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1. 发明授权

US5040992A Mounting structure for electronic device 失效
标题翻译：电子设备的安装结构
公开(公告)号：US5040992A
公开(公告)日：1991-08-20
申请号：US444859
申请日：1989-12-04
申请人： Mitsuo Miyamoto , Fumiyuki Kobayashi , Shizuo Zushi , Norio Sengoku , Yoshiaki Horita
发明人： Mitsuo Miyamoto , Fumiyuki Kobayashi , Shizuo Zushi , Norio Sengoku , Yoshiaki Horita
IPC分类号： G06F1/18 , H05K1/14 , H05K7/14
CPC分类号： H05K7/1449 , H05K1/14 , H05K1/148 , Y10S439/928
摘要： A first mother board among a plurality of mother boards is mounted adjacent to a reference mother board and a second mother board among said plurality of mother boards is mounted in a position rotated 180.degree. about the horizontal centerline of the second mother board and mounted back to back to the first mother board, whereby the reference mother board and the first and second mother boards can be interconnected at a minimal distance.
摘要翻译：多个母板中的第一母板安装在参考母板附近，并且所述多个母板中的第二母板安装在围绕第二母板的水平中心线旋转180°的位置，并安装回返回到第一母板，由此参考母板和第一和第二母板可以以最小的距离相互连接。

2. 发明授权

US4837663A Electronic apparatus cooling system 失效
标题翻译：电子设备冷却系统
公开(公告)号：US4837663A
公开(公告)日：1989-06-06
申请号：US145473
申请日：1988-01-19
申请人： Shizuo Zushi , Mitsuo Miyamoto , Hiroshi Gou , Fumiyuki Kobayashi , Tetsuo Ogata
发明人： Shizuo Zushi , Mitsuo Miyamoto , Hiroshi Gou , Fumiyuki Kobayashi , Tetsuo Ogata
IPC分类号： F25D1/02 , H05K7/20
CPC分类号： H05K7/20572
摘要： A cooling system for an electronic apparatus comprises a plurality of mother boards each having a circuit board to be cooled, a blower for causing an air flow from one of the mother boards to the other, and a draft duct for directing the air flow between the mother boards.The draft duct includes an inlet for dividing the air flow into a plurality of partial flows, a partition for changing an air flow direction of the partial flows into some other directions, and an outlet for intermixing the partial flows.
摘要翻译：一种用于电子设备的冷却系统包括多个母板，每个母板具有要冷却的电路板，用于使空气从一个母板引导到另一个的鼓风机，以及用于将空气流引导到母板引流管包括用于将空气流分成多个部分流的入口，用于将部分流动的空气流动方向改变成一些其它方向的分隔件和用于混合部分流动的出口。

3. 发明授权

US5109317A Mounting mechanism for mounting heat sink on multi-chip module 失效
标题翻译：用于在多芯片模块上安装散热器的安装机构
公开(公告)号：US5109317A
公开(公告)日：1992-04-28
申请号：US604953
申请日：1990-10-29
申请人： Mitsuo Miyamoto , Shizuo Zushi , Hiroshi Go , Fumiyuki Kobayashi , Hiroyuki Kojima
发明人： Mitsuo Miyamoto , Shizuo Zushi , Hiroshi Go , Fumiyuki Kobayashi , Hiroyuki Kojima
IPC分类号： H01L23/40 , H01L23/433 , H01L23/473
CPC分类号： H01L23/4006 , H01L23/433 , H01L23/473 , H01L2224/16225
摘要： A cooling structure for cooling a multi-chip module by a heat sink is disclosed in which the heat sink is disposed above the multi-chip module in a state that heat-conductive grease is sandwiched between the heat sink and the module cap of the multi-chip module, and the heat sink, the module cap and the wiring board of the multi-chip module are clamped as one body by clamp member, and in which a heat-sink pushing member for pressing the heat sink against the module cap by a constant force is attached to the clamp members.
摘要翻译：公开了一种用于通过散热器冷却多芯片模块的冷却结构，其中散热器设置在多芯片模块上方，导热油脂被夹在散热器和多重模块的模块盖之间芯片模块，并且多芯片模块的散热器，模块盖和布线板通过夹紧构件夹紧为一体，其中散热器推动构件用于将散热器按压在模块盖上固定力附着在夹紧件上。

