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1. 发明申请

US20060006384A1 Special contact points for accessing internal circuitry of an intergrated circuit 审中-公开
标题翻译：用于访问集成电路内部电路的特殊接点
公开(公告)号：US20060006384A1
公开(公告)日：2006-01-12
申请号：US11221231
申请日：2005-09-06
申请人： Benjamin Eldridge , Igor Khandros , David Pedersen , Ralph Whitten
发明人： Benjamin Eldridge , Igor Khandros , David Pedersen , Ralph Whitten
IPC分类号： H01L23/58
CPC分类号： G01R1/07307 , G01R31/2884 , G01R31/31723 , H01L22/32 , H01L23/50 , H01L23/60 , H01L2224/0401 , H01L2224/05554 , H01L2224/16 , H01L2924/00013 , H01L2924/01079 , H01L2924/10253 , H01L2224/29099 , H01L2924/00
摘要： One embodiment of the present invention concerns an integrated circuit that includes bond pads and special contact pads or points. The bond pads are for interfacing the integrated circuit as a whole with an external circuit, and are to be bonded to a package or circuit board. The bond pads are disposed on the die in a predetermined alignment such as a peripheral, grid, or lead-on-center alignment. The special contact pads are used to provide external test patterns to internal circuits and/or to externally monitor results from testing the internal circuits. The special contact pads may be advantageously located on the integrated circuit with a high degree of positional freedom. For one embodiment, the special contact pads may be disposed on the die at a location that is not in the same alignment as the bond pads. The special contact pads may be smaller than the bond pads so as not to increase the die size due to the special contact pads. The special contact points may also be used to externally program internal circuits (e.g., nonvolatile circuits) at the die or package level. The special contact points may also be used to select redundant circuits for faulty circuits.
摘要翻译：本发明的一个实施例涉及包括接合焊盘和特殊接触焊盘或点的集成电路。接合焊盘用于将集成电路作为整体与外部电路接口，并且将被连接到封装或电路板。接合焊盘以预定的对准方式设置在管芯上，例如外围，栅格或中心对准。特殊接触焊盘用于向内部电路提供外部测试模式和/或外部监测测试内部电路的结果。特别的接触垫可以有利地以高度的位置自由度位于集成电路上。对于一个实施例，特殊接触焊盘可以在与焊盘不同于对准的位置处设置在管芯上。特殊的接触焊盘可以小于接合焊盘，以便不会由于特殊的接触垫而增加管芯的尺寸。特殊接触点也可以用于在芯片或封装级别外部编程内部电路（例如非易失性电路）。特殊接触点也可用于选择故障电路的冗余电路。

2. 发明申请

US20050156165A1 Test assembly including a test die for testing a semiconductor product die 失效
标题翻译：测试组件，包括用于测试半导体产品模具的测试模具
公开(公告)号：US20050156165A1
公开(公告)日：2005-07-21
申请号：US11000586
申请日：2004-11-30
申请人： Benjamin Eldridge , Igor Khandros , David Pedersen , Ralph Whitten
发明人： Benjamin Eldridge , Igor Khandros , David Pedersen , Ralph Whitten
IPC分类号： G01R1/067 , G01R1/073 , G01R31/28 , H01L23/48 , H01L23/485 , H01L23/498 , H01L23/544 , H05K3/20 , H05K3/34 , H01L23/58 , G01R31/02 , H01L29/10
CPC分类号： G01R1/07307 , G01R1/07342 , G01R1/07371 , G01R31/2884 , G01R31/2886 , H01L22/32 , H01L22/34 , H01L23/49811 , H01L24/05 , H01L2224/0401 , H01L2224/05553 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/06136 , H01L2224/13 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K3/20 , H05K3/3421 , H01L2924/00014 , H01L2924/00
摘要： One embodiment of the present invention concerns a test assembly for testing product circuitry of a product die. In one embodiment, the test assembly includes at test die and an interconnection substrate for electrically coupling the test die to a host controller that communicates with the test die. The test die may be designed according to a design methodology that includes the step of concurrently designing test circuitry and a product circuitry in a unified design. The test circuitry can be designed to provide a high degree of fault coverage for the corresponding product circuitry generally without regard to the amount of silicon area that will be required by the test circuitry. The design methodology then partitions the unified design into the test die and the product die. The test die includes the test circuitry and the product die includes the product circuitry. The product and test die may then be fabricated on separate semiconductor wafers. By partitioning the product circuitry and test circuitry into separate die, embedded test circuitry can be either eliminated or minimized on the product die. This will tend to decrease the size of the product die and decrease the cost of manufacturing the product die while maintaining a high degree of test coverage of the product circuits within the product die. The test die can be used to test multiple product die on one or more wafers.
摘要翻译：本发明的一个实施例涉及一种用于测试产品模具的产品电路的测试组件。在一个实施例中，测试组件包括在测试模具和用于将测试模具电耦合到与测试模具通信的主机控制器的互连衬底。测试模具可以根据设计方法设计，包括在统一设计中同时设计测试电路和产品电路的步骤。测试电路可以设计成为相应的产品电路提供高度的故障覆盖，通常不考虑测试电路所需的硅面积的量。然后，设计方法将统一设计分为测试模具和产品模具。测试芯片包括测试电路，产品芯片包括产品电路。然后可以在单独的半导体晶片上制造产品和测试裸片。通过将产品电路和测试电路划分为单独的管芯，可以在产品管芯上消除或最小化嵌入式测试电路。这将倾向于减小产品模具的尺寸并降低制造产品模具的成本，同时保持产品模具内的产品电路的高度测试覆盖。测试模具可用于在一个或多个晶片上测试多个产品模具。

