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1. 发明申请

US20020026258A1 Method and apparatus for testing IC device 失效
标题翻译： IC器件测试方法及装置
公开(公告)号：US20020026258A1
公开(公告)日：2002-02-28
申请号：US09802914
申请日：2001-03-12
申请人： Hitachi Electronics Engineering Co., Ltd.
发明人： Tetsuya Suzuki , Akira Okitsu
IPC分类号： G06F019/00 , G06F007/00 , B65H029/32 , B65G057/04 , B65G059/02 , B65H003/08
CPC分类号： G01R31/2893 , B65G57/04 , B65G59/02
摘要： For testing electrical properties of packaged IC devices, there is provided an apparatus which includes a test board which is located at a testing station and provided with a plural number of contacting sockets for connecting individual IC devices to an IC tester separately and independently of each other, a loader which is located at a loading station and adapted to feed untested IC devices toward the test board, an unloader which is located at an unloading station and adapted to discharge tested IC devices from the test board at the testing station, and a device transfer mechanism which is movable across the testing station to transfer untested IC devices from the loader to the test board and also to transfer tested IC devices from the test board to the unloader. Upon detecting completion of a test on one of IC devices in one socket of the test board, a fresh untested IC device is transferred to the testing station to replace the tested IC device. As soon as the fresh IC device is set in position in that socket, execution of a test program is started with respect to that socket on the test board.
摘要翻译：为了测试封装的IC器件的电气特性，提供了一种设备，它包括一个测试板，该测试板位于测试站并且具有多个接触插座，用于将各个IC器件与IC测试器分别且彼此独立地连接位于加载站并适于将未测试IC器件馈送给测试板的装载机，位于卸载站处并适于从测试站处的测试板排出测试的IC器件的卸载器，以及装置传送机构，其可跨越测试站移动，以将未经测试的IC设备从装载器传送到测试板，并将测试的IC器件从测试板传送到卸载器。当检测到在测试板的一个插座中的一个IC器件上的测试完成时，将新的未经测试的IC器件传送到测试站以替换测试的IC器件。只要新的IC器件在该插座中就位，就可以对测试板上的插座开始执行测试程序。

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