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1. 发明申请

US20020117716A1 Power mosfet device, structures employing the same and methods of fabrication 有权
标题翻译：功率MOSFET器件，采用相同的结构和制造方法
公开(公告)号：US20020117716A1
公开(公告)日：2002-08-29
申请号：US09794937
申请日：2001-02-27
申请人： International Business Machines Corporation
发明人： Frank E. Bosco , George T. Galyon , Steven J. Mazzuca , Prabjit Singh
IPC分类号： H01L029/76
CPC分类号： H01L29/7802 , H01L29/0696 , H01L29/0847 , H01L29/41 , H02M7/5387
摘要： A semiconductor device, full bridge converter employing the same, and methods of fabrication thereof are provided. The device includes a vertical MOSFET having a parasitic body diode at a junction face between a body region and a semiconductor layer thereof. The parasitic body diode is suppressed by having no direct electrical connection to the body region, resulting in the parasitic body diode being open-circuited within the MOSFET. Co-packaged with the MOSFET is a separate bypass diode connected across a source and a drain of the MOSFET. The bypass diode functions to clamp the voltage across the MOSFET without employing the parasitic, electrically isolated body diode of the MOSFET.
摘要翻译：提供一种半导体器件，采用该半导体器件的全桥转换器及其制造方法。该器件包括在体区和半导体层之间的接合面处具有寄生体二极管的垂直MOSFET。通过与体区没有直接的电连接来抑制寄生体二极管，导致寄生体二极管在MOSFET内开路。与MOSFET共同封装的是在MOSFET的源极和漏极之间连接的单独的旁路二极管。旁路二极管用于钳位MOSFET上的电压，而不使用MOSFET的寄生，电隔离体二极管。

2. 发明申请

US20030203181A1 Interstitial material with enhanced thermal conductance for semiconductor device packaging 审中-公开
标题翻译：用于半导体器件封装的具有增强的导热性的间隙材料
公开(公告)号：US20030203181A1
公开(公告)日：2003-10-30
申请号：US10134577
申请日：2002-04-29
申请人： International Business Machines Corporation
发明人： Michael J. Ellsworth JR. , Mark A. Marnell , Egidio Marotta , Steven J. Mazzuca , Roger R. Schmidt
IPC分类号： B32B003/06
CPC分类号： H01L23/367 , H01L23/4275 , H01L2924/0002 , Y10T428/249956 , Y10T428/24999 , Y10T428/249991 , H01L2924/00
摘要： A thermal interface material for conducting thermal energy between a first surface and a second surface is disclosed. In an exemplary embodiment, the thermal interface material includes a non-metallic support layer and a phase change material coated on the support layer. At a transition temperature of the phase change material, the phase change material is caused to flow into gaps present between the support layer and the first and second surfaces. In addition, phase change compound (PCC) materials may be formulated to solid phase transition over a desired temperature range, such that in a the solid phase transition mode, a structured cell/laminate may be employed as a thermal energy storage unit which can provide thermal load-damping capabilities due to its latent heat effect.
摘要翻译：公开了一种用于在第一表面和第二表面之间传导热能的热界面材料。在示例性实施例中，热界面材料包括涂覆在支撑层上的非金属支撑层和相变材料。在相变材料的转变温度下，使相变材料流入存在于支撑层与第一和第二表面之间的间隙中。此外，相变化合物（PCC）材料可以在所需温度范围内配制成固相转变，使得在固相转变模式中，可以使用结构化电池/层压材料作为热能存储单元，其可以提供由于其潜热效应，热负载阻尼功能。

3. 发明申请

US20020092594A1 Fixture for securing hard stops to a substrate 失效
标题翻译：用于将硬止动件固定到基板的夹具
公开(公告)号：US20020092594A1
公开(公告)日：2002-07-18
申请号：US09764592
申请日：2001-01-18
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Dennis Barringer , Mark A. Marnell , Steven J. Mazzuca , Donald W. Porter , Roger R. Schmidt , Wade H. White
IPC分类号： B32B031/00
CPC分类号： G01R1/0408 , G01R31/2887 , Y10S269/903 , Y10T156/17 , Y10T156/1744
摘要： An exemplary embodiment is a fixture for securing hard stops to a substrate. The fixture has a base which provides support to the fixture. The base has a cavity configured for nestably supporting a substrate. A top plate is mounted on the base, the top plate is configured for mounting the substrate. An alignment plate is disposed on the top plate separate from the base. An adjusting plunger assembly is coupled to the base. The adjusting plunger assembly is configured for use with attaching a hard stop to the substrate. A plunger is coupled to the base substantially perpendicular to the adjusting plunger assembly. The plunger is configured for use with supporting the substrate. A method of using a fixture is disclosed comprising disposing a substrate in a base of the fixture and mounting a hard stop to the substrate. An adhesive is disposed between the hard stop and the substrate. The substrate is mounted between a plunger and a top plate. The hard stop on the substrate is aligned with an alignment plate. An adjusting plunger assembly is adjusted to mount the hard stop to the substrate.
摘要翻译：示例性实施例是用于将硬止动件固定到基底的夹具。该固定装置具有为夹具提供支撑的基座。基座具有被配置为可嵌套地支撑衬底的空腔。顶板安装在基座上，顶板被配置用于安装基板。对准板设置在与基座分开的顶板上。调节柱塞组件联接到基座。调节柱塞组件构造成用于将硬止动件附接到基底上。柱塞与基座垂直于调节柱塞组件联接到基座。柱塞构造成用于支撑衬底。公开了一种使用固定装置的方法，包括将基板设置在固定装置的基座中，并将硬止动件安装到基板上。粘合剂设置在硬止动件和基板之间。衬底安装在柱塞和顶板之间。基板上的硬止动件与对准板对准。调节柱塞组件被调节以将硬质止挡件安装到基板上。

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