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    • 4. 发明授权
    • Polishing pad for chemical mechanical polishing apparatus
    • 化学机械抛光设备抛光垫
    • US07052368B2
    • 2006-05-30
    • US10861254
    • 2004-06-03
    • Jin-Kook KimJae-Phil BooSang-Seon LeeJong-Bok Kim
    • Jin-Kook KimJae-Phil BooSang-Seon LeeJong-Bok Kim
    • B24B49/00
    • B24B37/205
    • Provided is a polishing pad for a chemical mechanical polishing (CMP) apparatus, having a sealing barrier which prevents fluid leakage and moisture accumulation on a window. The polishing pad comprises an upper pad having polishing surface in contact with a wafer, a bottom pad an upper face of which is attached to a lower face of the upper pad and a lower face of which is attached to an upper face of a platen of the CMP apparatus, an aperture through the bottom pad and the upper pad, a transparent window fitted in the aperture in the upper pad, and a sealing barrier, placed between the aperture and an external face of the bottom pad in contact with a fluid, to prevent fluid leakage and accumulation of moisture derived from fluid fed on the polishing surface through the bottom pad.
    • 本发明提供一种用于化学机械抛光(CMP)装置的抛光垫,其具有防止液体泄漏和水分积聚在窗户上的密封屏障。 抛光垫包括具有与晶片接触的抛光表面的上焊盘,底垫,其上表面附接到上焊盘的下表面,其下表面附接到压板的上表面 CMP装置,通过底垫和上垫的孔,安装在上垫中的孔中的透明窗和密封屏障,放置在孔与底部垫的与流体接触的外表面之间, 以防止流体通过底部衬垫泄漏和积聚来自在抛光表面上供给的流体的水分。
    • 9. 发明授权
    • Polishing pad cleaner and chemical mechanical polishing apparatus comprising the same
    • 抛光垫清洁剂和包括其的化学机械抛光装置
    • US07455575B2
    • 2008-11-25
    • US11477525
    • 2006-06-30
    • Jong-Bok KimSeung-Lyong Choi
    • Jong-Bok KimSeung-Lyong Choi
    • B24B1/00
    • B24B53/017
    • A polishing pad cleaner of a chemical mechanical polishing apparatus throughly and efficiently cleans the polishing pad of the apparatus. The head of the polishing pad cleaner includes a nozzle support plate, a plurality of nozzles mounted to the nozzle support plate, and extending from the bottom of the nozzle support plate, and partitions interposed between the nozzles. The head is placed over the polishing pad. Subsequently, the polishing pad is roated relative to the nozzles, and cleaning agent is ejected from the nozzles. The partitions help maintain the pressure of the cleaning agent as the agent flows from the nozzles to the polishing pad. Also, different types of cleaning agents can be simultaneously ejected from the nozzles, respectively, onto the polishing pad. Specifically, a high pressure gas and a cleaning solution can be directed onto the same region of the pad one after the other.
    • 化学机械抛光装置的抛光垫清洁器通过并有效地清洁装置的抛光垫。 抛光垫清洁器的头部包括喷嘴支撑板,安装在喷嘴支撑板上并从喷嘴支撑板的底部延伸的多个喷嘴以及插入在喷嘴之间的分隔件。 头部放置在抛光垫上。 随后,抛光垫相对于喷嘴而旋转,清洗剂从喷嘴喷出。 当试剂从喷嘴流到抛光垫时,隔板有助于保持清洁剂的压力。 此外,可以将不同类型的清洁剂分别从喷嘴喷射到抛光垫上。 具体地说,可以将高压气体和清洗液一个接一个地引导到垫的同一区域上。