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1. 发明申请

US20070063721A1 Apparatus And Method Of Testing Singulated Dies 有权
标题翻译：测试单位模具的装置和方法
公开(公告)号：US20070063721A1
公开(公告)日：2007-03-22
申请号：US11532494
申请日：2006-09-15
申请人： Thomas Dozier , Benjamin Eldridge , David Hsu , Igor Khandros , Charles Miller
发明人： Thomas Dozier , Benjamin Eldridge , David Hsu , Igor Khandros , Charles Miller
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R31/2893 , G01R31/31905
摘要： An exemplary die carrier is disclosed. In some embodiments, the die carrier can hold a plurality of singulated dies while the dies are tested. The dies can be arranged on the carrier in a pattern that facilities testing the dies. The carrier can be configured to allow interchangeable interfaces to different testers to be attached to and detached from the carrier. The carrier can also be configured as a shipping container for the dies.
摘要翻译：公开了一种示例性的模具载体。在一些实施例中，模具载体可以在测试模具的同时保持多个单个模具。模具可以以对模具进行测试的模式布置在载体上。载体可以被配置为允许不同的测试仪的可互换的接口被附接到载体上并与载体分离。载体也可以被配置为模具的运输容器。

2. 发明申请

US20080116927A1 CONTACT TIP STRUCTURE FOR MICROELECTRONIC INTERCONNECTION ELEMENTS AND METHODS OF MAKING SAME 审中-公开
标题翻译：微电子互连元件的接点提示结构及其制作方法
公开(公告)号：US20080116927A1
公开(公告)日：2008-05-22
申请号：US12020380
申请日：2008-01-25
申请人： Thomas Dozier , Benjamin Eldridge , Igor Khandros , Gaetan Mathieu , Sheldon Taylor
发明人： Thomas Dozier , Benjamin Eldridge , Igor Khandros , Gaetan Mathieu , Sheldon Taylor
IPC分类号： G01R1/067 , G01R31/02
CPC分类号： G01R1/06727 , G01R1/07342 , H01L2924/01074 , H01L2924/01078
摘要： Contact tip structures are fabricated on sacrificial substrates for subsequent joining to interconnection elements including composite interconnection elements, monolithic interconnection elements, tungsten needles of probe cards, contact bumps of membrane probes, and the like. The spatial relationship between the tip structures can lithographically be defined to very close tolerances. The metallurgy of the tip structures is independent of that of the interconnection element to which they are attached, by brazing, plating or the like. The contact tip structures are readily provided with topological (small, precise, projecting, non-planar) contact features, such as in the form of truncated pyramids, to optimize electrical pressure connections subsequently being made to terminals of electronic components. Elongate contact tip structures, adapted in use to function as spring contact elements without the necessity of being joined to resilient contact elements are described. Generally, the invention is directed to making (pre-fabricating) relatively ‘perfect’ contact tip structures (“tips”) and joining them to relatively ‘imperfect’ interconnection elements to improve the overall capabilities of resulting “tipped” interconnection elements.
摘要翻译：接触尖端结构被制造在牺牲衬底上，用于随后连接到包括复合互连元件，单片互连元件，探针卡的钨针，膜探针的接触凸块等的互连元件。尖端结构之间的空间关系可以光刻地定义为非常接近的公差。尖端结构的冶金独立于它们所连接的互连元件的冶金，通过钎焊，电镀等。接触尖端结构容易地具有拓扑（小的，精确的，突出的，非平面的）接触特征，例如呈截锥形的形式，以优化随后对电子部件的端子进行的电压连接。描述了适于用作弹簧接触元件而不需要接合到弹性接触元件的细长接触尖端结构。通常，本发明旨在制造（预制）相对“完美”的接触尖端结构（“尖端”）并将它们连接到相对“不完美”的互连元件，以改善所产生的“尖端”互连元件的整体能力。

3. 发明申请

US20060223345A1 SOCKETS FOR "SPRINGED" SEMICONDUCTOR DEVICES 审中-公开
标题翻译： “弹簧”半导体器件的插座
公开(公告)号：US20060223345A1
公开(公告)日：2006-10-05
申请号：US11423767
申请日：2006-06-13
申请人： Thomas Dozier , Benjamin Eldridge , Gary Grube , Igor Khandros , Gaetan Mathieu , David Pedersen , Michael Stadt
发明人： Thomas Dozier , Benjamin Eldridge , Gary Grube , Igor Khandros , Gaetan Mathieu , David Pedersen , Michael Stadt
IPC分类号： H01R12/00
CPC分类号： G01R1/0408 , B23K3/087 , G01R1/0416 , G01R1/0466 , G01R31/2886 , H01L23/04 , H01L23/13 , H01L23/32 , H01L23/5385 , H01L24/72 , H01L2224/1134 , H01L2224/13099 , H01L2224/16 , H01L2224/16237 , H01L2224/73251 , H01L2224/8114 , H01L2224/81901 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H05K1/119 , H05K3/308 , H05K3/325 , H05K2201/0311 , H05K2201/09472 , H05K2201/09827 , Y10T29/49128 , Y10T29/4913 , Y10T29/49139 , Y10T29/4914 , Y10T29/49147 , Y10T29/49153 , Y10T29/49208 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , H01L2924/00014 , H01L2224/72
摘要： Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.
摘要翻译：从诸如半导体器件的电子部件延伸的弹簧接触元件的临时连接是通过推动电子部件，因此弹簧接触元件的端部垂直地抵靠互连基板的端子，或者通过水平推动互连基板的端子抵抗弹簧接触元件的端部。公开了各种终端配置。

