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1. 发明专利

JP2012238703A Semiconductor device manufacturing method, semiconductor wafer with adhesive layer manufacturing method, semiconductor wafer with semiconductor element manufacturing method and semiconductor wafer laminate manufacturing method 审中-公开
标题翻译：半导体器件制造方法，具有粘合层制造方法的半导体波导，具有半导体元件制造方法和半导体波导层压制造方法的半导体器件
公开(公告)号：JP2012238703A
公开(公告)日：2012-12-06
申请号：JP2011106341
申请日：2011-05-11
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： OKUBO KEISUKE , NAGAI AKIRA , HONDA KAZUTAKA , ENOMOTO TETSUYA , MITSUKURA KAZUYUKI
IPC分类号： H01L21/60 , C09J4/00 , C09J11/06 , C09J201/00 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/16
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device using a semiconductor wafer with an adhesive layer, which can reduce voids at a bump part and minimize warp after grinding.SOLUTION: A semiconductor device manufacturing method comprises the steps of: obtaining a semiconductor wafer with an adhesive layer having a structure of more than one layer by coating of more than one type of liquid photosensitive adhesive 6, 7 and light irradiation on the coated film, on a circuit surface of a semiconductor wafer 10 having the circuit surface on which metal bumps 12 are formed; obtaining a semiconductor element with a plurality of adhesive layers by cutting the semiconductor wafer with the adhesive layer together with the adhesive layer; and pressure bonding the semiconductor element with the adhesive layer and another semiconductor element or a support member for semiconductor element mounting while sandwiching the adhesive layer of the semiconductor element with the adhesive layer. The adhesive layer having the structure of more than one layer includes an inner layer 7 containing a filler on a circuit surface side and an uppermost surface layer 6 not containing the filler or containing the filler of less content than the inner layer.
摘要翻译：要解决的问题：提供一种使用具有粘合剂层的半导体晶片的半导体器件的制造方法，其可以减少凸起部分处的空隙并最小化研磨后的翘曲。解决方案：半导体器件制造方法包括以下步骤：通过涂覆多于一种类型的液体感光性粘合剂6,7得到具有多于一层结构的粘合剂层的半导体晶片，以及在在具有形成金属凸块12的电路表面的半导体晶片10的电路表面上; 通过用粘合剂层与粘合剂层一起切割半导体晶片来获得具有多个粘合剂层的半导体元件; 并且将半导体元件与粘合剂层和另一半导体元件或用于半导体元件安装的支撑构件压接，同时用粘合剂层夹持半导体元件的粘合剂层。具有多层结构的粘合剂层包括在电路表面侧包含填料的内层7和不含填料或含有比内层含量少的填料的最上层6。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2012238702A Semiconductor device manufacturing method and semiconductor wafer laminate manufacturing method 有权
标题翻译：半导体器件制造方法和半导体陶瓷层压制造方法
公开(公告)号：JP2012238702A
公开(公告)日：2012-12-06
申请号：JP2011106331
申请日：2011-05-11
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： OKUBO KEISUKE , NAGAI AKIRA , ENOMOTO TETSUYA , MASUKO TAKASHI , MITSUKURA KAZUYUKI
IPC分类号： H01L25/065 , H01L21/60 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/73204 , H01L2924/10253 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method and a semiconductor wafer laminate manufacturing method, which can sufficiently reduce voids at a bump part, sufficiently minimize warp after grinding and achieve thinning of a semiconductor device having a structure of laminated plurality of semiconductor elements when the semiconductor device is manufactured from a semiconductor wafer with an adhesive layer.SOLUTION: A semiconductor device manufacturing method of the present invention comprises the steps of: forming a photosensitive adhesive layer by coating a liquid photosensitive adhesive on a circuit surface of a first semiconductor wafer having the circuit surface on which metal bumps are formed; obtaining a semiconductor wafer with an adhesive layer by bringing the photosensitive adhesive layer to a B-stage by light irradiation; obtaining a semiconductor wafer laminate by pressure bonding the semiconductor wafer with the adhesive layer with a second semiconductor wafer while sandwiching the adhesive layer of the semiconductor wafer with the adhesive layer; and cutting the semiconductor wafer laminate into a semiconductor element laminates in each of which semiconductor elements are laminated.