3. 发明申请

US20070285114A1 Socket For Making With Electronic Component, Particularly Semiconductor Device With Spring Packaging, For Fixturing, Testing, Burning-In Or Operating Such A Component 失效
标题翻译：用于制造电子元件的插座，特别是具有弹簧封装的半导体器件，用于固定，测试，燃烧或操作这样的部件
公开(公告)号：US20070285114A1
公开(公告)日：2007-12-13
申请号：US11733562
申请日：2007-04-10
申请人： David Pedersen , Benjamin Eldridge , Igor Khandros
发明人： David Pedersen , Benjamin Eldridge , Igor Khandros
IPC分类号： G01R31/02
CPC分类号： H01L25/16 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/0408 , G01R1/0433 , G01R1/06711 , G01R1/07342 , G01R1/07378 , G01R31/01 , G01R31/2863 , G01R31/2886 , G01R31/2889 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/04 , H01L23/13 , H01L23/32 , H01L23/49811 , H01L23/5385 , H01L24/06 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L2223/54473 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/05599 , H01L2224/06136 , H01L2224/1134 , H01L2224/13099 , H01L2224/16145 , H01L2224/45144 , H01L2224/49109 , H01L2224/73203 , H01L2224/81136 , H01L2224/81801 , H01L2224/85201 , H01L2224/85399 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01033 , H01L2924/01051 , H01L2924/01061 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/1532 , H01L2924/15787 , H01L2924/16152 , H01L2924/19043 , H05K1/141 , H05K3/20 , H05K3/325 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K2201/09472 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , H01L2924/00 , H01L2224/48
摘要： Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.
摘要翻译：提供产品和组件用于可插拔地接收从电子部件（例如半导体器件）延伸的细长互连元件，例如弹簧接触元件。插座基板设置有用于接收从电子部件延伸的细长互连元件的端部的捕获垫。公开了各种捕获垫结构。通过邻近插座基板表面的导电迹线提供与外部设备的连接。插座基板可以由支撑基板支撑。在特别优选的实施例中，捕获垫直接形成在诸如印刷电路板的主要基底上。

4. 发明申请

US20060223345A1 SOCKETS FOR "SPRINGED" SEMICONDUCTOR DEVICES 审中-公开
标题翻译： “弹簧”半导体器件的插座
公开(公告)号：US20060223345A1
公开(公告)日：2006-10-05
申请号：US11423767
申请日：2006-06-13
申请人： Thomas Dozier , Benjamin Eldridge , Gary Grube , Igor Khandros , Gaetan Mathieu , David Pedersen , Michael Stadt
发明人： Thomas Dozier , Benjamin Eldridge , Gary Grube , Igor Khandros , Gaetan Mathieu , David Pedersen , Michael Stadt
IPC分类号： H01R12/00
CPC分类号： G01R1/0408 , B23K3/087 , G01R1/0416 , G01R1/0466 , G01R31/2886 , H01L23/04 , H01L23/13 , H01L23/32 , H01L23/5385 , H01L24/72 , H01L2224/1134 , H01L2224/13099 , H01L2224/16 , H01L2224/16237 , H01L2224/73251 , H01L2224/8114 , H01L2224/81901 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H05K1/119 , H05K3/308 , H05K3/325 , H05K2201/0311 , H05K2201/09472 , H05K2201/09827 , Y10T29/49128 , Y10T29/4913 , Y10T29/49139 , Y10T29/4914 , Y10T29/49147 , Y10T29/49153 , Y10T29/49208 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , H01L2924/00014 , H01L2224/72
摘要： Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.
摘要翻译：从诸如半导体器件的电子部件延伸的弹簧接触元件的临时连接是通过推动电子部件，因此弹簧接触元件的端部垂直地抵靠互连基板的端子，或者通过水平推动互连基板的端子抵抗弹簧接触元件的端部。公开了各种终端配置。

