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1. 发明专利

JP2012209558A Anisotropic conductive adhesive for circuit member connection 审中-公开
标题翻译：用于电路会员连接的各向导性粘合剂
公开(公告)号：JP2012209558A
公开(公告)日：2012-10-25
申请号：JP2012098913
申请日：2012-04-24
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE ITSUO , TAKEMURA KENZO , NAGAI AKIRA , ISAKA KAZUHIRO , WATANABE OSAMU , KOJIMA KAZUYOSHI
IPC分类号： H01L21/60 , C09J7/00 , C09J9/02 , C09J11/04 , C09J11/06 , C09J133/00 , C09J163/00 , H01B1/20 , H05K1/14 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide an adhesive with which a circuit board hardly causing an increase of connection resistance at a connection and separation of an adhesive and remarkably improved in connection reliability can be manufactured.SOLUTION: An anisotropic conductive adhesive for circuit member connection is interposed between circuit electrodes facing with each other and, when pressure is applied between the circuit electrodes facing with each other, electrically connects between the electrodes in the pressurized direction. The adhesive contains: an adhesive resin composition including an epoxy resin having a skeleton including at least one naphthalene ring in one molecule and a latent curing agent; an inorganic filler selected from a group consisting of fused silica, crystalline silica, calcium silicate, alumina and calcium carbonate and having an average particle size of 3 μm or less; and a conductive particle. A content of the inorganic filler in the adhesive is 40-90 pts. wt. relative to 100 pts. wt. of the adhesive resin composition, and an average thermal expansion coefficient at 120-140°C after curing of the adhesive is 120 ppm or less.
摘要翻译：要解决的问题：为了提供一种电路板几乎不会导致连接处的连接电阻增加并且粘合剂分离并且显着提高连接可靠性的粘合剂。解决方案：用于电路构件连接的各向异性导电粘合剂插入在彼此面对的电路电极之间，并且当在彼此面对的电路电极之间施加压力时，在加压方向上电连接电极。粘合剂包含：粘合树脂组合物，其包含在一分子中具有至少一个萘环的骨架的环氧树脂和潜在性固化剂; 选自熔融二氧化硅，结晶二氧化硅，硅酸钙，氧化铝和碳酸钙的平均粒径为3μm以下的无机填料; 和导电颗粒。粘合剂中无机填料的含量为40-90点。重量。相对于100点。重量。，粘合剂固化后的120-140℃的平均热膨胀系数为120ppm以下。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2011171711A Adhesive film for semiconductor wafer processing 有权
标题翻译：用于半导体波导处理的粘合膜
公开(公告)号：JP2011171711A
公开(公告)日：2011-09-01
申请号：JP2010277311
申请日：2010-12-13
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE OSAMU , TAKEMURA KENZO , SATO SHIN , KAWABATA YASUNORI , NAGAI AKIRA
IPC分类号： H01L21/304 , C09J7/02 , C09J11/04 , C09J11/06 , C09J201/00
CPC分类号： H01L21/6836 , H01L2221/68327 , H01L2221/6834
摘要： PROBLEM TO BE SOLVED: To provide an adhesive film for a semiconductor wafer processing that actualizes uniform and flat backgrind of a semiconductor wafer, allows a base film to be easily peeled from an adhesive layer, and hardly causes degradation in the performance of the adhesive layer. SOLUTION: The adhesive film for a semiconductor wafer processing includes a mold release layer, the adhesive layer, an isolation layer, and the base film in order on a carrier tape, and is used to process the semiconductor wafer, wherein each of the adhesive layer, isolation layer and base film is formed in a wafer shape of substantially the same size with the semiconductor wafer to be processed. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供实现半导体晶片的均匀和平坦的背面研磨的用于半导体晶片处理的粘合膜，允许基膜容易从粘合剂层剥离，并且几乎不会导致性能降低粘合剂层。解决方案：用于半导体晶片处理的粘合剂膜在载带上依次包括脱模层，粘合剂层，隔离层和基膜，并且用于处理半导体晶片，其中每个将粘合剂层，隔离层和基膜形成为与要加工的半导体晶片大致相同尺寸的晶片形状。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2011165822A Film for processing semiconductor wafer, and method of manufacturing semiconductor chip using the film 有权
标题翻译：用于处理半导体膜的膜和使用膜制造半导体芯片的方法
公开(公告)号：JP2011165822A
公开(公告)日：2011-08-25
申请号：JP2010025702
申请日：2010-02-08
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： SATO SHIN , TAKEMURA KENZO , NAGAI AKIRA , WATANABE OSAMU , KAWABATA YASUNORI
IPC分类号： H01L21/301 , H01L21/304 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a film for processing a semiconductor wafer, reduced in manufacturing cost while existing manufacturing processes are utilized, and also to provide a method of manufacturing a semiconductor chip using the film.