摘要翻译：解决问题的方案为了提供能够充分减小凸部的空隙的半导体装置的制造方法和半导体晶片层叠体的制造方法，能够充分地使研磨后的翘曲最小化，并且能够实现具有层叠结构的半导体装置的薄型化半导体器件由具有粘合剂层的半导体晶片制造时的多个半导体元件。解决方案：本发明的半导体器件制造方法包括以下步骤：通过在具有形成有金属凸块的电路表面的第一半导体晶片的电路表面上涂覆液体感光性粘合剂来形成感光性粘合剂层; 通过光照射使感光性粘合剂层达到B级，从而获得具有粘合剂层的半导体晶片; 通过利用第二半导体晶片将半导体晶片与粘合剂层压接，同时用粘合剂层夹住半导体晶片的粘合剂层来获得半导体晶片层压体; 并将半导体晶片层叠体切割成半导体元件叠层的半导体元件层叠体。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2012174722A Semiconductor device manufacturing method 有权
标题翻译：半导体器件制造方法
公开(公告)号：JP2012174722A
公开(公告)日：2012-09-10
申请号：JP2011032150
申请日：2011-02-17
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： NAGAI AKIRA , OKUBO KEISUKE , ENOMOTO TETSUYA
IPC分类号： H01L21/60
CPC分类号： H01L24/81 , H01L2224/16225 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/83191 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can prevent a heating and pressurizing tool from being tainted and improve yield without causing occurrence of failure in a tool protection material preventing connection materials from being adhered to the heating and pressurizing tool when manufacturing the semiconductor device by connecting electronic components.SOLUTION: When a semiconductor device is manufactured by heating and pressurizing a first electronic component 1 by a heating and pressurizing tool 3 with connection materials 4 sandwiched between the first electronic component 1 and a second electronic component 2 which face each other to connect the first electronic component 1 and the second electronic component 2, heating and pressurizing are performed by intervening a tool protection material 5 having a dimension equivalent to that of a heating and pressurizing surface 31 of the heating and pressurizing tool 3 and composed of any one of a metal foil, a silicon chip and a ceramic sheet, between the heating and pressurizing surface 31 of the heating and pressurizing tool 3 and a rear face 13 that is a heated and pressurized surface of the first electronic component 1.
摘要翻译：要解决的问题：提供一种能够防止加热加压工具被污染并提高成品率的半导体器件制造方法，而不会导致工具保护材料发生故障，从而防止连接材料粘附到加热和加压通过连接电子元件制造半导体器件时的工具。解决方案：当半导体器件通过加热和加压工具3加热和加压第一电子部件1而制造时，连接材料4夹在第一电子部件1和彼此面对的第二电子部件2之间以连接第一电子部件1和第二电子部件2的加热和加压通过插入具有与加热加压工具3的加热和加压表面31相同的尺寸的工具保护材料5来执行，并由金属箔，硅芯片和陶瓷片，位于加热加压工具3的加热和加压表面31之间，以及作为第一电子部件1的加热和加压表面的后表面13。（C）2012，JPO＆INPIT

4. 发明专利

JP2012069913A Adhesive film for solar cell electrode and manufacturing method of solar cell module using the same 有权
标题翻译：用于太阳能电池电极的粘合膜和使用其的太阳能电池模块的制造方法
公开(公告)号：JP2012069913A
公开(公告)日：2012-04-05
申请号：JP2011151932
申请日：2011-07-08
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： SHIMIZU NARIYOSHI , TANAKA TADAYOSHI , IZAWA HIROYUKI , OKUBO KEISUKE , FUNYU SHIGEAKI , OKADA YUTAKA , FUNYU KEIKO
IPC分类号： H01L31/042 , C09J7/02 , C09J11/06 , C09J133/06 , C09J163/00 , C09J163/02 , C09J171/10
CPC分类号： C08L7/00 , C08L33/00 , C08L71/12 , C09J163/00 , H01L31/022425 , H01L31/0504 , Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide an adhesive film for a solar cell electrode and a manufacturing method of a solar cell module using the same which can decrease an adverse effect on the solar cell due to heat and pressure to obtain a solar cell with adequate solar cell characteristics.SOLUTION: The adhesive film for a solar cell electrode, which is an adhesive film used to electrically connect a surface electrode of a solar cell and wiring members, is made of a crystalline epoxy resin, a curative agent and a film formation material.
摘要翻译：解决的问题：提供一种用于太阳能电池电极的粘合膜和使用该粘合膜的太阳能电池组件的制造方法，其可以降低由于热和压力而对太阳能电池的不利影响以获得太阳能电池具有足够的太阳能电池特性。＆lt; P＆gt;解决方案：作为用于将太阳能电池的表面电极和配线构件电连接的粘合膜的太阳能电池用电极用粘接膜由结晶性环氧树脂，固化剂和成膜材料构成。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2011231137A Epoxy resin composition for seal-filling semiconductor and semiconductor device 审中-公开
标题翻译：密封填充半导体和半导体器件的环氧树脂组合物
公开(公告)号：JP2011231137A
公开(公告)日：2011-11-17
申请号：JP2010099704
申请日：2010-04-23
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： ENOMOTO TETSUYA , NAGAI AKIRA , OKUBO KEISUKE , MIYAZAWA EMI , HONDA KAZUTAKA
IPC分类号： C08G59/62 , C08K5/053 , C08K5/092 , C08K5/13 , C08L63/00 , H01L21/60
CPC分类号： H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin composition for seal-filling a semiconductor, which achieves excellent connection reliability and sufficiently suppresses occurrence of voids in a resin during connection when used as a resin composition for seal-filling a semiconductor for a previous feed method and a semiconductor apparatus using the same.SOLUTION: The epoxy resin composition for seal-filling a semiconductor is used for electrically connecting a semiconductor chip provided with a plurality of bumps to a substrate having a plurality of electrodes (tin or solder exists on at least either of the surfaces of the bumps and the surfaces of the electrodes). The epoxy resin composition comprises an epoxy resin, a curing agent and a flux agent as essential components. The connection is carried out by a prescribed method in the epoxy resin composition for seal-filling a semiconductor.