4. 发明授权

US4739444A Device for adjusting pressure loss of cooling air for an assembly of cards carrying electronic components 失效
标题翻译：用于调节携带电子部件的卡组件的冷却空气的压力损失的装置
公开(公告)号：US4739444A
公开(公告)日：1988-04-19
申请号：US835764
申请日：1986-03-03
申请人： Shizuo Zushi , Tetsuo Ogata , Mitsuo Miyamoto , Tsutomu Imai , Fumiyuki Kobayashi
发明人： Shizuo Zushi , Tetsuo Ogata , Mitsuo Miyamoto , Tsutomu Imai , Fumiyuki Kobayashi
IPC分类号： H05K7/20
CPC分类号： H05K7/20563
摘要： In a cooling structure for electronic apparatus in which cards consisting of electronic components mounted on circuit boards are arranged in parallel on a motherboard. A pressure adjustment device with holes is arranged in a cooling air flow passage of each card. The area of the holes is selected in relation to the pressure loss characteristics of the related card based upon average air-flow sectional area.
摘要翻译：在用于电子设备的冷却结构中，其中安装在电路板上的电子部件组成的卡片平行排列在母板上。具有孔的压力调节装置布置在每个卡的冷却空气流动通道中。基于平均气流截面面积，相对于相关卡的压力损失特性来选择孔的面积。

5. 发明授权

US5345107A Cooling apparatus for electronic device 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5345107A
公开(公告)日：1994-09-06
申请号：US839071
申请日：1992-02-20
申请人： Takahiro Daikoku , Nobuo Kawasaki , Noriyuki Ashiwake , Keizou Kawamura , Shizuo Zushi , Mitsuo Miyamoto , Atsushi Morihara
发明人： Takahiro Daikoku , Nobuo Kawasaki , Noriyuki Ashiwake , Keizou Kawamura , Shizuo Zushi , Mitsuo Miyamoto , Atsushi Morihara
IPC分类号： F28F13/00 , H01L23/433 , H01L23/473 , H01L25/065 , F28F7/00 , H01L23/00 , H05K7/20
CPC分类号： H01L24/32 , F28F13/00 , H01L23/4338 , H01L23/473 , H01L25/0655 , F28F2013/005 , H01L2224/16 , H01L2224/32057 , H01L2224/73253 , H01L2224/73257 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/0132 , H01L2924/15312 , H01L2924/16152
摘要： The present invention relates to a cooling apparatus for an electronic device, in which a cooling solid body in close contact through thermal conductive fluid with a heat transfer portion of the electronic device is provided, on its one surface in contact with the electronic device, with a number of grooves communicating with the outside of the heat transfer portion, and a spring member for elastically pressing this cooling solid body on the electronic device is provided for forcing the cooling solid body into close contact with the electronic device by means of the thermal conductive fluid in a third layer.
摘要翻译：本发明涉及一种用于电子设备的冷却装置，其中在其与电子设备接触的一个表面上设置有通过导电流体与电子设备的传热部分紧密接触的冷却固体，与提供与传热部分的外部连通的多个槽，以及用于将该冷却固体本体弹性挤压在电子装置上的弹簧构件，用于迫使冷却固体与电子装置紧密接触，借助于导热流体在第三层。

