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1. 发明专利

JP2010135839A Soldering equipment 审中-公开
标题翻译：焊接设备
公开(公告)号：JP2010135839A
公开(公告)日：2010-06-17
申请号：JP2010036991
申请日：2010-02-23
申请人： Hitachi Automotive Systems Ltd , Hitachi Car Eng Co Ltd , Tamura Fa System Co Ltd , Tamura Seisakusho Co Ltd , 日立オートモティブシステムズ株式会社 , 株式会社タムラエフエーシステム , 株式会社タムラ製作所 , 株式会社日立カーエンジニアリング
发明人： MUKUNO HIDEKI , TASHIRO KAZUMI , ARITA HIDEAKI , KANAI KIYOSHI , OKANO TERUO , YAMASHITA FUMIHIRO , MATSUHISA SHOICHIRO , IMAI HIDEKAZU
IPC分类号： H05K3/34 , B23K1/008 , B23K3/04 , B23K101/42
摘要： PROBLEM TO BE SOLVED: To provide soldering equipment, capable of uniformly heating a printed circuit board and the mounted electronic components, and of soldering, without thermally damaging the electronic components in soldering equipment using lead-free solder.
SOLUTION: The pressure of a fluid is allowed to be uniform and a porous body 130, having a plurality of pores, is disposed between a blower fan 122 and a heater 140. In addition, a radiation plate 150, that sprays the fluid heated by the heater 140 onto a heated object 10 as turbulent flow, is disposed between the heater 140 and the heated object 10, and the heated object is heated by spraying the heated fluid onto the heated object and melts the solder.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供能够均匀加热印刷电路板和安装的电子部件以及焊接的焊接设备，而不会在使用无铅焊料的焊接设备中对电子部件造成热损伤。解决方案：允许流体的压力是均匀的，并且具有多个孔的多孔体130设置在鼓风机风扇122和加热器140之间。此外，喷射板150喷射由加热器140加热到被加热物体10上的流体作为湍流被布置在加热器140和被加热物体10之间，并且通过将加热的流体喷射到被加热物体上并使焊料熔化来加热被加热物体。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2006148152A Soldering equipment 审中-公开
标题翻译：焊接设备
公开(公告)号：JP2006148152A
公开(公告)日：2006-06-08
申请号：JP2005375248
申请日：2005-12-27
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , Tamura Fa System Co Ltd , Tamura Seisakusho Co Ltd , 株式会社タムラエフエーシステム , 株式会社タムラ製作所 , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： MUKUNO HIDEKI , TASHIRO KAZUMI , ARITA HIDEAKI , KANAI KIYOSHI , OKANO TERUO , YAMASHITA FUMIHIRO , MATSUHISA SHOICHIRO , IMAI HIDEKAZU
IPC分类号： H05K3/34 , B23K1/008 , B23K3/04 , B23K101/42
摘要： PROBLEM TO BE SOLVED: To provide soldering equipment, capable of uniformly heating a printed circuit board and the mounted electronic components, and of soldering, without thermally damaging the electronic components in soldering equipment using lead-free solder.
SOLUTION: The pressure of a fluid is allowed to be uniform and a porous body 130, having a plurality of pores, is disposed between a blower fan 122 and a heater 140. In addition, a radiation plate 150, that sprays the fluid heated by the heater 140 onto a heated object 10 as turbulent flow, is disposed between the heater 140 and the heated object 10, and the heated object is heated by spraying the heated fluid onto the heated object and melts the solder.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供能够均匀加热印刷电路板和安装的电子部件以及焊接的焊接设备，而不会在使用无铅焊料的焊接设备中对电子部件造成热损伤。解决方案：允许流体的压力是均匀的，并且具有多个孔的多孔体130设置在鼓风机风扇122和加热器140之间。此外，喷射板150喷射由加热器140加热到被加热物体10上的流体作为湍流被布置在加热器140和被加热物体10之间，并且通过将加热的流体喷射到被加热物体上并使焊料熔化来加热被加热物体。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2004106029A Soldering device 有权
公开(公告)号：JP2004106029A
公开(公告)日：2004-04-08
申请号：JP2002273723
申请日：2002-09-19
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , Tamura Fa System Co Ltd , Tamura Seisakusho Co Ltd , 株式会社タムラエフエーシステム , 株式会社タムラ製作所 , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： OKANO TERUO , UCHIDA TOSHIYA , HATTORI KAORU , MUKUNO HIDEKI , ARITA HIDEAKI
IPC分类号： B23K3/00 , B23K1/08 , B23K31/02 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a soldering device for preventing the environment on the lower side of a work from influencing the upper side of the work.
SOLUTION: A plurality of circular holes 33 to fit a work W therein are opened at a predetermined angular interval in a disk-like index table 22 rotated while being stopped at the predetermined angle. A supporting tool 31 and a masking tool 32 to hold the work W while covering a space between the index table 22 and the work W are respectively provided in the circular holes 33. A closed work lower side space part 61 is formed below the index table 22, the supporting tool 31, the masking tool 32, and the work W, and at least a pre-heating unit 27 and a nozzle of a jet soldering tank are disposed therein. A closed work upper side space part 62 is demarcated on the upper side of the work lower side space part 61 via the index table 22, the supporting tool 31, the masking tool 32, and the work W.
COPYRIGHT: (C)2004,JPO