摘要翻译：要解决的问题：提供一种用于密封填充半导体的环氧树脂组合物，当用作用于密封填充半导体的树脂组合物时，其实现了良好的连接可靠性并充分抑制了在连接期间树脂中空隙的发生以前的馈送方法和使用该馈送方法的半导体装置。解决方案：用于密封填充半导体的环氧树脂组合物用于将具有多个凸起的半导体芯片电连接到具有多个电极的基板（锡或焊料存在于至少两个表面的任一表面上凸起和电极的表面）。环氧树脂组合物包含环氧树脂，固化剂和助熔剂作为必需组分。在用于密封填充半导体的环氧树脂组合物中通过规定的方法进行连接。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2011140617A Adhesive composition for forming underfill, adhesive sheet for forming underfill, and method for manufacturing semiconductor device 审中-公开
标题翻译：用于形成底胶的粘合组合物，用于形成底胶的粘合片和制造半导体器件的方法
公开(公告)号：JP2011140617A
公开(公告)日：2011-07-21
申请号：JP2010099183
申请日：2010-04-22
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： NAGAI AKIRA , OKUBO KEISUKE , TAKEMURA KENZO , WATANABE OSAMU
IPC分类号： C09J171/10 , C09J7/02 , C09J11/04 , C09J11/06 , C09J163/00 , C09J201/00 , H01L21/60 , H01L23/29 , H01L23/31
CPC分类号： H01L24/27 , H01L2224/16225 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/83191 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition for forming an underfill, which is sufficiently excellent in embedding performance when it is formed into a film form, and with which a semiconductor device having excellent connection reliability is manufactured. SOLUTION: The adhesive composition for forming an underfill contains at least (A) a thermoplastic resin, (B) a thermosetting resin, (C) a latent curing agent; and (D) an inorganic filler. The thermoplastic resin (A) contains a bisphenol A, F copolymerization type phenoxy resin. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种形成底部填充剂的粘合剂组合物，其在形成为膜状时具有足够好的嵌入性能，并且制造具有优异的连接可靠性的半导体器件。解决方案：用于形成底部填充剂的粘合剂组合物至少含有（A）热塑性树脂，（B）热固性树脂，（C）潜在性固化剂; 和（D）无机填料。热塑性树脂（A）含有双酚A，F共聚型苯氧树脂。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2011178840A Adhesive composition, adhesive sheet for connection of circuit member and method for manufacturing semiconductor device 有权
标题翻译：粘合组合物，用于连接电路部件的粘合片和制造半导体器件的方法
公开(公告)号：JP2011178840A
公开(公告)日：2011-09-15
申请号：JP2010042372
申请日：2010-02-26
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： OKUBO KEISUKE , NAGAI AKIRA
IPC分类号： C09J163/00 , C09J7/02 , C09J11/06 , H01L21/60
CPC分类号： H01L24/27 , H01L2224/73104 , H01L2224/83191
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition that can fabricate a semiconductor device excellent in reflow resistance and connection reliability and to provide an adhesive sheet for the connection of a circuit member by using the adhesive composition. SOLUTION: The adhesive composition includes (a) a first epoxy resin having an aromatic ring and an epoxy equivalent of 100 to 250 g/eq, (b) a second epoxy resin having an aromatic ring and an epoxy equivalent of 300-1,300 g/eq and (c) a microcapsule type curing accelerator. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供一种能够制造耐回流性和连接可靠性优异的半导体器件的粘合剂组合物，并且通过使用粘合剂组合物提供用于连接电路部件的粘合片。粘合剂组合物包括（a）具有芳环和环氧当量为100〜250g / eq的第一环氧树脂，（b）具有芳环和环氧当量为300〜 1,300g / eq，（c）微胶囊型固化促进剂。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2011174010A Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet for circuit member connection, and method for manufacturing semiconductor device 有权
标题翻译：压敏粘合剂组合物，用于电路构件连接的压敏粘合片和制造半导体器件的方法
公开(公告)号：JP2011174010A
公开(公告)日：2011-09-08
申请号：JP2010040349
申请日：2010-02-25
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： OKUBO KEISUKE , NAGAI AKIRA
IPC分类号： C09J163/00 , C09J4/00 , C09J7/02 , C09J11/00 , C09J201/00 , H01L21/301 , H01L21/304 , H01L21/60