SOLUTION: In a film 10 used for processing a semiconductor wafer, a separating layer 2 and an adhesive agent layer 3 are laminated on a base material 1 in this order. The adhesive agent layer 3 is individualized in a shape covering the whole of the semiconductor wafer to which the film 10 for processing a semiconductor wafer is bonded, and thereby, a plurality of individualized adhesive agent layers 3 exist on the separating layer 2.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供用于处理半导体晶片的膜，在利用现有制造工艺的同时降低制造成本，并且还提供使用该膜制造半导体芯片的方法。解决方案：在用于处理半导体晶片的膜10中，分层2和粘合剂层3依次层压在基材1上。粘合剂层3以覆盖半导体晶片的整个半导体晶片的形状个体化，半导体晶片用于处理半导体晶片的膜10，从而在分离层2上存在多个单独的粘合剂层3。 >版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2011109022A Method of manufacturing semiconductor chip, and film for processing 有权
标题翻译：制造半导体芯片的方法和加工薄膜
公开(公告)号：JP2011109022A
公开(公告)日：2011-06-02
申请号：JP2009265318
申请日：2009-11-20
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE OSAMU , TAKEMURA KENZO , SATO SHIN , KAWABATA YASUNORI , NAGAI AKIRA
IPC分类号： H01L21/301 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor chip that can secures a sufficient yield of manufacture by suppressing warpage of a semiconductor wafer in a thinning process, and to provide a film for processing. SOLUTION: In the method of manufacturing the semiconductor chip, the film 1 for processing which has a width larger than the diameter of the semiconductor wafer 10 and whose base film 2 has a thickness of 50 to 120 μm is stuck on a circuit surface 10a of the semiconductor wafer 10. Consequently, when an excess portion 12 of the film 1 for processing which protrudes from the circuit surface 10a of the semiconductor wafer 10 is removed, operation efficiency is held excellent, and formation of burrs of a cut portion of the film 1 for processing and cutting wastes is suppressed. Further, the semiconductor wafer 10 is made thin in a state where warpage thereof is suppressed, so the semiconductor wafer 10 can be flattened without being broken and a dicing tape 16 can be stuck, thereby securing the yield of the manufacture. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造半导体芯片的方法，其可以通过抑制在薄化工艺中的半导体晶片的翘曲来确保足够的制造成品率，并提供用于加工的膜。解决方案：在制造半导体芯片的方法中，将具有比半导体晶片10的直径宽度大的底片2的厚度为50〜120μm的加工用膜1贴在电路因此，当去除从半导体晶片10的电路表面10a突出的加工用膜1的过剩部分12时，保持良好的操作效率，并且形成切割部分的毛刺的用于加工和切割废物的薄膜1被抑制。此外，半导体晶片10在其翘曲被抑制的状态下变薄，因此半导体晶片10可以被平坦化而不被破坏，并且切割带16可被卡住，从而确保制造的成品率。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2011171712A Adhesive tape for semiconductor wafer processing, method of manufacturing semiconductor wafer with adhesive tape for semiconductor wafer processing, method of manufacturing semiconductor device, and semiconductor device 审中-公开
标题翻译：用于半导体波导处理的粘合带，用于半导体波导处理的粘合带制造半导体波形的方法，制造半导体器件的方法和半导体器件
公开(公告)号：JP2011171712A
公开(公告)日：2011-09-01
申请号：JP2010278328
申请日：2010-12-14
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKEMURA KENZO , WATANABE OSAMU , SATO SHIN , KAWABATA YASUNORI , NAGAI AKIRA
IPC分类号： H01L21/304 , C09J7/02 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide an adhesive tape for semiconductor wafer processing that is efficiently stuck on a semiconductor wafer. SOLUTION: The adhesive tape for semiconductor wafer processing includes at least an adhesive layer for circuit member connection laminated on a base film, and has a width which is ≥3 mm larger, per one side, than the width of the semiconductor wafer on which the adhesive tape is stuck on each side, and is wound in a roll shape to the width. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供有效地粘贴在半导体晶片上的用于半导体晶片处理的胶带。解决方案：用于半导体晶片处理的粘合带至少包括层压在基膜上的电路部件连接用粘合剂层，并且每一边的宽度比半导体晶片的宽度大3毫米胶带粘贴在其上，并以卷形卷绕成宽度。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2008141169A Film adhesive for circuit connection 有权
标题翻译：电路连接胶片
公开(公告)号：JP2008141169A
公开(公告)日：2008-06-19
申请号：JP2007259105
申请日：2007-10-02
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： NAGAI AKIRA , WATANABE ITSUO , TAKEMURA KENZO , WATANABE OSAMU , ISAKA KAZUHIRO , KOJIMA KAZUYOSHI
IPC分类号： H01L21/52 , C09J7/02 , C09J9/02 , C09J11/04 , C09J11/06 , C09J133/00 , C09J133/14 , C09J163/00 , C09J171/10 , H01B1/22 , H05K1/14 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide a film adhesive for circuit connection, which can decrease the heating temperature and the pressing force in a temporary connection process and can improve the workability.
