专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20050225347A1 Wireless test cassette 有权
标题翻译：无线测试盒
公开(公告)号：US20050225347A1
公开(公告)日：2005-10-13
申请号：US10820319
申请日：2004-04-08
申请人： Igor Khandros , Benjamin Eldridge , Charles Miller , A. Sporck
发明人： Igor Khandros , Benjamin Eldridge , Charles Miller , A. Sporck
IPC分类号： G01R1/073 , G01R31/02 , G01R31/26
CPC分类号： G01R1/0491 , G01R1/073 , G01R31/3025
摘要： A base controller disposed in a test cassette receives test data for testing a plurality of electronic devices. The base controller wirelessly transmits the test data to a plurality of wireless test control chips, which write the test data to each of the electronic devices. The wireless test control chips then read response data generated by the electronic devices, and the wireless test control chips wirelessly transmit the response data to the base controller.
摘要翻译：设置在测试盒中的基本控制器接收用于测试多个电子设备的测试数据。基站控制器将测试数据无线传输到多个无线测试控制芯片，其将测试数据写入每个电子设备。然后，无线测试控制芯片读取由电子设备产生的响应数据，无线测试控制芯片将响应数据无线发送到基本控制器。

2. 发明申请

US20070210822A1 WIRELESS TEST SYSTEM 有权
标题翻译：无线测试系统
公开(公告)号：US20070210822A1
公开(公告)日：2007-09-13
申请号：US11749004
申请日：2007-05-15
申请人： Igor Khandros , Benjamin Eldridge , A. Sporck , Charles Miller
发明人： Igor Khandros , Benjamin Eldridge , A. Sporck , Charles Miller
IPC分类号： G01R31/26
CPC分类号： G01R31/3025 , G01R31/31907 , G01R31/31908
摘要： One or more testers wirelessly communicate with one or more test stations. The wireless communication may include transmission of test commands and/or test vectors to a test station, resulting in testing of one or more electronic devices at the test station. The wireless communication may also include transmission of test results to a tester. Messages may also be wirelessly exchanged.
摘要翻译：一个或多个测试人员与一个或多个测试台无线通信。无线通信可以包括将测试命令和/或测试向量发送到测试站，导致测试台上的一个或多个电子设备的测试。无线通信还可以包括将测试结果传输给测试者。消息也可以被无线地交换。

3. 发明申请

US20070182438A1 Wireless Test Cassette 失效
标题翻译：无线测试盒
公开(公告)号：US20070182438A1
公开(公告)日：2007-08-09
申请号：US11696582
申请日：2007-04-04
申请人： Igor Khandros , Benjamin Eldridge , Charles Miller , A. Sporck
发明人： Igor Khandros , Benjamin Eldridge , Charles Miller , A. Sporck
IPC分类号： G01R31/26
CPC分类号： G01R1/0491 , G01R1/073 , G01R31/3025
摘要： A base controller disposed in a test cassette receives test data for testing a plurality of electronic devices. The base controller wirelessly transmits the test data to a plurality of wireless test control chips, which write the test data to each of the electronic devices. The wireless test control chips then read response data generated by the electronic devices, and the wireless test control chips wirelessly transmit the response data to the base controller.
摘要翻译：设置在测试盒中的基本控制器接收用于测试多个电子设备的测试数据。基站控制器将测试数据无线传输到多个无线测试控制芯片，其将测试数据写入每个电子设备。然后，无线测试控制芯片读取由电子设备产生的响应数据，无线测试控制芯片将响应数据无线发送到基本控制器。

4. 发明申请

US20050086021A1 Wireless test system 有权
标题翻译：无线测试系统
公开(公告)号：US20050086021A1
公开(公告)日：2005-04-21
申请号：US10690170
申请日：2003-10-21
申请人： Igor Khandros , Benjamin Eldridge , A. Sporck , Charles Miller
发明人： Igor Khandros , Benjamin Eldridge , A. Sporck , Charles Miller
IPC分类号： G01R31/319 , G06F19/00 , G01R31/00
CPC分类号： G01R31/3025 , G01R31/31907 , G01R31/31908
摘要： One or more testers wirelessly communicate with one or more test stations. The wireless communication may include transmission of test commands and/or test vectors to a test station, resulting in testing of one or more electronic devices at the test station. The wireless communication may also include transmission of test results to a tester. Messages may also be wirelessly exchanged.
摘要翻译：一个或多个测试人员与一个或多个测试台无线通信。无线通信可以包括将测试命令和/或测试向量发送到测试站，导致测试台上的一个或多个电子设备的测试。无线通信还可以包括将测试结果传输给测试者。消息也可以被无线地交换。