4. 发明申请

US20070075715A1 Contact Carriers (Tiles) For Populating Larger Substrates With Spring Contacts 失效
标题翻译：联系承运人（瓷砖）用于填充较大的基板与弹簧触点
公开(公告)号：US20070075715A1
公开(公告)日：2007-04-05
申请号：US11561297
申请日：2006-11-17
申请人： Igor Khandros , Benjamin Eldridge , Gaetan Mathieu , Thomas Dozier , William Smith
发明人： Igor Khandros , Benjamin Eldridge , Gaetan Mathieu , Thomas Dozier , William Smith
IPC分类号： G01R31/02
CPC分类号： H05K3/4015 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/06711 , G01R1/06716 , G01R1/07342 , G01R1/07378 , G01R3/00 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/1134 , H01L2224/13099 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2224/85205 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/49004 , Y10T29/49126 , Y10T29/49208 , Y10T29/49222 , H01L2924/00 , H01L2224/48
摘要： An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.
摘要翻译：一种互连装置和形成互连装置的方法。接触结构附着在第一基底上或形成在第一基底上。第一衬底附接到比第一衬底大的第二衬底。可以将多个这样的第一基板附接到第二基板，以便产生接触结构的阵列。每个接触结构可以是细长的和弹性的，并且可以包括在涂覆有向接触结构赋予期望的结构特性的材料的芯上。

5. 发明申请

US20070210822A1 WIRELESS TEST SYSTEM 有权
标题翻译：无线测试系统
公开(公告)号：US20070210822A1
公开(公告)日：2007-09-13
申请号：US11749004
申请日：2007-05-15
申请人： Igor Khandros , Benjamin Eldridge , A. Sporck , Charles Miller
发明人： Igor Khandros , Benjamin Eldridge , A. Sporck , Charles Miller
IPC分类号： G01R31/26
CPC分类号： G01R31/3025 , G01R31/31907 , G01R31/31908
摘要： One or more testers wirelessly communicate with one or more test stations. The wireless communication may include transmission of test commands and/or test vectors to a test station, resulting in testing of one or more electronic devices at the test station. The wireless communication may also include transmission of test results to a tester. Messages may also be wirelessly exchanged.
摘要翻译：一个或多个测试人员与一个或多个测试台无线通信。无线通信可以包括将测试命令和/或测试向量发送到测试站，导致测试台上的一个或多个电子设备的测试。无线通信还可以包括将测试结果传输给测试者。消息也可以被无线地交换。

6. 发明申请

US20070182438A1 Wireless Test Cassette 失效
标题翻译：无线测试盒
公开(公告)号：US20070182438A1
公开(公告)日：2007-08-09
申请号：US11696582
申请日：2007-04-04
申请人： Igor Khandros , Benjamin Eldridge , Charles Miller , A. Sporck
发明人： Igor Khandros , Benjamin Eldridge , Charles Miller , A. Sporck
IPC分类号： G01R31/26
CPC分类号： G01R1/0491 , G01R1/073 , G01R31/3025
摘要： A base controller disposed in a test cassette receives test data for testing a plurality of electronic devices. The base controller wirelessly transmits the test data to a plurality of wireless test control chips, which write the test data to each of the electronic devices. The wireless test control chips then read response data generated by the electronic devices, and the wireless test control chips wirelessly transmit the response data to the base controller.
摘要翻译：设置在测试盒中的基本控制器接收用于测试多个电子设备的测试数据。基站控制器将测试数据无线传输到多个无线测试控制芯片，其将测试数据写入每个电子设备。然后，无线测试控制芯片读取由电子设备产生的响应数据，无线测试控制芯片将响应数据无线发送到基本控制器。

7. 发明申请

US20050086021A1 Wireless test system 有权
标题翻译：无线测试系统
公开(公告)号：US20050086021A1
公开(公告)日：2005-04-21
申请号：US10690170
申请日：2003-10-21
申请人： Igor Khandros , Benjamin Eldridge , A. Sporck , Charles Miller
发明人： Igor Khandros , Benjamin Eldridge , A. Sporck , Charles Miller
IPC分类号： G01R31/319 , G06F19/00 , G01R31/00
CPC分类号： G01R31/3025 , G01R31/31907 , G01R31/31908
摘要： One or more testers wirelessly communicate with one or more test stations. The wireless communication may include transmission of test commands and/or test vectors to a test station, resulting in testing of one or more electronic devices at the test station. The wireless communication may also include transmission of test results to a tester. Messages may also be wirelessly exchanged.
摘要翻译：一个或多个测试人员与一个或多个测试台无线通信。无线通信可以包括将测试命令和/或测试向量发送到测试站，导致测试台上的一个或多个电子设备的测试。无线通信还可以包括将测试结果传输给测试者。消息也可以被无线地交换。