SOLUTION: A heat-adherent film adhesive for circuit connection is used to electrically connect circuit electrodes facing each other in the pressing direction by heating and pressing the circuit electrodes, and contains an epoxy resin, a potential curing agent, and a phenoxy resin having a molecular weight of 20,000 or more. One side of the film adhesive is supported by a separator. There is a difference in peel force before heat curing between the sides of the film adhesive. The peel force (A) for the separator (supporter) side is smaller than the peel force (B) for the other side. The blending quantity of the phenoxy resin having a molecular weight of 20,000 or more into the mixture of the epoxy resin and the potential curing agent is greater in the adhesive constituting the separator side than in the adhesive constituting the other side.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于电路连接的膜粘合剂，其可以在临时连接过程中降低加热温度和压力，并且可以提高可加工性。解决方案：用于电路连接的热粘合膜粘合剂用于通过加热和加压电路电极来使按压方向彼此面对的电路电极电连接，并且包含环氧树脂，潜在的固化剂和苯氧基分子量为20,000以上的树脂。胶粘剂的一侧由隔板支撑。在胶粘剂的侧面之间的热固化之前的剥离力存在差异。分离器（支撑件）侧的剥离力（A）小于另一侧的剥离力（B）。在环氧树脂和潜在固化剂的混合物中，分子量为20,000以上的苯氧基树脂的共混量在构成隔板侧的粘合剂中的配合比构成另一侧的粘合剂的配合量大。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2008027921A Connection member, and connection structure and connection method of electrode using same 有权
标题翻译：连接构件，以及使用其的电极的连接结构和连接方法
公开(公告)号：JP2008027921A
公开(公告)日：2008-02-07
申请号：JP2007228030
申请日：2007-09-03
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , HIROZAWA YUKIHISA , KOBAYASHI KOJI , OTA TOMOHISA , MATSUOKA HIROSHI , WATANABE ITSUO , TAKEMURA KENZO , SHIOZAWA NAOYUKI , WATANABE OSAMU , KOJIMA KAZUYOSHI
IPC分类号： H01R11/01 , H01L21/60 , H01R43/00
CPC分类号： H01L2224/2929 , H01L2224/293 , H01L2224/83851
摘要： PROBLEM TO BE SOLVED: To provide a high-resolution connection member that has improved long-term connection reliability, and has improved working efficiency by dispensing with the accurate alignment between a conductive particle and an electrode, and to provide a connection structure of the electrode using the connection member. SOLUTION: In a multilayer connection member, where an insulation adhesive layer is formed at least on one side of an adhesive layer that is made of a conductive material and a binder and is conductive in a pressurization direction, the binder and the insulation adhesive layer are mainly made of an epoxy resin modified by a high molecular weight component, and a heat-resistant difference is provided between the binder and the insulation adhesive layer for preferentially separating the connection member for semiconductor chips from one substrate surface after connection. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种提高长期连接可靠性的高分辨率连接构件，并且通过分配导电颗粒和电极之间的精确对准而提高工作效率，并提供连接结构的电极。解决方案：在多层连接构件中，绝缘粘合剂层形成在由导电材料和粘合剂制成并且在加压方向上导电的粘合剂层的至少一侧上，粘合剂和绝缘体粘合剂层主要由通过高分子量组分改性的环氧树脂制成，并且在粘合剂和绝缘粘合剂层之间提供耐热差异，用于在连接后优先从半导体芯片的连接构件与一个基板表面分离。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2008022036A Connection member, connection structure of electrode using the same, and connection method 有权
标题翻译：连接构件，使用其的电极的连接结构和连接方法
公开(公告)号：JP2008022036A
公开(公告)日：2008-01-31
申请号：JP2007260090
申请日：2007-10-03
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , HIROZAWA YUKIHISA , KOBAYASHI KOJI , OTA TOMOHISA , MATSUOKA HIROSHI , WATANABE ITSUO , TAKEMURA KENZO , SHIOZAWA NAOYUKI , WATANABE OSAMU , KOJIMA KAZUYOSHI
