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1. 发明专利

JP2006179556A Method of repairing electronic part 审中-公开
标题翻译：修复电子部件的方法
公开(公告)号：JP2006179556A
公开(公告)日：2006-07-06
申请号：JP2004368981
申请日：2004-12-21
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： NAKAMURA MASATO , HACHIYA TOSHIHIRO , ISHIDA YOSHIKATSU , SUZUKI KAZUTOSHI
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To achieve a method of repairing an electronic part which displays excellent connection reliability.
SOLUTION: In an electronic part dismounting process in a repairing work, the electronic part is dismounted after it is subjected to a thermal treatment process containing a thermal treatment condition under which a connection interface between lands located on a mounting board and solders decreases remarkably in strength, then the residual solder is mechanically removed, and a substitute electronic part is remounted and connected.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：实现一种修复显示出良好的连接可靠性的电子部件的方法。解决方案：在修理工作中的电子部件拆卸过程中，电子部件经过包含热处理条件的热处理处理后被拆卸，在该处理条件下，位于安装板和焊盘之间的焊盘之间的连接接口减小显着地强度，然后机械地去除残留的焊料，并重新安装和连接替代电子部件。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2002057178A SEMICONDUCTOR MOUNTING STRUCTURE 失效
公开(公告)号：JP2002057178A
公开(公告)日：2002-02-22
申请号：JP2000244008
申请日：2000-08-07
申请人： HITACHI LTD
发明人： ISHIDA YOSHIKATSU , MURAMATSU MORIO
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To solve the problem that, in the flip chip type semiconductor element mounting, among bump electrodes of a semiconductor device arranged in a single or a plurality of arrays at narrow pitches, those bump electrodes of the semiconductor device for making electric conduction with terminal electrodes of a circuit board unstably faced them and, if chip bonding was applied as they were, the electric conduction became unstable. SOLUTION: In addition to those bump electrodes of a semiconductor device for making electric conduction, auxiliary electrodes are provided so that the device mounted together with the bump electrodes on a circuit board is parallel to the circuit board. This makes good the facing condition of the bump electrodes at terminal electrodes of the circuit board and reduces the unstableness of the electric conduction.

3. 发明专利

JP2001110932A WIRING BOARD AND MOUNTING METHOD FOR ELECTRONIC COMPONENT USING THE SAME 失效
公开(公告)号：JP2001110932A
公开(公告)日：2001-04-20
申请号：JP28516399
申请日：1999-10-06
申请人： HITACHI LTD
发明人： ISHIDA YOSHIKATSU , HACHIYA TOSHIHIRO
IPC分类号： H05K3/34 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a wiring board, as well as a mounting method for electronic components wherein, when a component (bare chip) mounted on a board is removed and replaced with a new one, other mounted components and a board assembly are reused as they are. SOLUTION: With an electronic component mounted on a wiring board, a plurality of first electrodes connectable to the electrode of electronic component as well as a plurality of second electrodes so connected to the first electrodes as to enclose them are provided. With the electrode of electronic component wire-bonded to the first electrode on the wiring board, if the electronic component is removed and other electronic component is mounted again, it is connected to the second electrode on the wiring board.

4. 发明专利

JPH08298433A SURFACE ACOUSTIC WAVE FILTER 失效
公开(公告)号：JPH08298433A
公开(公告)日：1996-11-12
申请号：JP14700896
申请日：1996-06-10
申请人： HITACHI LTD , HITACHI ELECTRONICS
发明人： HIKITA MITSUTAKA , SUMIOKA JUNJI , ISHIDA YOSHIKATSU
IPC分类号： H03H9/145 , H03H9/25 , H03H9/64
摘要： PURPOSE: To improve power resistance by arranging three common electrodes or over onto a piezoelectric substrate opposite to each other and using numbers of pairs of electrode fingers for one-opening surface acoustic wave resonator to expand the area of electrode conductors. CONSTITUTION: Common electrodes 9-1...9-6 are arranged in parallel on a piezoelectric substrate 8 and electrode fingers formed interdigitally are connected to each common electrode. The electrode 9-1 (9-2) at both ends is provided with a matching circuit comprising inductors 3, 4 (5, 6) with respect to an input (output) load with a signal input terminal 1 (output terminal 2). The one-opening surface acoustic wave resonator is formed between the adjacent common electrodes and the filter is formed by using the capacitance between the common earth and the piezoelectric substrate 8 comprising the common electrodes and the electrode fingers. Numbers of pairs of electrode fingers are adopted for the one-opening surface acoustic wave resonator to obtain a large area of the electrode conductors, injected power to the filter over a wide range, and the breakdown resistance to the one-opening surface acoustic wave resonator is strengthened against migration because of a small electrode loss.

