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    • 2. 发明专利
    • Visual inspection apparatus using electron beam
    • 使用电子束的视觉检查装置
    • JP2003083917A
    • 2003-03-19
    • JP2001277418
    • 2001-09-13
    • Hitachi Ltd株式会社日立製作所
    • GUNJI YASUHIRONINOMIYA HIROSHIFUNATSU RYUICHIKAMETANI MASATSUGUYAMAMOTO KENJIRO
    • G01N23/225G01R31/02G01R31/302H01J37/147H01J37/28H01L21/66
    • PROBLEM TO BE SOLVED: To provide a visual inspection apparatus using an electron beam by which a defect hardly detectable by an optical image is detected with high accuracy by using an electron beam image, and by which a dose amount and an inspection speed as an inspection-apparatus single body as becoming a problem at this time can be controlled by a simple operation and with high accuracy. SOLUTION: In the inspection apparatus, the defect in a sample is detected on the basis of a detection signal of secondary charged particles generated by scanning the electron beam. The apparatus comprises a means which decides the inspection speed and a primary electron dose. The apparatus is provided with a function by which, when one from among both is decided, the other is automatically adjusted according to its result.
    • 要解决的问题:提供一种使用电子束的目视检查装置,其中通过使用电子束图像以高精度检测到难以被光学图像检测到的缺陷,并且通过其使用剂量和检查速度作为检查 此时成为问题的装置单体可以通过简单的操作和高精度来控制。 解决方案:在检查装置中,基于通过扫描电子束产生的二次带电粒子的检测信号来检测样品中的缺陷。 该装置包括决定检查速度和初级电子剂量的装置。 该装置具有如下功能:当两者之一决定时,另一个根据其结果自动调整。
    • 3. 发明专利
    • Method and apparatus for testing pattern
    • 测试模式的方法和装置
    • JP2003031629A
    • 2003-01-31
    • JP2001216254
    • 2001-07-17
    • Hitachi Ltd株式会社日立製作所
    • HIROI TAKASHIWATANABE MASAHIROTANAKA MAKIKUNI TOMOHIROSHISHIDO CHIENISHIYAMA HIDETOSHIOKUDA HIROTOMIYAI YASUSHIGUNJI YASUHIROSHIMODA ATSUSHIOSHIMA YOSHIMASA
    • H01L21/66
    • PROBLEM TO BE SOLVED: To eliminate the problem that in a method wherein a charged particle beam is cast on a substrate to be tested, and secondary electrons or the like emitted are detected to obtain an image, and then the obtained image is compared with a reference image to test the substrate for pattern defects or a defect is checked by moving to a location of a pattern defect, the substrate to be tested is charged up by the irradiation of the charged particle beam, causing the charged particle beam to be bent and then the positional deviation of the defect.
      SOLUTION: An amount of positional deviation at the time of inspection and an amount of positional deviation from a reference image are inspected and, at the same time, calculated to correct the location of the defect at the time of inspection. Defects information is added with an image at the time of inspection, and then is corrected for an amount of positional deviation between image information and layout information. The defects information is added with the image at the time of inspection, and then is compared with an image at the time of checking defects to correct the location of the defect. When checking defects, an image is obtained and then is added to the defects information, and the defects information is compared with the image at the time of checking defects and an image detected by another apparatus or with the layout information, to correct the location of the defect.
