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1. 发明申请

US20020026258A1 Method and apparatus for testing IC device 失效
标题翻译： IC器件测试方法及装置
公开(公告)号：US20020026258A1
公开(公告)日：2002-02-28
申请号：US09802914
申请日：2001-03-12
申请人： Hitachi Electronics Engineering Co., Ltd.
发明人： Tetsuya Suzuki , Akira Okitsu
IPC分类号： G06F019/00 , G06F007/00 , B65H029/32 , B65G057/04 , B65G059/02 , B65H003/08
CPC分类号： G01R31/2893 , B65G57/04 , B65G59/02
摘要： For testing electrical properties of packaged IC devices, there is provided an apparatus which includes a test board which is located at a testing station and provided with a plural number of contacting sockets for connecting individual IC devices to an IC tester separately and independently of each other, a loader which is located at a loading station and adapted to feed untested IC devices toward the test board, an unloader which is located at an unloading station and adapted to discharge tested IC devices from the test board at the testing station, and a device transfer mechanism which is movable across the testing station to transfer untested IC devices from the loader to the test board and also to transfer tested IC devices from the test board to the unloader. Upon detecting completion of a test on one of IC devices in one socket of the test board, a fresh untested IC device is transferred to the testing station to replace the tested IC device. As soon as the fresh IC device is set in position in that socket, execution of a test program is started with respect to that socket on the test board.
摘要翻译：为了测试封装的IC器件的电气特性，提供了一种设备，它包括一个测试板，该测试板位于测试站并且具有多个接触插座，用于将各个IC器件与IC测试器分别且彼此独立地连接位于加载站并适于将未测试IC器件馈送给测试板的装载机，位于卸载站处并适于从测试站处的测试板排出测试的IC器件的卸载器，以及装置传送机构，其可跨越测试站移动，以将未经测试的IC设备从装载器传送到测试板，并将测试的IC器件从测试板传送到卸载器。当检测到在测试板的一个插座中的一个IC器件上的测试完成时，将新的未经测试的IC器件传送到测试站以替换测试的IC器件。只要新的IC器件在该插座中就位，就可以对测试板上的插座开始执行测试程序。

2. 发明申请

US20020171446A1 Driver circuit integrated with load current output circuit, pin electronics and IC tester having thereof 失效
标题翻译：与负载电流输出电路集成的驱动电路，引脚电子器件及其IC测试器
公开(公告)号：US20020171446A1
公开(公告)日：2002-11-21
申请号：US10032761
申请日：2001-12-27
申请人： Hitachi Electronics Engineering Co., Ltd
发明人： Keizo Takechi , Akio Ohsaki , Yoshihiko Hayashi , Kazuhiko Murata
IPC分类号： G01R031/26
CPC分类号： G01R31/31924
摘要： A driver circuit integrated with a load current output circuit has a function as a driver for applying a predetermined test waveform to a device under test (DUT), and a function as a load current output for reproducing an actual use situation by receiving the load current to the DUT to judge a response waveform by receiving the response waveform from the DUT. Both functions are made up on a common circuit, operate as the driver circuit when applying the test waveform, and operate as the load current output circuit when judging the response waveform.
摘要翻译：与负载电流输出电路集成的驱动电路具有作为将预定测试波形施加到被测器件（DUT）的驱动器的功能，以及作为负载电流输出的功能，用于通过接收负载电流来再现实际使用状况通过接收来自DUT的响应波形来判断响应波形。这两个功能都由公共电路组成，在应用测试波形时作为驱动电路运行，并在判定响应波形时作为负载电流输出电路工作。

