实施例的变型中，连接管道位于顶部和底部，并且供应和返回管道分别是双收敛和双重发散的。可以添加辅助鼓风机以增加总系统空气流量。外壳还可以设置有自动打开的通气面板，以允许室内空气在过温情况下循环和冷却。外壳的设计允许其与机架安装的设备分开构造，并且如果需要，则在机架先前已经操作的设施处随后附接到机架上。

3. 发明申请

US20040100770A1 METHOD AND APPARATUS FOR COMBINED AIR AND LIQUID COOLING OF STACKED ELECTRONICS COMPONENTS 有权
标题翻译：用于组合电子元件的组合空气和液体冷却的方法和装置
公开(公告)号：US20040100770A1
公开(公告)日：2004-05-27
申请号：US10303284
申请日：2002-11-25
申请人： International Business Machines Corporation
发明人： Richard C. Chu , Michael J. Ellsworth JR. , Edward Furey , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K007/20
CPC分类号： H05K7/20754
摘要： An enclosure apparatus provides for combined air and liquid cooling of rack mounted stacked electronic components. A heat exchanger is mounted on the side of the stacked electronics and air flows side to side within the enclosure, impelled by air-moving devices mounted behind the electronics. Auxiliary air-moving devices may be mounted within the enclosure to increase the air flow. In an alternative embodiment, air-to-liquid heat exchangers are provided across the front and back of the enclosure, and a closed air flow loop is created by a converging supply plenum, electronics drawers through which air is directed by air-moving devices, diverging return plenum, and a connecting duct in the bottom. In a variant of this embodiment, connecting ducts are in both top and bottom, and supply and return ducts are doubly convergent and doubly divergent, respectively. Auxiliary blowers may be added to increase total system air flow. The enclosure also may be provided with automatically opening vent panels to allow room air to circulate and cool in the event of an over-temperature condition. The design of the enclosure permits it to be constructed apart from the rack-mounted apparatus and subsequently attached to the rack, if desired, at the facility at which the rack had been previously operating.
摘要翻译：机壳设备提供机架安装的堆叠式电子部件的组合的空气和液体冷却。热交换器安装在堆叠的电子设备的侧面上，空气在壳体内侧向流动，由安装在电子设备后面的气动装置推动。辅助气动装置可以安装在外壳内以增加气流。在替代实施例中，空气到液体的热交换器跨过外壳的前部和后部设置，并且封闭的空气流动回路由会聚的供气室，电子抽屉产生，空气通过空气移动装置引导，发散的回风室，底部有一个连接管。在该实施例的变型中，连接管道位于顶部和底部，并且供应和返回管道分别是双收敛和双重发散的。可以添加辅助鼓风机以增加总系统空气流量。外壳还可以设置有自动打开的通气面板，以允许室内空气在过温情况下循环和冷却。外壳的设计允许其与机架安装的设备分开构造，并且如果需要，则在机架先前已经操作的设施处随后附接到机架上。

4. 发明申请

US20040085732A1 STACKABLE LIQUID COOLING PUMP 有权
标题翻译：可堆叠液体冷却泵
公开(公告)号：US20040085732A1
公开(公告)日：2004-05-06
申请号：US10283727
申请日：2002-10-30
申请人： International Business Machines Corporation
发明人： William E. Cox , Roger R. Schmidt
IPC分类号： H05K007/20
CPC分类号： F04D13/14 , F28F2250/08 , G06F1/20 , G06F1/206 , G06F2200/201
摘要： Electronic system components are cooled using a field configurable pump comprising a selectable plurality of identical or nearly identical modular pump units. The pump units are disposed in a stacked arrangement and are fluidly connected to adjacent modular pump units via a removable coupling, preferably one of the quick-disconnect variety. Each modular pump unit comprises a housing, an impeller and a sealing mechanism. When disposed in a stack the combined pump structure is driven by a single motor. In this fashion, pump structures may be employed which are adaptable to heat flux demands imposed by the electronic components.
摘要翻译：使用包括可选择的多个相同或几乎相同的模块化泵单元的现场可配置泵来冷却电子系统部件。泵单元被布置成堆叠布置，并且经由可移除的联接件，优选地是快速断开连接件之一流体地连接到相邻的模块化泵单元。每个模块化泵单元包括壳体，叶轮和密封机构。当组装在堆叠中时，组合的泵结构由单个电动机驱动。以这种方式，可以采用适用于由电子部件施加的热通量需求的泵结构。