4. 发明专利

JP2004106028A Soldering device 审中-公开
公开(公告)号：JP2004106028A
公开(公告)日：2004-04-08
申请号：JP2002273722
申请日：2002-09-19
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , Tamura Fa System Co Ltd , Tamura Seisakusho Co Ltd , 株式会社タムラエフエーシステム , 株式会社タムラ製作所 , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： OKANO TERUO , UCHIDA TOSHIYA , HATTORI KAORU , MUKUNO HIDEKI , ARITA HIDEAKI
IPC分类号： B23K3/00 , B23K1/08 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a soldering device for enhancing the soldering efficiency.
SOLUTION: A pre-heating unit 27 to preheat a work W to be carried by an index table 22 and a wave soldering tank 28 to feed molten solder to the work W are installed on a lower side of the index table 22 to be turned while the work W is stopped at a predetermined angle. The wave solder tank 28 is located on the downstream side of the pre-heating unit 27 and between a stop position P
1 and a stop position P
2 of the index table 22. A pulse-controllable motor 25 to drive the index table 22 at a variable speed is controlled by a controller 26 at a variable speed. The controller 26 has a speed control pattern having a high-speed carrying area to drive the index table 22 in a non-soldering mode at a relatively high speed, and a soldering speed area to drive the index table 22 in a soldering mode at a soldering speed set according to the work W.
COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2007073786A Soldering method 审中-公开
标题翻译：焊接方法
公开(公告)号：JP2007073786A
公开(公告)日：2007-03-22
申请号：JP2005260076
申请日：2005-09-08
申请人： Hitachi Ltd , Tamura Fa System Co Ltd , Tamura Seisakusho Co Ltd , 株式会社タムラエフエーシステム , 株式会社タムラ製作所 , 株式会社日立製作所
发明人： YAMAGUCHI TAKAHITO , HASEGAWA SHIKIO , KATO TORU , MUKUNO HIDEKI , ASANO MASAHIKO
IPC分类号： H05K3/34
CPC分类号： H05K3/3447 , B23K3/0653 , B23K2201/40 , H05K3/3468 , H05K2203/0746
摘要： PROBLEM TO BE SOLVED: To provide a soldering method which solves the soldering failure due to excessive fused solder upon soldering while applying internal pressure inside through-holes in a lead component mounting substrate. SOLUTION: (a) In the primary soldering process, the lead component mounting substrate 2 is lowered, and the rear face thereof is brought near or in close contact to the upper open end edge of a nozzle 52. At the same time, by raising the surface of fused solder Sa supplied to the nozzle 52, the supplying pressure of the fused solder from the nozzle 52 is applied inside the through-hole 4 in the lead component mounting substrate 2. (b) In the secondary soldering process, by lowering the surface of the fused solder Sb, the rear face of the lead component mounting substrate 2 is relatively moved apart from this surface, and only the leads 5 are immersed in the surface of the fused solder Sb in the nozzle 52 for a fixed time or longer time. (c) In the lead withdrawing process, by tilting and raising the lead component mounting substrate 2, it is withdrawn from the surface of the fused solder in the nozzle 52. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种焊接方法，其在焊接时解决由于过度的熔融焊料引起的焊接故障，同时在引线部件安装基板中的通孔内部施加内部压力。解决方案：（a）在主焊接过程中，引线部件安装基板2下降，并且其后表面靠近或紧密接触喷嘴52的上开口端边缘。同时通过提高供给喷嘴52的熔融焊料Sa的表面，将来自喷嘴52的熔融焊料的供给压力施加到引线部件安装基板2的通孔4的内部。（b）在二次焊接工序通过降低熔融焊料Sb的表面，引线部件安装基板2的后表面相对于该表面相对移动，并且仅将引线5浸入熔融焊料Sb的表面中，以在熔融焊料Sb的喷嘴52中浸渍固定时间或更长的时间。（c）在引线取出过程中，通过倾斜和升高引线部件安装基板2，其从喷嘴52中熔融焊料的表面退出。（C）2007，JPO＆INPIT

6. 发明专利

DE60011555T2 未知
公开(公告)号：DE60011555T2
公开(公告)日：2005-08-18
申请号：DE60011555
申请日：2000-12-08
申请人： HITACHI LTD , TAMURA FA SYSTEM CO , HITACHI CAR ENG CO LTD , TAMURA SEISAKUSHO KK
发明人： MUKUNO HIDEKI , TASHIRO KAZUMI , ARITA HIDEAKI , KANAI KIYOSHI , OKANO TERUO , YAMASHITA FUMIHIRO , MATSUHISA SHOICHIROU , IMAI HIDEKAZU
IPC分类号： B23K1/008 , B23K1/00 , B23K1/012 , B23K31/02 , H05K3/34