3. 发明申请

US20020036771A1 Apparatus and method for inspecting surface of semiconductor wafer or the like 有权
标题翻译：用于检查半导体晶片等的表面的装置和方法
公开(公告)号：US20020036771A1
公开(公告)日：2002-03-28
申请号：US09961513
申请日：2001-09-24
申请人： HITACHI ELECTRONICS ENGINEERING CO., LTD.
发明人： Tatsuya Sato , Yuichiro Kato , Kenji Mitomo
IPC分类号： G01N021/00
CPC分类号： G01N21/9501
摘要： Light beam is irradiated onto a surface of a substrate to be inspected and scattered lights from the surface of the substrate are received at different light reception angles, so that first and second light detection signals corresponding to the different light reception angles are generated. Reference function defining a correlation in level value between the first and second light detection signals is set, a comparison is made between respective level values of the first and second light detection signals using the reference function as a comparison reference, and it is determined, on the basis of a result of the comparison, which of a plurality of different types of defects, such as a foreign substance and crystal-originated pit, a possible defect present on the surface of the substrate, which is represented by the light detection signals, corresponds to. Also, the level value of a predetermined one of a plurality of the light detection signals is weighted with a predetermined coefficient, and a comparison is made between the weighted level value of the predetermined light detection signal and the level value of the remaining light detection signal, to thereby identify any of a plurality of different types of defects, such as a foreign substance and scratch, present on the surface of the substrate.
摘要翻译：将光束照射到要检查的基板的表面上，并且以不同的光接收角接收来自基板表面的散射光，从而产生与不同的光接收角对应的第一和第二光检测信号。设定定义第一和第二光检测信号之间的电平值的相关性的参考功能，使用参考功能作为比较基准比较第一和第二光检测信号的各个电平值，并且确定为比较结果的基础，由光检测信号表示的多种不同类型的缺陷中的哪一种，例如异物和晶体起源的凹坑，存在于基板的表面上的可能的缺陷，对应。此外，多个光检测信号中的预定一个光检测信号的电平值以预定系数加权，并且比较预定光检测信号的加权电平值和剩余光检测信号的电平值，从而识别存在于基板表面上的多种不同类型的缺陷，例如异物和划痕。

4. 发明申请

US20040198181A1 Polishing apparatus with abrasive tape, polishing method using abrasive tape and manufacturing method for magnetic disk 失效
标题翻译：研磨带抛光装置，研磨用抛光方法及磁盘制造方法
公开(公告)号：US20040198181A1
公开(公告)日：2004-10-07
申请号：US10656926
申请日：2003-09-05
申请人： Hitachi Electronics Engineering Co. Ltd.
发明人： Fujio Tajima , Hideaki Amano , Teruaki Tokutomi , Takahisa Ishida , Kazuyuki Sonobe , Yasunori Fukuyama , Tsutomu Nagakura , Noritake Shizawa , Takeshi Sato
IPC分类号： B24B049/00 , B24B001/00 , B24B007/19
CPC分类号： B24B21/004 , B24B21/12 , B24B49/16
摘要： An abrasive tape is supplied to a tape head by a tape supply unit and taken up from the tape head by a tape take-up unit. The tape head presses the abrasive tape against a surface of an object under polish, which is rotated by a rotating unit. A tape head pressuring unit utilizes a vice voice coil motor, for example. Since the tape head pressuring unit generates a pressuring force for pressuring the tape head using the electromagnetic force, it is able to set a minute pressuring force by controlling a drive signal, and to obtain the fine adjustment of the pressuring force easily by controlling the electric signal. Therefore, it becomes possible to press the abrasive tape against the surface of the object under polish with a desired low pressure.
摘要翻译：研磨带由带供应单元提供给带头，并通过带卷取单元从带头卷取。带头将研磨带压在被抛光的物体的表面上，该表面由旋转单元旋转。磁头加压单元例如使用副音圈马达。由于带头加压单元产生用于使用电磁力对带头加压的加压力，所以能够通过控制驱动信号来设定微小的加压力，并且通过控制电力来容易地获得加压力的微调信号。因此，可以以期望的低压力将研磨带压在物体的表面下，在抛光下。