      COPYRIGHT: (C)2003,JPO
    • 要解决的问题:为了消除在被测试的基板上投射带电粒子束的方法,并且检测发射的二次电子等以获得图像的问题,然后将获得的图像与 通过移动到图案缺陷的位置来检查用于图案缺陷的基板的参考图像或缺陷,通过照射带电粒子束对待测试的基板进行充电,使带电粒子束弯曲, 那么缺陷的位置偏差。 解决方案:检查检查时的位置偏差量和与参考图像的位置偏差量,同时计算出在检查时纠正缺陷的位置。 缺陷信息在检查时添加图像,然后对图像信息和布局信息之间的位置偏差量进行校正。 缺陷信息在检查时与图像一起添加,然后与检查缺陷时的图像进行比较,以校正缺陷的位置。 当检查缺陷时,获得图像,然后将其添加到缺陷信息中,并且在检查缺陷时的缺陷信息和与其他装置检测到的图像或布局信息相比较时,将缺陷信息与图像进行比较,以校正 缺陷。
    • 4. 发明专利
    • Charged particle ray device and automatic astigmatic adjusting method
    • 充电粒子装置和自动平衡调整方法
    • JP2003016983A
    • 2003-01-17
    • JP2001202904
    • 2001-07-04
    • Hitachi Ltd株式会社日立製作所
    • WATANABE MASAHIROTAKEDA MASATAKEHAYAKAWA KOICHIGUNJI YASUHIRO
    • G01N23/225H01J37/153H01J37/28
    • H01J37/153H01J37/28H01J2237/2817
    • PROBLEM TO BE SOLVED: To provide a charged particle ray device and an automatic astigmatic correction method allowing astigmatic and focus adjustment of high speed and high accuracy. SOLUTION: A small number of two-dimensional particle images acquired while changing the focus in two kinds of scanning directions are processed to detect the direction and grade of astigmatic difference and focus offset which are batch-converted into two kinds of astigmatic correction quantity and focus correction quantity to make a correction, thus realizing automatic astigmatic and focus adjustment of high speed and high accuracy. An astigmatic difference error is corrected to realize automatic astigmatic and focus adjustment of higher accuracy and further to realize the device that realizes inspection and measurement of high accuracy over a long time using the automatic astigmatic and focus adjustment.
    • 要解决的问题:提供一种带电粒子射线装置和自动散光校正方法,允许高速和高精度的像散和焦点调节。 解决方案:处理在两种扫描方向上改变焦点时获取的少量二维粒子图像,以检测散焦差异和聚焦偏移的方向和等级,将其分批转换为两种散光校正量和焦点 校正量进行校正,从而实现高速,高精度的自动散光和焦点调节。 校正散光差异误差,实现更高精度的自动散光和聚焦调整,并进一步实现使用自动散光和聚焦调整实现长时间高精度检测和测量的设备。
    • 5. 发明专利
    • Method and system for pattern inspection using electron beam
    • 使用电子束的图案检查的方法和系统
    • JP2006162609A
    • 2006-06-22
    • JP2005333561
    • 2005-11-18
    • Hitachi Ltd株式会社日立製作所
    • HIROI TAKASHIKUNI TOMOHIROWATANABE MASAHIROSHISHIDO CHIESHINADA HIROYUKIGUNJI YASUHIROTAKATO ATSUKO
    • G01N23/225G01B15/04H01J37/22H01J37/244H01J37/28H01L21/66
    • PROBLEM TO BE SOLVED: To provide a method and a system for pattern inspection using electron beam, which can solve the problem inherent to the present technology in electron optics systems or detectors requiring detector of above a certain area or larger as an important factor for irradiating electron beam and detect its secondary electrons, etc. at a high speed, where the detection of 200 Msps or higher is actually difficult due to the constraint of the frequency being inversely proportional to the area.
      SOLUTION: For example, to detect at 400 Msps with the required area set as 4 mm angle and speed at this 4 mm angle as 150 Msps, four simple detectors of high-speed 2 mm angle are aligned, signals of them are amplified and then added to be subject to A/D conversion. Alternatively, a secondary electronic deflector is used to allow secondary electrons to sequentially be incident into the detector of 8 mm angle, detected at 100 Msps, and then aligned after A/D conversion. Both of these methods can achieve an area of 4 mm angle and a speed of 400 Msps.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供一种使用电子束进行图案检查的方法和系统,其可以解决当前技术中固有的电子光学系统或需要高于某一区域或更大的检测器的检测器的重要问题作为重要的问题 用于照射电子束的因子并且以高速检测其二次电子等,其中由于频率与面积成反比的约束,实际上难以检测到200 Msps或更高。

      解决方案:例如,为了检测400 Msps,所需区域设置为4 mm角,速度为4 mm,为150 Msps,高速2 mm角的四个简单检测器对齐,其信号为 放大后再添加进行A / D转换。 或者,二次电子偏转器用于允许二次电子顺序地入射到以100 Msps检测到的8mm角的检测器中,然后在A / D转换之后对准。 这两种方法都可以达到4 mm角,400 Msps的速度。 版权所有(C)2006,JPO&NCIPI