5. 发明申请

US20030011394A1 Self-aligning wafer burn-in probe 失效
标题翻译：自对准晶圆老化探头
公开(公告)号：US20030011394A1
公开(公告)日：2003-01-16
申请号：US09902964
申请日：2001-07-11
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Budy D. Notohardjono , Roger R. Schmidt
IPC分类号： G01R031/02
CPC分类号： G01R1/06761 , G01R1/07357
摘要： The material and geometric properties of an electrical probe contact are combined to produce an electrical contact which is capable of self-alignment over many thousands of uses. The probe contact moves substantially only in a vertical direction and provides a consistent contact force with corresponding electrical contact pads on a semiconductor wafer. The probe contacts are configured in an array of a large plurality of individual contacts which extend from a base to which they are attached through apertures in an overlying mask spaced apart from the base.
摘要翻译：电探针接触件的材料和几何特性被组合以产生能够在数千种用途上进行自对准的电触点。探针接触基本上仅在垂直方向上移动并且提供与半导体晶片上的对应电接触焊盘一致的接触力。探针触点构造成大量多个单独触头的阵列，该多个单独的触点从与底座间隔开的上覆掩模中的孔穿过的底座延伸穿过。

6. 发明申请

US20040050231A1 SCALABLE COOLANT CONDITIONING UNIT WITH INTEGRAL PLATE HEAT EXCHANGER/EXPANSION TANK AND METHOD OF USE 有权
标题翻译：具有整体板式换热器/膨胀罐的可分级冷却液调节装置及其使用方法
公开(公告)号：US20040050231A1
公开(公告)日：2004-03-18
申请号：US10243708
申请日：2002-09-13
申请人： International Business Machines Corporation
发明人： Richard C. Chu , Michael J. Ellsworth JR. , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K007/20 , B26D005/08
CPC分类号： H05K7/2079 , Y10T83/8763 , Y10T83/8822
摘要： A scalable coolant conditioning unit (SCCU) is designed to accommodate removable modular pumping units (MPU's). The MPU's may comprise one or a plurality of pump/pump motor combinations. The MPU's are connected to coolant supply and discharge mechanisms by an insertion facilitation mechanism comprising an automatic coupling assembly and an isolation valve mechanism and are placed into and removed from the SCCU body with the aid of a seating mechanism. MPU's are added to an operating SCCU as needed to support increased heat loads of electronics frames. A plate heat exchanger is physically integrated within the expansion tank, reducing volumetric requirements for the SCCU and is sized to accommodate the maximum heat load.
摘要翻译：可扩展的冷却液调节单元（SCCU）设计用于容纳可移动模块化抽油机（MPU）。 MPU可以包括一个或多个泵/泵电机组合。 MPU通过包括自动联接组件和隔离阀机构的插入促进机构连接到冷却剂供应和排出机构，并且借助于就座机构放置到SCCU主体中并从SCCU主体移除。根据需要将MPU添加到操作的SCCU以支持电子框架的增加的热负荷。板式换热器物理上集成在膨胀箱内，减少了SCCU的体积要求，其尺寸适应最大的热负荷。