6. 发明授权

US5144531A Electronic apparatus cooling system 失效
标题翻译：电子设备冷却系统
公开(公告)号：US5144531A
公开(公告)日：1992-09-01
申请号：US637690
申请日：1991-01-07
申请人： Hiroshi Go , Shizuo Zushi , Mitsuo Miyamoto
发明人： Hiroshi Go , Shizuo Zushi , Mitsuo Miyamoto
IPC分类号： H01L23/427 , H01L23/473 , H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002
摘要： In a liquid cooling system comprising cold plates attached to their respective circuit modules, quick couplers are provided for connecting flexible hoses to these cold plates, a supply duct and a return duct to form strings of cold plates connected between the supply duct and the return duct. Valved quick couplers are used for the connection to the supply duct and the return duct, and valveless quick couplers are used for the connection to the cold plates. When a circuit module is to be serviced, a desired string of cold plates is disconnected from the supply duct and the return duct by disjoining the valved quick couplers for the connection thereto. The disconnected string of cold plates is drained of the coolant, and then the cold plate attached to the desired circuit module is disconnected from the hoses. Subsequently the desired circuit module and the cold plate attached thereto can be detached as one body from an associated connector.
摘要翻译：在包括连接到它们各自的电路模块的冷板的液体冷却系统中，提供快速联接器用于将柔性软管连接到这些冷板，供应管道和回流管道，以形成连接在供应管道和回流管道。带阀的快速接头用于连接到供气管道和回流管道，无阀快速接头用于连接冷板。当要对电路模块进行维修时，将所需的一系列冷板与供应管道和回流管道分离，通过分离与阀连接的带阀的快速联接器。断开的冷却板串排出冷却液，然后连接到所需电路模块的冷板与软管断开连接。随后，所需的电路模块和附接到其上的冷板可以作为一个主体从相关联的连接器分离。

7. 发明授权

US06609288B2 Taper implant and a screw-fastening structure using a taper implant with female threads 失效
标题翻译：锥形植入物和使用具有内螺纹的锥形植入物的螺钉紧固结构
公开(公告)号：US06609288B2
公开(公告)日：2003-08-26
申请号：US09984763
申请日：2001-10-31
申请人： Chikakazu Ninomiya , Takeji Shiokawa , Kuninori Imai , Mitsuo Miyamoto , Mitsuya Mikawa
发明人： Chikakazu Ninomiya , Takeji Shiokawa , Kuninori Imai , Mitsuo Miyamoto , Mitsuya Mikawa
IPC分类号： B21D3900
CPC分类号： B25D9/08 , B23B51/00 , B23B51/0081 , B23B51/009 , F16B37/122 , Y10T29/49881 , Y10T29/49904 , Y10T29/49945 , Y10T29/53078 , Y10T408/60
摘要： A method of fastening a first member and a second member using a taper implant having a threaded hole therein includes providing a taper implant having a frusto-conical outer surface, a projecting portion connected to a larger diameter end and a threaded hole passing therethrough and providing a first member having a wall portion with a tapered hole extending therethrough and having a counterbored portion adjacent a larger diameter end to receive the projection portion of the taper implant. The taper implant is inserted into the hole of the first member and held therein by frictional contact. A second member is provided having a wall portion with a hole therethrough. The second member is positioned in contact with the first member and the two members are fastened together by inserting a male screw through the hole of the second member and threading the male screw into engagement with the threaded hole of the taper implant.
摘要翻译：使用其中具有螺纹孔的锥形植入物来固定第一构件和第二构件的方法包括提供具有截头圆锥形外表面的锥形植入物，连接到较大直径端的突出部分和穿过其中的螺纹孔，并提供第一构件具有壁部分，其具有延伸穿过其中的锥形孔，并且具有邻近较大直径端部的接触部分，以接收锥形植入物的突出部分。锥形植入物插入到第一构件的孔中并通过摩擦接触保持在其中。第二构件设置有具有穿过其中的孔的壁部分。第二构件定位成与第一构件接触，并且两个构件通过将外螺纹穿过第二构件的孔并将外螺纹螺纹拧入与锥形植入物的螺纹孔接合而紧固在一起。