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To obtain a high-resolution connection member that has superior long connection reliability, dispenses with the precise alignment between a conductive particle and an electrode, and has excellent workability; and to obtain the connection structure of the electrode using the connection member. SOLUTION: In the connection structure between electrode rows having a plurality of chips, at least one of the electrode rows standing face to face is formed on a substrate. In this case, one electrode row is connected to the other via the connection member. The connection member is a multilayer connection member, where an insulating adhesive layer is formed on at least one side of an adhesive layer that is made of a conductive material and a binder and has conductivity in the direction of pressurization. Melting viscosity when a binder component is connected is not more than that as compared with the insulating adhesive layer. The insulating adhesive layer covers the periphery of at least the substrate side of a projected electrode. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题为了获得具有优异的长连接可靠性的高分辨率连接件，省去了导电颗粒和电极之间的精确对准，并且具有优异的可加工性; 并且使用连接构件获得电极的连接结构。解决方案：在具有多个芯片的电极列之间的连接结构中，在基板上形成至少一个电极列彼此面对面地形成。在这种情况下，一个电极列经由连接构件而彼此连接。连接构件是多层连接构件，其中在由导电材料和粘合剂制成的粘合剂层的至少一侧上形成绝缘粘合剂层，并且在加压方向上具有导电性。当粘合剂组分连接时的熔融粘度不大于与绝缘粘合剂层相比的熔融粘度。绝缘粘合剂层覆盖突起电极的至少基板侧的周边。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2007305994A Circuit connecting member, and circuit board 审中-公开
标题翻译：电路连接器和电路板
公开(公告)号：JP2007305994A
公开(公告)日：2007-11-22
申请号：JP2007122765
申请日：2007-05-07
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE ITSUO , TAKEMURA KENZO , NAGAI AKIRA , ISAKA KAZUHIRO , WATANABE OSAMU , KOJIMA KAZUYOSHI
IPC分类号： H05K3/32 , C09J7/00 , C09J9/02 , C09J11/04 , C09J11/08 , C09J121/00 , C09J163/00 , C09J171/10 , H01B1/24 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a circuit connecting member which is used for connection between an electronic component and a circuit board, eases stress at a circuit connection interface, and prevents an increase in connection resistance and removal of an adhesive even after a reliability test, thus greatly improves connection reliability, and to provide a circuit board having superior reliability.
SOLUTION: The circuit connecting member is used for connection between an IC chip and a printed board or between an IC chip and a flexible wiring board. In use of the circuit connecting member, opposed circuit electrodes are heated and pressured to electrically connect the electrodes in the direction of pressurization. The circuit connecting member contains (A) an epoxy resin dispersed with rubber grains having diameters of 0.02 to 1 micron, and (B) an adhesive composition containing an essential component of a latent curing agent for the epoxy resin.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于电子部件和电路板之间的连接的电路连接部件，在电路连接接口处减轻应力，并且即使在连接电阻之后即使在可靠性测试，从而大大提高了连接可靠性，并且提供了具有优异可靠性的电路板。
解决方案：电路连接部件用于IC芯片与印刷电路板之间或IC芯片与柔性电路板之间的连接。在电路连接部件的使用中，相对的电路电极被加热并加压以使电极沿加压方向电连接。电路连接部件包含（A）分散有直径为0.02〜1微米的橡胶粒子的环氧树脂，（B）含有环氧树脂的潜在性固化剂的必要成分的粘合剂组合物。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2011140617A Adhesive composition for forming underfill, adhesive sheet for forming underfill, and method for manufacturing semiconductor device 审中-公开
标题翻译：用于形成底胶的粘合组合物，用于形成底胶的粘合片和制造半导体器件的方法
公开(公告)号：JP2011140617A
公开(公告)日：2011-07-21
申请号：JP2010099183
申请日：2010-04-22
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： NAGAI AKIRA , OKUBO KEISUKE , TAKEMURA KENZO , WATANABE OSAMU
IPC分类号： C09J171/10 , C09J7/02 , C09J11/04 , C09J11/06 , C09J163/00 , C09J201/00 , H01L21/60 , H01L23/29 , H01L23/31
CPC分类号： H01L24/27 , H01L2224/16225 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/83191 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition for forming an underfill, which is sufficiently excellent in embedding performance when it is formed into a film form, and with which a semiconductor device having excellent connection reliability is manufactured. SOLUTION: The adhesive composition for forming an underfill contains at least (A) a thermoplastic resin, (B) a thermosetting resin, (C) a latent curing agent; and (D) an inorganic filler. The thermoplastic resin (A) contains a bisphenol A, F copolymerization type phenoxy resin. COPYRIGHT: (C)2011,JPO&INPIT

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