7. 发明申请

US20010050567A1 Segmented architecture for wafer test & burn-in 审中-公开
标题翻译：晶圆测试和老化的分段架构
公开(公告)号：US20010050567A1
公开(公告)日：2001-12-13
申请号：US09887211
申请日：2001-06-22
申请人： International Business Machines Corporation
发明人： Thomas W. Bachelder , Dennis R. Barringer , Dennis R. Conti , James M. Crafts , David L. Gardell , Paul M. Gaschke , Mark R. Laforce , Charles H. Perry , Roger R. Schmidt , Joseph J. Van Horn , Wade H. White
IPC分类号： G01R031/02
CPC分类号： G01R31/2863
摘要： An apparatus for simultaneously testing or burning in a large number of the integrated circuit chips on a product wafer includes probes mounted on a first board and tester chips mounted on a second board, there being electrical connectors connecting the two boards. The tester chips are for distributing power to the product chips or for testing the product chips. The probes and thin film wiring to which they are attached are personalized for the pad footprint of the particular wafer being probed. The base of the first board and the second board both remain the same for all wafers in a product family. The use of two boards provides that the tester chip is kept at a substantially lower temperature than the product chips during burn-in to extend the lifetime of tester chips. A gap can be used as thermal insulation between the boards, and the gap sealed and evacuated for further thermal insulation. Evacuation also provides atmospheric pressure augmentation of contact for connection between boards and contact to wafer. Probes for parallel testing of chips are arranged in crescent shaped stripes to significantly increase tester throughput as compared with probes arranged in an area array.
摘要翻译：用于在产品晶片上同时测试或燃烧大量集成电路芯片的装置包括安装在第一板上的探针和安装在第二板上的测试器芯片，连接两个板的电连接器。测试器芯片用于向产品芯片分配电力或用于测试产品芯片。其所附接的探针和薄膜布线被个性化以用于被探测的特定晶片的焊盘覆盖区。第一板和第二板的基座对于产品系列中的所有晶片都保持不变。使用两块板可以使测试仪芯片在老化期间保持在比产品芯片低得多的温度，以延长测试芯片的使用寿命。间隙可以用作板之间的绝热，并将间隙密封并抽真空以进行进一步的隔热。疏散还提供大气压力增加的接触，用于连接板和与晶片的接触。用于平行测试芯片的探针被布置成月牙形条纹，以便与布置在区域阵列中的探针相比显着增加测试仪的吞吐量。

8. 发明申请

US20040095721A1 Frame level partial cooling boost for drawer and/or node level processors 有权
标题翻译：抽屉和/或节点级处理器的帧级部分冷却提升
公开(公告)号：US20040095721A1
公开(公告)日：2004-05-20
申请号：US10300615
申请日：2002-11-20
申请人： International Business Machines Corporation
发明人： Michael J. Ellsworth JR. , Bret W. Lehman , Jason A. Matteson , Roger R. Schmidt
IPC分类号： H05K007/20
CPC分类号： H05K7/207 , H01L23/467 , H01L2924/0002 , H05K7/20781 , H01L2924/00
摘要： A hybrid cooling system is provided which is particularly useful for cooling electronic circuit components disposed on circuit boards arranged in a plurality of drawers within a cabinet or frame. Air cooling is provided locally with a supplementary, auxiliary, or secondary cooling system being provided at more distant frame level locations. This configuration permits optimal sizing of the respective hybrid cooling system components without negatively impacting the coefficient of performance (COP). Hybrid heat sinks are employed to accommodate the hybrid cooling system design.
摘要翻译：提供了一种混合冷却系统，其特别适用于冷却布置在橱柜或框架内的多个抽屉中的电路板上的电子电路部件。在本地提供空气冷却，在更远的框架水平位置处设置辅助，辅助或二次冷却系统。这种配置允许相应的混合冷却系统部件的最佳尺寸，而不会不利地影响性能系数（COP）。采用混合散热器来适应混合冷却系统设计。