8. 发明申请

US20050225347A1 Wireless test cassette 有权
标题翻译：无线测试盒
公开(公告)号：US20050225347A1
公开(公告)日：2005-10-13
申请号：US10820319
申请日：2004-04-08
申请人： Igor Khandros , Benjamin Eldridge , Charles Miller , A. Sporck
发明人： Igor Khandros , Benjamin Eldridge , Charles Miller , A. Sporck
IPC分类号： G01R1/073 , G01R31/02 , G01R31/26
CPC分类号： G01R1/0491 , G01R1/073 , G01R31/3025
摘要： A base controller disposed in a test cassette receives test data for testing a plurality of electronic devices. The base controller wirelessly transmits the test data to a plurality of wireless test control chips, which write the test data to each of the electronic devices. The wireless test control chips then read response data generated by the electronic devices, and the wireless test control chips wirelessly transmit the response data to the base controller.
摘要翻译：设置在测试盒中的基本控制器接收用于测试多个电子设备的测试数据。基站控制器将测试数据无线传输到多个无线测试控制芯片，其将测试数据写入每个电子设备。然后，无线测试控制芯片读取由电子设备产生的响应数据，无线测试控制芯片将响应数据无线发送到基本控制器。

9. 发明申请

US20070285114A1 Socket For Making With Electronic Component, Particularly Semiconductor Device With Spring Packaging, For Fixturing, Testing, Burning-In Or Operating Such A Component 失效
标题翻译：用于制造电子元件的插座，特别是具有弹簧封装的半导体器件，用于固定，测试，燃烧或操作这样的部件
公开(公告)号：US20070285114A1
公开(公告)日：2007-12-13
申请号：US11733562
申请日：2007-04-10
申请人： David Pedersen , Benjamin Eldridge , Igor Khandros
发明人： David Pedersen , Benjamin Eldridge , Igor Khandros
IPC分类号： G01R31/02
CPC分类号： H01L25/16 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/0408 , G01R1/0433 , G01R1/06711 , G01R1/07342 , G01R1/07378 , G01R31/01 , G01R31/2863 , G01R31/2886 , G01R31/2889 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/04 , H01L23/13 , H01L23/32 , H01L23/49811 , H01L23/5385 , H01L24/06 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L2223/54473 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/05599 , H01L2224/06136 , H01L2224/1134 , H01L2224/13099 , H01L2224/16145 , H01L2224/45144 , H01L2224/49109 , H01L2224/73203 , H01L2224/81136 , H01L2224/81801 , H01L2224/85201 , H01L2224/85399 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01033 , H01L2924/01051 , H01L2924/01061 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/1532 , H01L2924/15787 , H01L2924/16152 , H01L2924/19043 , H05K1/141 , H05K3/20 , H05K3/325 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K2201/09472 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , H01L2924/00 , H01L2224/48
摘要： Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.
摘要翻译：提供产品和组件用于可插拔地接收从电子部件（例如半导体器件）延伸的细长互连元件，例如弹簧接触元件。插座基板设置有用于接收从电子部件延伸的细长互连元件的端部的捕获垫。公开了各种捕获垫结构。通过邻近插座基板表面的导电迹线提供与外部设备的连接。插座基板可以由支撑基板支撑。在特别优选的实施例中，捕获垫直接形成在诸如印刷电路板的主要基底上。

10. 发明申请

US20060279300A1 Probe Card Assembly And Kit 失效
标题翻译：探头卡组合和套件
公开(公告)号：US20060279300A1
公开(公告)日：2006-12-14
申请号：US11423808
申请日：2006-06-13
申请人： Igor Khandros , A. Sporck , Benjamin Eldridge
发明人： Igor Khandros , A. Sporck , Benjamin Eldridge
IPC分类号： G01R31/02
CPC分类号： H05K3/4015 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/06711 , G01R1/07342 , G01R1/07364 , G01R1/07378 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/76897 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/1134 , H01L2224/13099 , H01L2224/16145 , H01L2224/45014 , H01L2224/45144 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01045 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4092 , H05K7/1069 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2224/48 , H01L2224/05599
摘要： In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.
摘要翻译：在探针卡组件中，可以将一系列探针元件排列在硅空间变压器上。硅空间变压器可以以与半导体器件的间距相当的非常紧密的间距的主要触点阵列制造。一个优选的主要接触是弹性弹簧接触。空间变压器中的导电元件以更放松的间距被路由到第二触点。在一个优选实施例中，第二触点适于直接连接带状电缆，带状电缆又可连接以提供对每个主触点的选择性连接。硅空间变压器安装在固定装置中，其提供与待测试的晶片或装置的弹性连接。可以调整该夹具以使主触头与支撑探针卡板的平面平坦化。

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