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1. 发明专利

DE3272754D1 DEW SENSOR 未知
公开(公告)号：DE3272754D1
公开(公告)日：1986-09-25
申请号：DE3272754
申请日：1982-10-27
申请人： HITACHI LTD
发明人： TANEI HIRAYOSHI , IWANAGA SHOICHI , IKEGAMI AKIRA , OTSU HIROSHI , ISOMAE HIROMI
IPC分类号： H01C7/00 , G01N27/12 , G01N27/04
摘要： A dew sensor of direct current type and resistance- lowering type with increasing humidity for quick and sharp detection of dewing is provided, which comprises a pair of counterposed electrodes, humidity-sensitive layer of insulating porous metal oxide with a porosity of 20 to 60% provided on and between the counterposed electrodes, and an organic polymer coating layer having a thickness of 0.05 to 2 µm provided on the humidity-sensitive layer.

2. 发明专利

GB2186456B SURFACE ACOUSTIC WAVE DEVICE 未知
公开(公告)号：GB2186456B
公开(公告)日：1989-11-08
申请号：GB8700064
申请日：1987-01-05
申请人： HITACHI LTD
发明人： YUHARA AKITSUNA , SASAKI JUN , ISOMAE HIROMI , KAWAKUBO SHOZI , YAMADA JUN
IPC分类号： H03H3/08 , H03H9/145

3. 发明专利

DE3700789C2 未知
公开(公告)号：DE3700789C2
公开(公告)日：1995-12-14
申请号：DE3700789
申请日：1987-01-13
申请人： HITACHI LTD
发明人： YUHARA AKITSUNA , SASAKI JUN , ISOMAE HIROMI , KAWAKUBO SHOZI , YAMADA JUN
IPC分类号： H03H3/08 , H03H9/145

4. 发明专利

GB2186456A Surface acoustic wave device 未知
公开(公告)号：GB2186456A
公开(公告)日：1987-08-12
申请号：GB8700064
申请日：1987-01-05
申请人： HITACHI LTD
发明人： YUHARA AKITSUNA , SASAKI JUN , ISOMAE HIROMI , KAWAKUBO SHOZI , YAMADA JUN
IPC分类号： H03H3/08 , H03H9/145
摘要： In a SAW device having a piezoelectric substrate (11) and interleaved metal electrodes (12, 12') formed on the substrate, the formation of the electrodes on the substrate is carried out by sputtering. Further, the metal electrodes may contain an additive of Cu, Ti, Zn, Mg, Fe, Ni, Cr, Ga, Ge, Sn, Pd or Ta. The resulting SAW device is capable of dealing with high frequency electric signals of a larger amplitude, or higher power electric signals, as compared with the conventional SAW device.

5. 发明专利

DE3700789A1 未知
公开(公告)号：DE3700789A1
公开(公告)日：1987-07-16
申请号：DE3700789
申请日：1987-01-13
申请人： HITACHI LTD
发明人： YUHARA AKITSUNA , SASAKI JUN , ISOMAE HIROMI , KAWAKUBO SHOZI , YAMADA JUN
IPC分类号： H03H3/08 , H03H9/145

6. 发明专利

JPH10106464A ELECTRON SOURCE AND MANUFACTURE THEREFOR 失效
公开(公告)号：JPH10106464A
公开(公告)日：1998-04-24
申请号：JP21161397
申请日：1997-08-06
申请人： HITACHI LTD
发明人： ISOMAE HIROMI , FUKUHARA SATORU , IZAWA SHIGERU , MATSUMOTO TAKESHI
IPC分类号： H01J1/15 , H01J9/04 , H01J37/06 , H01J37/073
摘要： PROBLEM TO BE SOLVED: To uniformize application to a needle-like cathode by applying specific metallic oxide powder and an applying solvent to the needle-like cathode joined to a heating filament. SOLUTION: A heating filament 2 composed of a W-made wire rod molded in a hair pin shape is welded to a stainless steel terminal 4 embedded and installed in a ceramic insulating insulator 5, and a W single crystal wire rod 1 is welded to the center of its heating filament 2. Preferably, application, heating and sintering are performed on this needle-like cathode 1 by using an applying solvent composed of metallic oxide powder composed of a zirconium oxide, a titanium oxide, a scandium oxide or a hafnium oxide and a solvent containing an acetic ester. Preferably, when the zirconium oxide, the titanium oxide, the scandium oxide or the hafnium oxide are formed in a delivery quantity of 10×10 g to 100×10 g, application of zirconium or the like to the needle-like cathode can be uniformized.