8. 发明授权

US5147605A Method for the sterilization of ultrapure water line 失效
标题翻译：超纯水线灭菌方法
公开(公告)号：US5147605A
公开(公告)日：1992-09-15
申请号：US487937
申请日：1990-03-05
申请人： Toshio Tatsuno , Mitsuo Miyamoto , Yoshiharu Ohta , Koichi Sawada
发明人： Toshio Tatsuno , Mitsuo Miyamoto , Yoshiharu Ohta , Koichi Sawada
IPC分类号： B01D65/02 , A01N59/00 , A01N59/10 , C02F1/04 , C02F1/42 , C02F1/44 , C02F1/50
CPC分类号： C02F1/50 , A01N59/00 , A01N59/10 , C02F1/045
摘要： Periodical sterilization is usually needed in the ultrapure water line provided in an ultrapure water-producing system or plant to kill some occasionally occurring viable cells of microorganisms in the ultrapure water as produced or being produced and thereby keep the ultrapure water under germ-free conditions. Now, it is discovered that an aqueous solution containing 1 to 100 ppm of hydrofluoric acid is effective to sterilize the ultrapure water line and is advantageous over the conventional sterilization agents such as aqueous hydrogen peroxide and sodium hypochlorite which were employed normally for the sterilization of the ultrapure water line.
摘要翻译：在超纯水生产系统或设备中提供的超纯水管线中通常需要定期灭菌，以杀死生产或生产的超纯水中的一些偶尔发生的微生物活细胞，从而将超纯水保持在无菌条件下。现在，发现含有1〜100ppm氢氟酸的水溶液对超纯水管线进行消毒是有效的，并且比常规杀菌剂如过氧化氢水溶液和次氯酸钠有利，这些灭菌剂通常用于灭菌超纯水线。

9. 发明授权

US06488458B2 Taper implant and a screw-fastening structure using a taper implant with female threads 失效
标题翻译：锥形植入物和使用具有内螺纹的锥形植入物的螺钉紧固结构
公开(公告)号：US06488458B2
公开(公告)日：2002-12-03
申请号：US08803232
申请日：1997-02-20
申请人： Chikakazu Ninomiya , Takeji Shiokawa , Kuninori Imai , Mitsuo Miyamoto , Mitsuya Mikawa
发明人： Chikakazu Ninomiya , Takeji Shiokawa , Kuninori Imai , Mitsuo Miyamoto , Mitsuya Mikawa
IPC分类号： F16B3702
CPC分类号： B25D9/08 , B23B51/00 , B23B51/0081 , B23B51/009 , F16B37/122 , Y10T29/49881 , Y10T29/49904 , Y10T29/49945 , Y10T29/53078 , Y10T408/60
摘要： A taper implant includes a taper portion having an outer surface frust-conical in shape. A flange portion is formed at an outermost end of the taper portion on the larger-diameter side to project outwardly with respect to the taper portion and having a flat surface situated perpendicularly to the axial direction of the taper portion, and female threads serving as a fit portion extending in the axial direction of the taper portion. A hole taper portion and a hole step portion are drilled at the same time to bore a hole in one of the members to be fastened, and the taper implant is driven into the hole, thereby providing a screw fastening structure for the fastened members.
摘要翻译：锥形植入物包括具有外表面截锥形的锥形部分。凸缘部形成在大直径侧的锥形部的最外端，相对于锥形部向外突出，并且具有与锥形部的轴向垂直的平坦面，作为在锥形部的轴向延伸的配合部。同时钻孔孔部分和孔台阶部分以在待紧固的构件中的一个孔中钻孔，并且将锥形植入物驱动到孔中，从而为紧固构件提供螺钉紧固结构。

10. 外观设计

USD444148S1 Computer housing 失效
公开(公告)号：USD444148S1
公开(公告)日：2001-06-26
申请号：US29127511
申请日：2000-08-08
申请人： Sayuri Hashizume , Takashi Yamamoto , Takashi Ohwada , Toshiyuki Utsuki , Kenta Kumagai , Mitsuo Miyamoto , Fumio Kishida , Michihito Watarai
设计人： Sayuri Hashizume , Takashi Yamamoto , Takashi Ohwada , Toshiyuki Utsuki , Kenta Kumagai , Mitsuo Miyamoto , Fumio Kishida , Michihito Watarai

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