CPC分类号： H01L24/27 , H01L24/83 , H01L2224/16225 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81193 , H01L2224/83191 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive composition by which a semiconductor device having excellent reflow-resistant properties and connection reliability can be prepared, to provide a pressure-sensitive adhesive sheet for circuit member connection and to provide a method for manufacturing a semiconductor device. SOLUTION: The pressure-sensitive adhesive composition includes (A) a polymer component having a weight-average molecular weight of 100,000 or more, (B) an epoxy resin, (C) an epoxy resin curing agent, (D) a compound having a glycidyl group and an ethylenically unsaturated group and (E) a photoinitiator. The pressure-sensitive adhesive sheet 10 for circuit member connection includes a light transmissible supporting base material 3 and a pressure-sensitive adhesive layer 2 provided on the supporting base material and made of the pressure-sensitive adhesive composition. In the method for manufacturing the semiconductor device, the pressure-sensitive adhesive sheet is used. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以制备具有优异的回流性能和连接可靠性的半导体器件的压敏粘合剂组合物，以提供用于电路部件连接的压敏粘合片，并提供一种半导体器件的制造方法。解决方案：压敏粘合剂组合物包含（A）重均分子量为100,000以上的聚合物组分，（B）环氧树脂，（C）环氧树脂固化剂，（D）具有缩水甘油基和烯属不饱和基团的化合物和（E）光引发剂。用于电路构件连接的压敏粘合片10包括透光性支撑基材3和设置在支撑基材上并由压敏粘合剂组合物制成的压敏粘合剂层2。在制造半导体器件的方法中，使用压敏粘合片。版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2011157552A Adhesive composition, adhesive sheet for connecting circuit member, and method for producing semiconductor device 审中-公开
标题翻译：粘合组合物，用于连接电路部件的粘合片和用于制造半导体器件的方法
公开(公告)号：JP2011157552A
公开(公告)日：2011-08-18
申请号：JP2011046809
申请日：2011-03-03
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： OKUBO KEISUKE , NAGAI AKIRA
IPC分类号： C09J163/00 , C09J4/00 , C09J7/02 , C09J11/06 , C09J201/00 , H01L21/301 , H01L21/60
CPC分类号： H01L24/29 , C08G59/68 , C08L2666/02 , C09J7/35 , C09J163/00 , C09J2203/326 , C09J2463/00 , H01L21/6836 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L2221/6834 , H01L2221/68386 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81193 , H01L2224/81203 , H01L2224/81801 , H01L2224/83191 , H01L2924/00011 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01051 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： PROBLEM TO BE SOLVED: To provide an adhesive sheet for connecting a circuit member which satisfies adhesiveness to a semiconductor wafer, grindability of the rear surface of the wafer and embedding property at flip chip bonding all in a high level. SOLUTION: The adhesive composition includes: (A) a thermoplastic resin having a weight-average molecular weight of 20,000 or more and 100,000 or less; (B) an epoxy resin; (C) a radiation polymerizable compound; (D) a photoinitiator; and (E) a microcapsule-type hardening accelerator. COPYRIGHT: (C)2011,JPO&INPIT

10. 发明专利

JP2004083836A Adhesive sheet, semiconductor device and method for producing the same 有权
公开(公告)号：JP2004083836A
公开(公告)日：2004-03-18
申请号：JP2002332929
申请日：2002-11-15
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MASUKO TAKASHI , KAWAKAMI HIROYUKI , INADA TEIICHI , OKUBO KEISUKE
IPC分类号： C09J7/02 , C09J163/00 , C09J179/08 , C09J183/10 , C09J201/00 , H01L21/301 , H01L21/52
CPC分类号： H01L24/27 , H01L2224/83191 , H01L2924/351 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive tape simplifying a pasting process until a dicing process, not only improving working property but also solving a problem such as the bending of wafer which becomes to have a larger diameter and thinner film thickness, further having heat resistance and moisture resistance required in the case of installing a semiconductor element having a large difference in thermal expansion coefficient on a supporting member for loading the semiconductor element, and also excellent in working property. SOLUTION: This adhesive sheet is characterized by forming (A) a substrate layer, (B) a radiation-curable sticky agent layer and (C) an adhesive layer containing a polyimide resin and a thermosetting resin in this order. COPYRIGHT: (C)2004,JPO

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