9. 发明申请

US20030203181A1 Interstitial material with enhanced thermal conductance for semiconductor device packaging 审中-公开
标题翻译：用于半导体器件封装的具有增强的导热性的间隙材料
公开(公告)号：US20030203181A1
公开(公告)日：2003-10-30
申请号：US10134577
申请日：2002-04-29
申请人： International Business Machines Corporation
发明人： Michael J. Ellsworth JR. , Mark A. Marnell , Egidio Marotta , Steven J. Mazzuca , Roger R. Schmidt
IPC分类号： B32B003/06
CPC分类号： H01L23/367 , H01L23/4275 , H01L2924/0002 , Y10T428/249956 , Y10T428/24999 , Y10T428/249991 , H01L2924/00
摘要： A thermal interface material for conducting thermal energy between a first surface and a second surface is disclosed. In an exemplary embodiment, the thermal interface material includes a non-metallic support layer and a phase change material coated on the support layer. At a transition temperature of the phase change material, the phase change material is caused to flow into gaps present between the support layer and the first and second surfaces. In addition, phase change compound (PCC) materials may be formulated to solid phase transition over a desired temperature range, such that in a the solid phase transition mode, a structured cell/laminate may be employed as a thermal energy storage unit which can provide thermal load-damping capabilities due to its latent heat effect.
摘要翻译：公开了一种用于在第一表面和第二表面之间传导热能的热界面材料。在示例性实施例中，热界面材料包括涂覆在支撑层上的非金属支撑层和相变材料。在相变材料的转变温度下，使相变材料流入存在于支撑层与第一和第二表面之间的间隙中。此外，相变化合物（PCC）材料可以在所需温度范围内配制成固相转变，使得在固相转变模式中，可以使用结构化电池/层压材料作为热能存储单元，其可以提供由于其潜热效应，热负载阻尼功能。

10. 发明申请

US20020092594A1 Fixture for securing hard stops to a substrate 失效
标题翻译：用于将硬止动件固定到基板的夹具
公开(公告)号：US20020092594A1
公开(公告)日：2002-07-18
申请号：US09764592
申请日：2001-01-18
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Dennis Barringer , Mark A. Marnell , Steven J. Mazzuca , Donald W. Porter , Roger R. Schmidt , Wade H. White
IPC分类号： B32B031/00
CPC分类号： G01R1/0408 , G01R31/2887 , Y10S269/903 , Y10T156/17 , Y10T156/1744
摘要： An exemplary embodiment is a fixture for securing hard stops to a substrate. The fixture has a base which provides support to the fixture. The base has a cavity configured for nestably supporting a substrate. A top plate is mounted on the base, the top plate is configured for mounting the substrate. An alignment plate is disposed on the top plate separate from the base. An adjusting plunger assembly is coupled to the base. The adjusting plunger assembly is configured for use with attaching a hard stop to the substrate. A plunger is coupled to the base substantially perpendicular to the adjusting plunger assembly. The plunger is configured for use with supporting the substrate. A method of using a fixture is disclosed comprising disposing a substrate in a base of the fixture and mounting a hard stop to the substrate. An adhesive is disposed between the hard stop and the substrate. The substrate is mounted between a plunger and a top plate. The hard stop on the substrate is aligned with an alignment plate. An adjusting plunger assembly is adjusted to mount the hard stop to the substrate.
摘要翻译：示例性实施例是用于将硬止动件固定到基底的夹具。该固定装置具有为夹具提供支撑的基座。基座具有被配置为可嵌套地支撑衬底的空腔。顶板安装在基座上，顶板被配置用于安装基板。对准板设置在与基座分开的顶板上。调节柱塞组件联接到基座。调节柱塞组件构造成用于将硬止动件附接到基底上。柱塞与基座垂直于调节柱塞组件联接到基座。柱塞构造成用于支撑衬底。公开了一种使用固定装置的方法，包括将基板设置在固定装置的基座中，并将硬止动件安装到基板上。粘合剂设置在硬止动件和基板之间。衬底安装在柱塞和顶板之间。基板上的硬止动件与对准板对准。调节柱塞组件被调节以将硬质止挡件安装到基板上。

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