5. 发明申请

US20040045575A1 Apparatus and method for processing a substrate 审中-公开
标题翻译：用于处理衬底的装置和方法
公开(公告)号：US20040045575A1
公开(公告)日：2004-03-11
申请号：US10658422
申请日：2003-09-10
申请人： Hitachi Electronics Engineering Co., Ltd
发明人： Kazuto Kinoshita , Kazuhiko Gommori , Kenya Wada
IPC分类号： B08B007/02
CPC分类号： H01L21/67115 , B08B7/00 , B08B7/0057 , C03C23/0075 , G02F2001/1316 , G11B23/505 , H01L21/67028 , Y10S134/902
摘要： A lamp house is located face to face with a substrate which is transferred by a conveyer means. A dielectric barrier discharge lamp is provided in the lamp house to irradiate the substrate with ultraviolet light, while a moistened inert gas, consisting of an inert gas and water vapor, is supplied to a space between the substrate and the dielectric barrier discharge lamp from a moistened inert gas generating means. Under irradiation of ultraviolet light from the dielectric barrier discharge lamp, water vapor in the moistened inert gas is split into a reducing active member nullH.null and an oxidative active member null.OHnull.
摘要翻译：一个灯座与一个由传送装置传送的基片面对面。介电阻挡放电灯设置在灯室中以紫外线照射基板，同时由惰性气体和水蒸气组成的润湿惰性气体从基板和介质阻挡放电灯之间的空间润湿惰性气体发生装置。在来自介电阻挡放电灯的紫外线照射下，湿润的惰性气体中的水蒸气被分解成还原活性成分[H]和氧化活性成分[.OH]。

6. 发明申请

US20020043344A1 Method and apparatus for bonding substrate plates together through gap-forming sealer material 失效
标题翻译：通过间隙形成密封材料将基板连接在一起的方法和装置
公开(公告)号：US20020043344A1
公开(公告)日：2002-04-18
申请号：US09951512
申请日：2001-09-14
申请人： Hitachi Electronics Engineering Co., Ltd.
发明人： Hiroyuki Watanabe , Yuji Otsubo , Shinji Sugizaki , Hisayoshi Ichikawa , Hiroaki Kiyomiya
IPC分类号： B32B031/00
CPC分类号： G02F1/1339 , B32B38/1841 , B32B2038/1891 , B32B2041/04 , B32B2457/202 , G02F2001/133354 , Y10T156/1092
摘要： Method and apparatus for registering and bonding upper and lower substrate plates together through a sealer material and in such a way as to form a gap of a predetermined width between the two substrate plates. Registered substrate plates are provisionally pressed to form a joined substrate assembly, which is then pressed under heated conditions at a hot press station, thereby compressing the sealer material into a flattened form and at the same time thermally hardening the sealer material to form a predetermined gap space between the two substrate plates. In order to correct positional deviations which occur to the upper and lower substrate plates in the course of the hot pressing, on the basis detected positional deviations of upper and lower substrate plates of a hot-pressed substrate assembly, upper and lower substrates are set in offset positions instead of aligned positions when registering them at the provisional press station to cancel predicted positional deviations at the hot press station.
摘要翻译：用于通过密封材料将上和下基板一起登记和粘合在一起的方法和装置，并且以这样的方式形成两个基板之间的预定宽度的间隙。临时压制注册的基板以形成接合的基板组件，然后在加热条件下在热压站处压制，从而将密封剂材料压缩成扁平形式，同时将密封材料热固化以形成预定间隙两个基板之间的空间。为了校正在热压过程中上，下基板发生的位置偏差，基于检测到热压基板组件的上基板和下基板的位置偏差，将上基板和下基板设置在偏移位置，而不是在临时压力机台登记时对准的位置，以取消热压站的预测位置偏差。