7. 发明专利

DE60011555D1 未知
公开(公告)号：DE60011555D1
公开(公告)日：2004-07-22
申请号：DE60011555
申请日：2000-12-08
申请人： HITACHI LTD , TAMURA FA SYSTEM CO , HITACHI CAR ENG CO LTD , TAMURA SEISAKUSHO KK
发明人： MUKUNO HIDEKI , TASHIRO KAZUMI , ARITA HIDEAKI , KANAI KIYOSHI , OKANO TERUO , YAMASHITA FUMIHIRO , MATSUHISA SHOICHIROU , IMAI HIDEKAZU
IPC分类号： B23K1/008 , B23K1/00 , B23K1/012 , B23K31/02 , H05K3/34

8. 发明专利

JP2002151539A METHOD AND SYSTEM FOR FORMING BUMP 失效
公开(公告)号：JP2002151539A
公开(公告)日：2002-05-24
申请号：JP2000342819
申请日：2000-11-10
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD , MINAMI ENGINEERING CO LTD
发明人： MUKUNO HIDEKI , MATSUI ATSUSHI , UCHIYAMA KAORU , ITSUJI TAKAYUKI , KONDO KUNIO
IPC分类号： B23K1/00 , B23K3/06 , H01L21/48 , H01L21/60 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To realize an inexpensive system for forming bumps at the electrode parts on a wafer or a circuit board using spherical conductive particles having a specified dimensional accuracy. SOLUTION: A mask 11 is provided with a plurality of holes made at positions corresponding to a plurality of electrodes 10a for mounting conductive particles 13 formed on one side of an object 10, and the electrodes 10a of the object 10 face the plurality of holes, respectively. A table 12 is provided with a plurality of holes 12a for sucking the object 10 from the other side and sucking the particles 13 through the holes of the mask 11 such that the particles 13 are mounted on the electrodes 10a of the object 10. A hopper 14 containing a plurality of particles 13 is provided with a split part 17 for dropping the particles gravitationally while suppressing mutual suction. The split 17 of the hopper 14 is moved while facing the upper surface of the mask 11 through an interval larger than the diameter of the particle 13. The hopper 14 is disposed on the preceding side while a collection unit 15 is disposed on the following side, and particles 13 not dropping into the holes of the mask 11 are collected in the collection unit 15.

9. 发明专利

JP2003258016A BUMP MANUFACTURING DEVICE 审中-公开
公开(公告)号：JP2003258016A
公开(公告)日：2003-09-12
申请号：JP2002059655
申请日：2002-03-06
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD
发明人： NAKATSUKA TETSUYA , MATSUI ATSUSHI , MUKUNO HIDEKI , UCHIYAMA KAORU , ITSUJI TAKAYUKI
IPC分类号： H05K3/34 , B23K3/06 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To obtain an inexpensive bump manufacturing method which enables a bump to be manufactured in an electrode part on a wafer or a circuit board by using ball-like conductive particles of prescribed dimensional accuracy and its device. SOLUTION: The bump manufacturing device has an air blow unit in the periphery of a supply device in a device composed of a process for aligning a mask with a through hole and a wafer in a bump manufacturing position, a ball mounting process having the supply device which moves while dropping conductive particles to the through hole on the mask and a ball connection process for collecting conductive particles which are dropped outside the mask through hole. COPYRIGHT: (C)2003,JPO

10. 发明专利

JP2001170767A SOLDERING APPARATUS 失效
公开(公告)号：JP2001170767A
公开(公告)日：2001-06-26
申请号：JP35146899
申请日：1999-12-10
申请人： HITACHI LTD , TAMURA SEISAKUSHO KK , TAMURA FA SYSTEM KK , HITACHI CAR ENG CO LTD
发明人： MUKUNO HIDEKI , TASHIRO KAZUMI , ARITA HIDEAKI , KANAI KIYOSHI , OKANO TERUO , YAMASHITA FUMIHIRO , MATSUHISA SHOICHIRO , IMAI HIDEKAZU
IPC分类号： B23K1/008 , B23K1/00 , B23K1/012 , B23K31/02 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a soldering apparatus capable of uniformly heating a printed circuit board and electronic parts mounted thereon and not damaging electronic parts in temperature-wise as a soldering apparatus using lead free solder. SOLUTION: A porous body 130 having a plurality of holes for uniformizing fluid pressure is arranged between a blower fan 122 and a heater 140. Further, a radiation plate 150 to blow a fluid heated by the heater 140 toward a object 10 to be heated in a turbulent flow is arranged between the heater 140 and the object 10 to be heated. Thus, the object to be heated is heated by blowing a heating fluid to the object to be heated, solder is fused.

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