5. 发明申请

US20070210822A1 WIRELESS TEST SYSTEM 有权
标题翻译：无线测试系统
公开(公告)号：US20070210822A1
公开(公告)日：2007-09-13
申请号：US11749004
申请日：2007-05-15
申请人： Igor Khandros , Benjamin Eldridge , A. Sporck , Charles Miller
发明人： Igor Khandros , Benjamin Eldridge , A. Sporck , Charles Miller
IPC分类号： G01R31/26
CPC分类号： G01R31/3025 , G01R31/31907 , G01R31/31908
摘要： One or more testers wirelessly communicate with one or more test stations. The wireless communication may include transmission of test commands and/or test vectors to a test station, resulting in testing of one or more electronic devices at the test station. The wireless communication may also include transmission of test results to a tester. Messages may also be wirelessly exchanged.
摘要翻译：一个或多个测试人员与一个或多个测试台无线通信。无线通信可以包括将测试命令和/或测试向量发送到测试站，导致测试台上的一个或多个电子设备的测试。无线通信还可以包括将测试结果传输给测试者。消息也可以被无线地交换。

6. 发明申请

US20060279300A1 Probe Card Assembly And Kit 失效
标题翻译：探头卡组合和套件
公开(公告)号：US20060279300A1
公开(公告)日：2006-12-14
申请号：US11423808
申请日：2006-06-13
申请人： Igor Khandros , A. Sporck , Benjamin Eldridge
发明人： Igor Khandros , A. Sporck , Benjamin Eldridge
IPC分类号： G01R31/02
CPC分类号： H05K3/4015 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/06711 , G01R1/07342 , G01R1/07364 , G01R1/07378 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/76897 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/1134 , H01L2224/13099 , H01L2224/16145 , H01L2224/45014 , H01L2224/45144 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01045 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4092 , H05K7/1069 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2224/48 , H01L2224/05599
摘要： In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.
摘要翻译：在探针卡组件中，可以将一系列探针元件排列在硅空间变压器上。硅空间变压器可以以与半导体器件的间距相当的非常紧密的间距的主要触点阵列制造。一个优选的主要接触是弹性弹簧接触。空间变压器中的导电元件以更放松的间距被路由到第二触点。在一个优选实施例中，第二触点适于直接连接带状电缆，带状电缆又可连接以提供对每个主触点的选择性连接。硅空间变压器安装在固定装置中，其提供与待测试的晶片或装置的弹性连接。可以调整该夹具以使主触头与支撑探针卡板的平面平坦化。

7. 发明申请

US20050146339A1 Method of manufacturing a probe card 有权
公开(公告)号：US20050146339A1
公开(公告)日：2005-07-07
申请号：US11073187
申请日：2005-03-04
申请人： Gary Grube , Igor Khandros , Benjamin Eldridge , Gaetan Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
发明人： Gary Grube , Igor Khandros , Benjamin Eldridge , Gaetan Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
IPC分类号： G01R31/26 , G01R1/073 , G01R31/28 , H01L21/66 , G01R31/02
CPC分类号： G01R31/2886 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07378 , G01R3/00 , Y10T29/49126
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.