5. 发明申请

US20060279300A1 Probe Card Assembly And Kit 失效
标题翻译：探头卡组合和套件
公开(公告)号：US20060279300A1
公开(公告)日：2006-12-14
申请号：US11423808
申请日：2006-06-13
申请人： Igor Khandros , A. Sporck , Benjamin Eldridge
发明人： Igor Khandros , A. Sporck , Benjamin Eldridge
IPC分类号： G01R31/02
CPC分类号： H05K3/4015 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/06711 , G01R1/07342 , G01R1/07364 , G01R1/07378 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/76897 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/1134 , H01L2224/13099 , H01L2224/16145 , H01L2224/45014 , H01L2224/45144 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01045 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4092 , H05K7/1069 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2224/48 , H01L2224/05599
摘要： In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.
摘要翻译：在探针卡组件中，可以将一系列探针元件排列在硅空间变压器上。硅空间变压器可以以与半导体器件的间距相当的非常紧密的间距的主要触点阵列制造。一个优选的主要接触是弹性弹簧接触。空间变压器中的导电元件以更放松的间距被路由到第二触点。在一个优选实施例中，第二触点适于直接连接带状电缆，带状电缆又可连接以提供对每个主触点的选择性连接。硅空间变压器安装在固定装置中，其提供与待测试的晶片或装置的弹性连接。可以调整该夹具以使主触头与支撑探针卡板的平面平坦化。

6. 发明申请

US20050035347A1 Probe card assembly 失效
标题翻译：探头卡组合
公开(公告)号：US20050035347A1
公开(公告)日：2005-02-17
申请号：US10889334
申请日：2004-07-12
申请人： Igor Khandros , A. Sporck , Benjamin Eldridge
发明人： Igor Khandros , A. Sporck , Benjamin Eldridge
IPC分类号： B23K1/00 , B23K20/00 , C23C18/16 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/04 , G01R1/067 , G01R1/073 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L21/603 , H01L21/66 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L25/065 , H01L25/16 , H05K1/14 , H05K3/20 , H05K3/30 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40 , H05K7/10 , H01L23/58
CPC分类号： H05K3/4015 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/06711 , G01R1/07342 , G01R1/07364 , G01R1/07378 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/76897 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/1134 , H01L2224/13099 , H01L2224/16145 , H01L2224/45014 , H01L2224/45144 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01045 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4092 , H05K7/1069 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2224/48 , H01L2224/05599
摘要： In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.
摘要翻译：在探针卡组件中，可以将一系列探针元件排列在硅空间变压器上。硅空间变压器可以以与半导体器件的间距相当的非常紧密的间距的主要触点阵列制造。一个优选的主要接触是弹性弹簧接触。空间变压器中的导电元件以更放松的间距被路由到第二触点。在一个优选实施例中，第二触点适于直接连接带状电缆，带状电缆又可连接以提供对每个主触点的选择性连接。硅空间变压器安装在固定装置中，其提供与待测试的晶片或装置的弹性连接。可以调整该夹具以使主触头与支撑探针卡板的平面平坦化。

7. 发明申请

US20070063721A1 Apparatus And Method Of Testing Singulated Dies 有权
标题翻译：测试单位模具的装置和方法
公开(公告)号：US20070063721A1
公开(公告)日：2007-03-22
申请号：US11532494
申请日：2006-09-15
申请人： Thomas Dozier , Benjamin Eldridge , David Hsu , Igor Khandros , Charles Miller
发明人： Thomas Dozier , Benjamin Eldridge , David Hsu , Igor Khandros , Charles Miller
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R31/2893 , G01R31/31905
摘要： An exemplary die carrier is disclosed. In some embodiments, the die carrier can hold a plurality of singulated dies while the dies are tested. The dies can be arranged on the carrier in a pattern that facilities testing the dies. The carrier can be configured to allow interchangeable interfaces to different testers to be attached to and detached from the carrier. The carrier can also be configured as a shipping container for the dies.
摘要翻译：公开了一种示例性的模具载体。在一些实施例中，模具载体可以在测试模具的同时保持多个单个模具。模具可以以对模具进行测试的模式布置在载体上。载体可以被配置为允许不同的测试仪的可互换的接口被附接到载体上并与载体分离。载体也可以被配置为模具的运输容器。