5. 发明专利

JPH02159794A THICK FILM FORMING DEVICE OF HYBRID INTEGRATED CIRCUIT 失效
公开(公告)号：JPH02159794A
公开(公告)日：1990-06-19
申请号：JP31385788
申请日：1988-12-14
申请人： HITACHI LTD
发明人： ISHIDA YOSHIKATSU
IPC分类号： H05K3/12 , H05K3/40
摘要： PURPOSE:To surely form a through-hole by a method wherein a board mounting table provided with board through-hole sucking holes and holding holes formed on its outer peripheral end is placed on a board holding suction table in a detachable manner. CONSTITUTION:A board mounting table 3, which is provided with board through- hole sucking holes 3 and holding holes 10 that hold a board 2 by sucking and are formed on its outer peripheral end, is placed on a board holding suction table in a detachable manner. That is, the holes 6 slightly larger than through- holes 7 of the through hole forming board 2 are provided to the board mounting table 3 corresponding to the position of the through-holes 7 of the board 2 and not provided for a non-through hole section 9, so that suction is uniformly executed at the formation of through-holes. And a board fixing suction system is additionally provided, that is, the board 2 is sucked by the holes 10 separately provided, so that a through-hole forming suction power is made stable. By this setup, a through-hole can be surely formed.

6. 发明专利

JPS63155613A MANUFACTURE OF THIN-FILM DEVICE 失效
公开(公告)号：JPS63155613A
公开(公告)日：1988-06-28
申请号：JP30121786
申请日：1986-12-19
申请人： HITACHI LTD
发明人： ISOMAE HIROMI , ISHIDA YOSHIKATSU , IWAMA AKIRA
IPC分类号： H01L27/04 , H01L21/027 , H01L21/30 , H01L21/822 , H03H3/08
摘要： PURPOSE:To increase the yield of devices per wafer by installing an alignment pattern for a layer pattern at a gap between thin-film devices formed on a wafer. CONSTITUTION:First-layer electrodes with a pattern shape for a bonding pad are formed inside device-forming blocks 3 which are arranged at fixed intervals lengthwise and breadthwise. L-shaped and inverted-L-shaped alignment patterns 4 for the first-layer electrodes are formed at the outside of the device-forming block 3. Cross-shaped alignment patterns 5, for a second-layer electrode, which are formed on a photomask are aligned with the center of the alignment patterns 4 for the first-layer electrodes during an exposure process. By this method, even when the alignment patterns 4 are formed on a wafer, the device- forming blocks 3 are not affected. As a result, it is possible to enhance the yield efficiency for obtaining as many pieces as possible.

7. 发明专利

JP2000200803A MOUNTING DEVICE FOR ELECTRONIC ELEMENT 失效
公开(公告)号：JP2000200803A
公开(公告)日：2000-07-18
申请号：JP9399
申请日：1999-01-04
申请人： HITACHI LTD
发明人： ISHIDA YOSHIKATSU
IPC分类号： H05K3/34 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To reduce an occupied area of a wire bonding electrode pad part by dividing the electrode pad part into two electrode pad parts and by bonding a space between the electrode pad parts by a bonding part having a narrower width than the electrode pad part. SOLUTION: A part of a semiconductor element 2 on a wiring board 1 is supported by a wire bonding electrode pad part 3 provided on the semiconductor element 2 by a bonding wire 4 and another part of the opposite side is supported by a wire bonding electrode pad part 5 provided on the wiring board 1 by bonding. The wire bonding electrode pad part 5 provided on the wiring board 1 is bonded with a second electrode pad part 6 by bonding part 7 so provided as to have a narrower width than the wire bonding electrode pad part 5. The adjacent first and second electrode pads 5 and 6 of the wire bonding electrode pad parts are so arranged as to insert into a space generated by the bonding part 7 and these are repeated alternatively.

