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    • 5. 发明申请
    • SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME
    • 半导体器件及其形成方法
    • US20110133306A1
    • 2011-06-09
    • US12788542
    • 2010-05-27
    • In Gyoo KIMDae Seo ParkJun Taek HongGyungock Kim
    • In Gyoo KIMDae Seo ParkJun Taek HongGyungock Kim
    • H01L29/06H01L21/762
    • H01L21/7624H01L21/76243H01L21/76264H01L29/0657
    • Provided are a semiconductor device and a method of forming the same. According to the method, a first buried oxide layer is locally formed in a semiconductor substrate and a core semiconductor pattern of a line form, a pair of anchor-semiconductor patterns and a support-semiconductor pattern are formed by patterning a semiconductor layer on the first buried oxide layer to expose the first buried oxide layer. The pair of anchor-semiconductor patterns contact both ends of the core semiconductor pattern, respectively, and the support-semiconductor pattern contacts one sidewall of the core semiconductor pattern, the first buried oxide layer below the core semiconductor pattern is removed. At this time, a portion of the first buried oxide layer below each of the anchor-semiconductor patterns and a portion of the first buried oxide layer below the support-semiconductor pattern remain. A second buried oxide layer is formed to fill a region where the first buried oxide layer below the core semiconductor pattern.
    • 提供半导体器件及其形成方法。 根据该方法,在半导体衬底中局部地形成第一掩埋氧化物层,并且通过在第一衬底上图案化半导体层来形成线形式的芯半导体图案,一对锚半导体图案和支撑半导体图案 埋入氧化物层以暴露第一掩埋氧化物层。 一对锚半导体图案分别接触芯半导体图案的两端,并且支撑半导体图案接触芯半导体图案的一个侧壁,去除芯半导体图案下方的第一掩埋氧化物层。 此时,保留在半导体图案的每一个下面的第一掩埋氧化物层的一部分和位于载体半导体图案之下的第一掩埋氧化物层的一部分。 形成第二掩埋氧化物层以填充在芯半导体图案之下的第一掩埋氧化物层的区域。
    • 7. 发明申请
    • METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING OPTICAL DEVICES
    • 制造具有光学器件的半导体器件的方法
    • US20110136318A1
    • 2011-06-09
    • US12783216
    • 2010-05-19
    • In Gyoo KIMDae Seo ParkJun Taek HongGyungock Kim
    • In Gyoo KIMDae Seo ParkJun Taek HongGyungock Kim
    • H01L21/31
    • G02B6/136G02B6/132G02F1/2257G02F2001/212G02F2203/15H01L27/1203
    • Provided is a method of manufacturing a semiconductor device. According to the method, a first buried oxide layer is formed in the semiconductor substrate in a first region, such that a first semiconductor layer is defined on the first buried oxide layer. An active portion is defined by forming a trench in the semiconductor substrate in a second region. A capping semiconductor pattern is formed on a top surface and an upper portion of a sidewall of the active portion. An oxide layer is formed by oxidizing the capping semiconductor pattern and an exposed lower portion of the sidewall of the active portion, such that the oxide layer surrounds a non-oxidized portion of the active portion. The non-oxidized portion of the active portion is a core and one end of the core is connected to a first optical device formed at the first semiconductor.
    • 提供一种制造半导体器件的方法。 根据该方法,在第一区域中的半导体衬底中形成第一掩埋氧化物层,使得第一半导体层被限定在第一掩埋氧化物层上。 通过在第二区域中在半导体衬底中形成沟槽来限定有源部分。 在有源部分的侧壁的顶表面和上部形成封盖半导体图案。 通过氧化覆盖半导体图案和有源部分的侧壁的暴露下部来形成氧化物层,使得氧化物层包围有源部分的未氧化部分。 有源部分的未氧化部分是芯,并且芯的一端连接到形成在第一半导体处的第一光学器件。