7. 发明专利

JPH09123629A SOLDER PASTE PRINTING AND MANUFACTURE OF COATED PLATE 失效
公开(公告)号：JPH09123629A
公开(公告)日：1997-05-13
申请号：JP28128695
申请日：1995-10-30
申请人： HITACHI LTD , NAKA INSTR KK
发明人： KANAZAWA DAISUKE , KADOTA YOSHIRO , GOIBUCHI KENICHI , ISOMAE HIROMI , MOROI FUKAMIZU , MINAFUJI TAKASHI , TOMIOKA MASAO
IPC分类号： B41F15/34 , B41C1/14 , B41N1/12 , H01R4/02 , H01R43/02 , H05K3/12 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To reduce the incidence of a fault such as electric shortcircuit caused by the crosslinking of a solder between adjacent lead wires by applying a method for printing a solder paste to a semiconductor with lead wires spaced at a pitch of 0.5mm. SOLUTION: A silicone resin liquid is poured into a metal mask 1 for printing a solder paste 5 to prepare a thermally cured coated plate. In addition, a mutually less adhesive film to the metal mask 1 and the solder paste 5 is formed on the upper surface of a protrusion on a coated plate. Further, a mutually less viscous film 4 is formed on the lateral wall of an opening part in the metal mask 1 consisting of the metal mask 1 stacked on the coated plate. Finally, the solder paste 5 is printed by transfer on the electrode terminal of a printed circuit board 7 through the metal mask 1 with a specified opening part.

8. 发明专利

JPH08250845A METHOD FOR MOUNTING COMPONENT ON PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPH08250845A
公开(公告)日：1996-09-27
申请号：JP4810195
申请日：1995-03-08
申请人： HITACHI LTD
发明人： NISHINO TERUMICHI , MOROI FUKAMIZU , ISOMAE HIROMI , OYAMA ZENSHIRO , KADOTA YOSHIRO
IPC分类号： H05K3/34
摘要： PURPOSE: To prevent solder balls and the residue of flux from entering gaps between a printed wiring board and components mounted on the surface of the printed wiring board by providing an organic compound in the gaps. CONSTITUTION: Components 7 are mounted on a printed wiring board 3 after preventing the entering of solder balls, solvent, vapor, gas, water, etc., in gaps formed with a printed wiring board 3 and components 7 mounted on the surface of the board 3 by providing a single layer of double layers of an organic compound in the gap 7. Such a compound that does not react to solder, namely, is not wetted with solder and does not react to flux is suitable for the compound 1. The compound 1 can be 2-phenoxy ethanol A, ethylene glycol B, metha- phenoxy toluene, 2-phenylethyl alcohol D, 3-phenyl-1-propanol E, etc.

9. 发明专利

JPH02123792A MANUFACTURE OF THICK-FILM HYBRID INTEGRATED CIRCUIT DEVICE 失效
公开(公告)号：JPH02123792A
公开(公告)日：1990-05-11
申请号：JP27624288
申请日：1988-11-02
申请人： HITACHI LTD
发明人： ISOMAE HIROMI , KOBAYASHI TAKAO
IPC分类号： H05K3/34 , H05K1/09
摘要： PURPOSE:To solder a part, in which the intervals of leads are narrowed, positively, and to increase element packaging density by forming a solder film onto the exposed conductor of a thick-film circuit substrate, applying solder paste to a desired section, loading the part and making solder reflow. CONSTITUTION:A protectic coat 4 functioning as a solder resist in combination is shaped, a substrate 1 is dipped in a molten solder bath, and pulled up and annealed, solder is solidified and a solder film 5 is formed, solder paste 6 is printed and applied onto the solder film 5 on a terminal electrode 3, to which a part, in which the intervals of leads are widened, is connected, the part is loaded at a specified position, and solder paste is heated and made to reflow. Accordingly, no short-circuit defect is generated even in sections, in which lead intervals are narrowed, and a solder-quantity shortage loose defect can be prevented by supplying solder paste even in the sections of leads, in which lead intervals are broadened and thickened, thus increasing element packaging density.

10. 发明专利

JPS6244858B2 失效
公开(公告)号：JPS6244858B2
公开(公告)日：1987-09-22
申请号：JP9763382
申请日：1982-06-09
申请人： HITACHI LTD
发明人： YOSHIKAWA KAZUO , ISOMAE HIROMI
IPC分类号： H05K1/02 , H01L23/50 , H01L23/544 , H05K1/11 , H05K3/34

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