8. 发明专利

JPH08298434A SURFACE ACOUSTIC WAVE FILTER 失效
公开(公告)号：JPH08298434A
公开(公告)日：1996-11-12
申请号：JP14700996
申请日：1996-06-10
申请人： HITACHI LTD , HITACHI ELECTRONICS
发明人： HIKITA MITSUTAKA , SUMIOKA JUNJI , ISHIDA YOSHIKATSU
IPC分类号： H03H9/145 , H03H9/25 , H03H9/64
摘要： PURPOSE: To improve power resistance by arranging a common electrode group using a set of three common electrodes or over onto a piezoelectric substrate, an earth electrode between the two common electrode groups and using many pairs of electrode fingers for a one-opening surface acoustic wave resonator. CONSTITUTION: Common electrodes 9-1...9-6 are arranged in parallel on a piezoelectric substrate 8 and the surface acoustic wave filter is divided into filters 7-1, 7-2 to isolate the input and the output, and an earth electrode 13 is inserted between the filters 7-1, 7-2. Electrode fingers are connected interdigitally to each common electrode, a one-opening surface acoustic wave resonator is formed between adjacent common electrodes and the filter is formed by using the capacitance between the common earth and the piezoelectric substrate 8 comprising the common electrodes and the electrode fingers. Many pairs of electrode fingers are adopted for the one-opening surface acoustic wave resonator to obtain a large area of the electrode conductors, injected power to the filter over a wide range, and the breakdown resistance to the one-opening surface acoustic wave resonator is strengthened against migration because of a small electrode loss.

9. 发明专利

JPH04196827A BRANCHING FILTER DEVICE FOR RADIO EQUIPMENT 失效
公开(公告)号：JPH04196827A
公开(公告)日：1992-07-16
申请号：JP32298590
申请日：1990-11-28
申请人： HITACHI LTD
发明人： ISHIDA YOSHIKATSU
IPC分类号： H04B1/38
摘要： PURPOSE:To reduce the number of parts, to effectively utilize a radio equipment device side substrate, and to enable an application to a compact radio equipment by mounting constituting parts on one substrate in order to integrate them. CONSTITUTION:A surface acoustic wave filter is used as transmitting and receiving filters 102 and 103, the filters 102 and 103, received low noise amplifier 115, and reception mixer 118 or the like are arranged on the same substrate, barrier plate 105 which isolates the transmission and reception is installed on the substrate, and frame bodies 106 and 107 which electrically shields the entire substrate are installed in the surrounding. In this case, the filters 102 and 103 are reduced to one severals of the filter using a hollow resonator, and the filters 102 and 103 are mounted on one substrate 101, so that the holding parts can be reduced. Moreover, the received low noise amplifier 115 and reception mixer 118 or the like are integrated on one substrate 101, so that spare spaces for connecting each partial constituting element are not unnecessitated. On the other hand, the constituting parts can be three-dimensionally constituted on a radio equipment device substrate 111 without necessitating the spare spaces as a branching filter device. Thus, the application to the compact radio equipment can be attained.

10. 发明专利

JPH02179017A SURFACE ACOUSTIC WAVE DEVICE 失效
公开(公告)号：JPH02179017A
公开(公告)日：1990-07-12
申请号：JP33487088
申请日：1988-12-28
申请人： HITACHI LTD
发明人： ISHIDA YOSHIKATSU
IPC分类号： H03H9/25 , H05K3/34
摘要： PURPOSE:To eliminate the need for components such as lead frame leads and to obtain a small device having high reliability by forming wiring connecting to a surface acoustic wave chip on a ceramic substrate and soldering a recessed part provided to the ceramic substrate so as to connect the wiring and the wiring board. CONSTITUTION:An impedance matching pattern 1d is formed on the ceramic substrate 1 and a metallic material 2 ensuring grounding a surface acoustic wave chip 6 is fixed to a rectangular hole 1a in the middle of the substrate 1 with silver brazing 3 or the like. Moreover, copper foil is formed to the entire rear side of the substrate 1, a metallic frame 4 is provided on the substrate 1 while surrounding the chip 6 with a glass seal agent 19 and the opening opposite to the substrate 1 is welded by a metal made cover 5 under nitrogen atmosphere. The surface acoustic wave device filled with nitrogen is placed on the wiring board 16, the wire 17 formed on the board 16 is aligned to a recessed part 1c, which is soldered by using solder 13.

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