会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明申请
    • IMAGE SENSORS
    • 图像传感器
    • US20130221465A1
    • 2013-08-29
    • US13599960
    • 2012-08-30
    • Sang-Hoon KIMChang-Rok MOON
    • Sang-Hoon KIMChang-Rok MOON
    • H01L31/0232
    • H01L27/14636H01L27/1464H01L27/14689
    • Image sensors include a first insulation interlayer structure on a first surface of a substrate and having a multi-layered structure. A first wiring structure is in the first insulation interlayer structure. A via contact plug extends from a second surface of the substrate and penetrates the substrate to be electrically connected to the first wiring structure. Color filters and micro lenses are stacked on the second surface in a first region of the substrate. A second insulation interlayer structure is on the second surface in a second region of the substrate. A second wiring structure is in the second insulation interlayer structure to be electrically connected to the via contact plug. A pad pattern is electrically connected to the second wiring structure and having an upper surface through which an external electrical signal is applied. Photodiodes are between the first and second wiring structures in the first region.
    • 图像传感器包括在基板的第一表面上的具有多层结构的第一绝缘夹层结构。 第一布线结构处于第一绝缘夹层结构中。 通孔接触插塞从基板的第二表面延伸并穿透基板以电连接到第一布线结构。 彩色滤光器和微透镜在衬底的第一区域中的第二表面上堆叠。 第二绝缘层间结构位于衬底的第二区域中的第二表面上。 第二布线结构在第二绝缘层间结构中,以电连接到通孔接触插塞。 焊盘图案电连接到第二布线结构,并且具有施加外部电信号的上表面。 光电二极管位于第一区域中的第一和第二布线结构之间。