8. 发明申请

US20070285114A1 Socket For Making With Electronic Component, Particularly Semiconductor Device With Spring Packaging, For Fixturing, Testing, Burning-In Or Operating Such A Component 失效
标题翻译：用于制造电子元件的插座，特别是具有弹簧封装的半导体器件，用于固定，测试，燃烧或操作这样的部件
公开(公告)号：US20070285114A1
公开(公告)日：2007-12-13
申请号：US11733562
申请日：2007-04-10
申请人： David Pedersen , Benjamin Eldridge , Igor Khandros
发明人： David Pedersen , Benjamin Eldridge , Igor Khandros
IPC分类号： G01R31/02
CPC分类号： H01L25/16 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/0408 , G01R1/0433 , G01R1/06711 , G01R1/07342 , G01R1/07378 , G01R31/01 , G01R31/2863 , G01R31/2886 , G01R31/2889 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/04 , H01L23/13 , H01L23/32 , H01L23/49811 , H01L23/5385 , H01L24/06 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L2223/54473 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/05599 , H01L2224/06136 , H01L2224/1134 , H01L2224/13099 , H01L2224/16145 , H01L2224/45144 , H01L2224/49109 , H01L2224/73203 , H01L2224/81136 , H01L2224/81801 , H01L2224/85201 , H01L2224/85399 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01033 , H01L2924/01051 , H01L2924/01061 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/1532 , H01L2924/15787 , H01L2924/16152 , H01L2924/19043 , H05K1/141 , H05K3/20 , H05K3/325 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K2201/09472 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , H01L2924/00 , H01L2224/48
摘要： Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.
摘要翻译：提供产品和组件用于可插拔地接收从电子部件（例如半导体器件）延伸的细长互连元件，例如弹簧接触元件。插座基板设置有用于接收从电子部件延伸的细长互连元件的端部的捕获垫。公开了各种捕获垫结构。通过邻近插座基板表面的导电迹线提供与外部设备的连接。插座基板可以由支撑基板支撑。在特别优选的实施例中，捕获垫直接形成在诸如印刷电路板的主要基底上。

9. 发明申请

US20060006384A1 Special contact points for accessing internal circuitry of an intergrated circuit 审中-公开
标题翻译：用于访问集成电路内部电路的特殊接点
公开(公告)号：US20060006384A1
公开(公告)日：2006-01-12
申请号：US11221231
申请日：2005-09-06
申请人： Benjamin Eldridge , Igor Khandros , David Pedersen , Ralph Whitten
发明人： Benjamin Eldridge , Igor Khandros , David Pedersen , Ralph Whitten
IPC分类号： H01L23/58
CPC分类号： G01R1/07307 , G01R31/2884 , G01R31/31723 , H01L22/32 , H01L23/50 , H01L23/60 , H01L2224/0401 , H01L2224/05554 , H01L2224/16 , H01L2924/00013 , H01L2924/01079 , H01L2924/10253 , H01L2224/29099 , H01L2924/00
摘要： One embodiment of the present invention concerns an integrated circuit that includes bond pads and special contact pads or points. The bond pads are for interfacing the integrated circuit as a whole with an external circuit, and are to be bonded to a package or circuit board. The bond pads are disposed on the die in a predetermined alignment such as a peripheral, grid, or lead-on-center alignment. The special contact pads are used to provide external test patterns to internal circuits and/or to externally monitor results from testing the internal circuits. The special contact pads may be advantageously located on the integrated circuit with a high degree of positional freedom. For one embodiment, the special contact pads may be disposed on the die at a location that is not in the same alignment as the bond pads. The special contact pads may be smaller than the bond pads so as not to increase the die size due to the special contact pads. The special contact points may also be used to externally program internal circuits (e.g., nonvolatile circuits) at the die or package level. The special contact points may also be used to select redundant circuits for faulty circuits.
摘要翻译：本发明的一个实施例涉及包括接合焊盘和特殊接触焊盘或点的集成电路。接合焊盘用于将集成电路作为整体与外部电路接口，并且将被连接到封装或电路板。接合焊盘以预定的对准方式设置在管芯上，例如外围，栅格或中心对准。特殊接触焊盘用于向内部电路提供外部测试模式和/或外部监测测试内部电路的结果。特别的接触垫可以有利地以高度的位置自由度位于集成电路上。对于一个实施例，特殊接触焊盘可以在与焊盘不同于对准的位置处设置在管芯上。特殊的接触焊盘可以小于接合焊盘，以便不会由于特殊的接触垫而增加管芯的尺寸。特殊接触点也可以用于在芯片或封装级别外部编程内部电路（例如非易失性电路）。特殊接触点也可用于选择故障电路的冗余电路。

10. 发明申请

US20050146339A1 Method of manufacturing a probe card 有权
公开(公告)号：US20050146339A1
公开(公告)日：2005-07-07
申请号：US11073187
申请日：2005-03-04
申请人： Gary Grube , Igor Khandros , Benjamin Eldridge , Gaetan Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
发明人： Gary Grube , Igor Khandros , Benjamin Eldridge , Gaetan Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
IPC分类号： G01R31/26 , G01R1/073 , G01R31/28 , H01L21/66 , G01R31/02
CPC分类号： G01R31/2886 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07378 , G01R3/00 , Y10T29/49126
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式