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    • 8. 发明申请
    • SI-CONTAINING POLYMERS FOR NANO-PATTERN DEVICE FABRICATION
    • 用于纳米图案装置制造的含SI聚合物
    • WO2008055137A2
    • 2008-05-08
    • PCT/US2007/082967
    • 2007-10-30
    • INTERNATIONAL BUSINESS MACHINES CORPORATIONCHEN, Kuang-JungHUANG, Wu-SongLI, Wai-KinLIN, Yi-Hsiung, S.
    • CHEN, Kuang-JungHUANG, Wu-SongLI, Wai-KinLIN, Yi-Hsiung, S.
    • G03C1/00
    • G03F7/0758G03F7/0045
    • A resist polymer (22) that has nano-scale patterns of sub-lithographic openings (26) located therein that are oriented substantially perpendicular to its major surfaces is provided. Such a resist polymer having the nano-scale patterns is used as an etch mask transferring nano-scale patterns to an underlying substrate such as, for example, dielectric material (12). After the transferring of the nano-scale patterns into the substrate, nano-scale openings having a width of less than 50 nm are created in the substrate. The presence of the nano-scale voids in a dielectric material lowers the dielectric constant, k, of the original dielectric material. In accordance with an aspect of the present invention, the inventive resist polymer comprises a copolymer that includes a first monomer unit (A) that contains a Si-containing component, and a second monomer unit (B) that contains an organic component, wherein said two monomer units (A and B) have different etch rates.
    • 提供了具有位于其中的基本上垂直于其主表面定向的亚光刻开口(26)的纳米尺度图案的抗蚀剂聚合物(22)。 具有纳米尺度图案的这种抗蚀剂聚合物用作将纳米尺度图案转移到诸如介电材料(12)的下面的基底的蚀刻掩模。 在将纳米尺度图案转移到基底中之后,在基底中产生宽度小于50nm的纳米级开口。 电介质材料中纳米尺度空隙的存在降低了原始电介质材料的介电常数k。 根据本发明的一个方面,本发明的抗蚀剂聚合物包括包含含有含Si组分的第一单体单元(A)和含有有机组分的第二单体单元(B)的共聚物,其中所述 两个单体单元(A和B)具有不同的蚀刻速率。