8. 发明申请

US20070271071A1 Remote Test Facility With Wireless Interface To Local Test Facilities 失效
标题翻译：具有无线接口的远程测试设备到本地测试设施
公开(公告)号：US20070271071A1
公开(公告)日：2007-11-22
申请号：US11835151
申请日：2007-08-07
申请人： Igor Khandros , Benjamin Eldridge
发明人： Igor Khandros , Benjamin Eldridge
IPC分类号： G06F11/00 , G06F15/00
CPC分类号： G01R31/2884 , G01R31/3025 , G01R31/31907
摘要： A central test facility transmits wirelessly test data to a local test facility, which tests electronic devices using the test data. The local test facility transmits wirelessly response data generated by the electronic devices back to the central test facility, which analyzes the response data to determine which electronic devices passed the testing. The central test facility may provide the results of the testing to other entities, such as a design facility where the electronic devices were designed or a manufacturing facility where the electronic devices where manufactured. The central test facility may accept requests for test resources from any of a number of local test facilities, schedule test times corresponding to each test request, and at a scheduled test time, wirelessly transmits test data to a corresponding local test facility.
摘要翻译：中央测试设备将无线测试数据传输到本地测试设备，该测试设备使用测试数据测试电子设备。本地测试设备将由电子设备生成的无线响应数据发送回中央测试设备，分析响应数据以确定哪些电子设备通过测试。中央测试设备可以向其他实体提供测试结果，例如设计电子设备的设计设施或其中制造的电子设备的制造设施。中央测试设备可以接受来自任何本地测试设施的测试资源的请求，对应于每个测试请求的调度测试时间，并且在预定的测试时间，将测试数据无线地传输到相应的本地测试设施。

9. 发明申请

US20070247176A1 Method of Manufacturing a Probe Card 失效
标题翻译：制造探针卡的方法
公开(公告)号：US20070247176A1
公开(公告)日：2007-10-25
申请号：US11692035
申请日：2007-03-27
申请人： Gary Grube , Igor Khandros , Benjamin Eldridge , Gaetan Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
发明人： Gary Grube , Igor Khandros , Benjamin Eldridge , Gaetan Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
IPC分类号： G01R31/26 , G01R31/04
CPC分类号： G01R31/2886 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07378 , G01R3/00 , Y10T29/49126
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
摘要翻译：一种设计和制造探针卡组件的方法包括将探针卡组件的一个或多个元件预制成一个或多个预定的设计。此后，接收关于新设计的半导体器件的设计数据以及描述用于测试半导体器件的测试器和测试算法的数据。使用接收到的数据，选择一个或多个预制元素。再次使用接收的数据，定制一个或多个所选择的预制元素。然后使用选定和定制的元件构建探针卡组件。

10. 发明申请

US20060237856A1 Microelectronic Contact Structure And Method Of Making Same 失效
标题翻译：微电子触点结构及其制作方法
公开(公告)号：US20060237856A1
公开(公告)日：2006-10-26
申请号：US11456568
申请日：2006-07-11
申请人： Benjamin Eldridge , Gary Grube , Igor Khandros , Gaetan Mathieu
发明人： Benjamin Eldridge , Gary Grube , Igor Khandros , Gaetan Mathieu
IPC分类号： H01L23/52
CPC分类号： G01R3/00 , B23K2101/38 , G01R1/06727 , G01R1/06744 , H01L21/6835 , H01L23/4951 , H01L24/72 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/3011 , H01L2924/3025 , H01R12/57 , H05K3/4092 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49204 , H01L2924/00
摘要： Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact element has a base end portion, a contact end portion, and a central body portion. The contact end portion is offset in the z-axis (at a different height) than the central body portion. The base end portion is preferably offset in an opposite direction along the z-axis from the central body portion. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the sacrificial substrate. The spring contact elements are suitably mounted by their base end portions to corresponding terminals on an electronic component, such as a space transformer or a semiconductor device, whereupon the sacrificial substrate is removed so that the contact ends of the spring contact elements extend above the surface of the electronic component. In an exemplary use, the spring contact elements are thereby disposed on a space transformer component of a probe card assembly so that their contact ends effect pressure connections to corresponding terminals on another electronic component, for the purpose of probing the electronic component.
摘要翻译：通过将至少一层金属材料沉积到限定在牺牲衬底上的开口中来制造弹簧接触元件。开口可以在衬底的表面内，或者在沉积在牺牲衬底的表面上的一个或多个层中。每个弹簧接触元件具有基端部分，接触端部分和中心体部分。接触端部在与中心体部分相同的z轴（不同高度）偏移。基端部优选地沿着与中心主体部分的z轴相反的方向偏移。以这种方式，在牺牲基板上以规定的空间关系制造多个弹簧接触元件。弹簧接触元件通过它们的基端部适当地安装在诸如空间变压器或半导体器件的电子部件上的对应端子上，从而去除牺牲基板，使得弹簧接触元件的接触端部在表面上方延伸的电子元件。在示例性用途中，弹簧接触元件因此被布置在探针卡组件的空间变换器部件上，使得它们的接触端在另一电子部件上实现与相应端子的压力连接，以便探测电子部件。

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