7. 发明申请

US20010015021A1 Method and apparatus for drying substrate plates 失效
标题翻译：干燥基板的方法和装置
公开(公告)号：US20010015021A1
公开(公告)日：2001-08-23
申请号：US09780498
申请日：2001-02-12
申请人： Hitachi Electronics Engineering Co., Ltd.
发明人： Kazuhiko Gommori , Kazuto Kinoshita , Isamu Akiba , Masao Sugiyama
IPC分类号： F26B003/00
CPC分类号： F26B5/14 , F26B15/12 , F26B21/004
摘要： While being transferred in substantially horizontal state along a predetermined path of transfer by a conveyer means, a substrate plate is dried by a jet of compressed air which is spurted out from a slit-like mouth of an air knife nozzle crosswise of the entire width of the substrate plate and at a predetermined angle of incidence with respect to a drying surface of the substrate plate to scrape off a liquid. The angle of incidence of jet air is made shallower as soon as the substrate on the conveyer means comes to a point of entry to an air blasting zone and is made deeper at latest when the substrate plate comes to a position immediately before a point of disengagement from the air blasting zone.
摘要翻译：当沿着预定的传送路径以大致水平的状态转移时，通过压缩空气的喷射流干燥衬底板，压缩空气从空气刀喷嘴的狭缝状口喷出，横截面为整个宽度并且相对于基板的干燥表面以预定的入射角度刮去液体。一旦输送装置上的基板进入到喷气区，喷射空气的入射角变得更浅，并且当基板刚刚脱离接合点之前立即变得更深从喷砂区。

8. 发明申请

US20020192391A1 Method and apparatus for treating surface of substrate plate 失效
标题翻译：用于处理基板表面的方法和装置
公开(公告)号：US20020192391A1
公开(公告)日：2002-12-19
申请号：US09988559
申请日：2001-11-20
申请人： Hitachi Electronics Engineering Co., Ltd.
发明人： Kenya Wada , Kazuto Kinoshita , Kazuhiko Gommori
IPC分类号： B44C001/22 , H01L021/306 , H01L021/31
CPC分类号： B08B7/0057 , B08B7/0035
摘要： Method and apparatus for treating a surface of a substrate plate under irradiation of ultraviolet ray emitted from a dielectric barrier discharge lamp. Upon admission into a treating chamber, oxygen is removed from a treating surface and surrounding atmosphere of a substrate plate in order to suppress energy losses of ultraviolet ray to a minimum.
摘要翻译：用于在从电介质阻挡放电灯发射的紫外线的照射下处理基板的表面的方法和装置。进入处理室时，从基板的处理面和周围的气氛除去氧，以将紫外线的能量损失抑制到最小。

9. 发明专利

DE3337499C2 未知
公开(公告)号：DE3337499C2
公开(公告)日：1987-01-22
申请号：DE3337499
申请日：1983-10-14
申请人： HITACHI, LTD., TOKIO/TOKYO, JP , HITACHI ELECTRONICS ENGINEERING CO., LTD., ASHIGARAKAMI, KANAGAWA, JP
发明人： TAKAHASHI, HATSUO, CHIGASAKI, JP , HIBINO, JUNICHI, MINAMI-ASHIGARA, JP
IPC分类号： H02K33/18 , G11B5/11 , G11B5/55 , G11B21/02 , H02K41/035 , G11B5/58

10. 发明专利

DE3513035C2 未知
公开(公告)号：DE3513035C2
公开(公告)日：1988-01-21
申请号：DE3513035
申请日：1985-04-11
申请人： HITACHI, LTD., TOKIO/TOKYO, JP , HITACHI ELECTRONICS ENGINEERING CO., LTD., ASHIGARAKAMI, KANAGAWA, JP
发明人： SAITO, SUSUMU, HACHIOJI, TOKIO/TOKYO, JP , SUZUKI, MICHIO, HINO, TOKIO/TOKYO, JP , SUDA, KYO, HACHIOJI, TOKIO/TOKYO, JP , YATSUGAKE, YASUO, ODAWARA, KANAGAWA, JP , TSUKADA, KAZUYA, KANAGAWA, JP
IPC分类号： G01N15/02 , G01N15/14 , G01N21/39 , G01N15/06 , G01N15/12 , G01N21/47
摘要： In a small particle detection system for use in detecting small particles, which float in a gas, by utilizing the light scattering effect thereof, a detecting cell is disposed in an external optical resonator which is adapted to resonate with the output light from a laser oscillator. When the detecting cell is disposed in the laser oscillating optical resonator, the position is selectively determined; the former is set in the position in the latter in which the diameter of a laser beam is minimal.

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