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1. 发明专利

JP2007073786A Soldering method 审中-公开
标题翻译：焊接方法
公开(公告)号：JP2007073786A
公开(公告)日：2007-03-22
申请号：JP2005260076
申请日：2005-09-08
申请人： Hitachi Ltd , Tamura Fa System Co Ltd , Tamura Seisakusho Co Ltd , 株式会社タムラエフエーシステム , 株式会社タムラ製作所 , 株式会社日立製作所
发明人： YAMAGUCHI TAKAHITO , HASEGAWA SHIKIO , KATO TORU , MUKUNO HIDEKI , ASANO MASAHIKO
IPC分类号： H05K3/34
CPC分类号： H05K3/3447 , B23K3/0653 , B23K2201/40 , H05K3/3468 , H05K2203/0746
摘要： PROBLEM TO BE SOLVED: To provide a soldering method which solves the soldering failure due to excessive fused solder upon soldering while applying internal pressure inside through-holes in a lead component mounting substrate. SOLUTION: (a) In the primary soldering process, the lead component mounting substrate 2 is lowered, and the rear face thereof is brought near or in close contact to the upper open end edge of a nozzle 52. At the same time, by raising the surface of fused solder Sa supplied to the nozzle 52, the supplying pressure of the fused solder from the nozzle 52 is applied inside the through-hole 4 in the lead component mounting substrate 2. (b) In the secondary soldering process, by lowering the surface of the fused solder Sb, the rear face of the lead component mounting substrate 2 is relatively moved apart from this surface, and only the leads 5 are immersed in the surface of the fused solder Sb in the nozzle 52 for a fixed time or longer time. (c) In the lead withdrawing process, by tilting and raising the lead component mounting substrate 2, it is withdrawn from the surface of the fused solder in the nozzle 52. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种焊接方法，其在焊接时解决由于过度的熔融焊料引起的焊接故障，同时在引线部件安装基板中的通孔内部施加内部压力。解决方案：（a）在主焊接过程中，引线部件安装基板2下降，并且其后表面靠近或紧密接触喷嘴52的上开口端边缘。同时通过提高供给喷嘴52的熔融焊料Sa的表面，将来自喷嘴52的熔融焊料的供给压力施加到引线部件安装基板2的通孔4的内部。（b）在二次焊接工序通过降低熔融焊料Sb的表面，引线部件安装基板2的后表面相对于该表面相对移动，并且仅将引线5浸入熔融焊料Sb的表面中，以在熔融焊料Sb的喷嘴52中浸渍固定时间或更长的时间。（c）在引线取出过程中，通过倾斜和升高引线部件安装基板2，其从喷嘴52中熔融焊料的表面退出。（C）2007，JPO＆INPIT

2. 发明专利

JP2009088048A Electronic control device using lc module structure 有权
标题翻译：使用LC模块结构的电子控制装置
公开(公告)号：JP2009088048A
公开(公告)日：2009-04-23
申请号：JP2007252983
申请日：2007-09-28
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： TSUYUNO ENJIYOU , YOSHINARI HIDETO , HOZOJI HIROYUKI , ASANO MASAHIKO , HARADA MASAHIDE , KAWAKITA SHINYA
IPC分类号： H05K7/20
CPC分类号： H05K7/20454 , H05K1/0203 , H05K1/141 , H05K7/20854 , H05K2201/10015 , H05K2201/1003 , H05K2201/10189 , H05K2201/10303 , H05K2201/1056 , Y10T29/49147
摘要： PROBLEM TO BE SOLVED: To provide a small and low-cost electronic control device in which lead insertion type components, such as, a capacitor and a coil used for a step-up circuit are build, and to provide its manufacturing method. SOLUTION: In an electronic control device having two or more kinds of lead insertion type components, each comprising at least a capacitor and a coil, the component is attached to a support having wirings, a terminal structure, and a mechanical fixation portion. The lead for the component is electrically connected, in a state in which the lead is inserted into a hole provided in the wiring portion of the support. The component and the support are fixed by use of a fixing adhesive. The upper surface of the component comes into contact with a metal housing via a heat conductive material, having a low elastic modulus. The mechanical fixing portion of the support is fixed onto the metal housing; and the terminal structure of the support is electrically connected to a wiring substrate on which at least a control element is mounted. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种低成本的电子控制装置，其中构建用于升压电路的诸如电容器和线圈的引线插入型部件，并且提供其制造方法。解决方案：在具有两种或更多种引线插入型部件的电子控制装置中，每个包括至少一个电容器和一个线圈，该部件被附接到具有布线的支撑件，端子结构和机械固定部分。在引线被插入设置在支撑件的布线部分中的孔中的状态下，元件的引线电连接。组件和支撑件通过使用固定粘合剂固定。组件的上表面通过具有低弹性模量的导热材料与金属壳体接触。支撑件的机械固定部分固定在金属外壳上; 并且支撑体的端子结构电连接到其上安装有至少一个控制元件的布线基板。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2008291730A Engine control device 有权
标题翻译：发动机控制装置
公开(公告)号：JP2008291730A
公开(公告)日：2008-12-04
申请号：JP2007137784
申请日：2007-05-24
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： YOSHINARI HIDETO , KANEKO YUJIRO , ASANO MASAHIKO , TSUYUNO ENJIYOU , YOKOZUKA TAKEHIDE
IPC分类号： F02D41/00
CPC分类号： F02D41/20 , F02D41/3005 , F02D2041/2006 , F02D2400/18 , H01L25/162 , H01L25/165 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To improve heat radiation property and reliability while reducing the size of the mounting structure of an engine control device for an automobile. SOLUTION: The engine control device is equipped with: a booster circuit for boosting power source voltage; an injector drive circuit using the boosted high voltage; and a microcomputer for controlling the engine. In the engine control device, an LC module mounting a step-up coil composing the booster circuit, and an accumulating electrolytic capacitor, a power module mounting a rectification element composing the booster circuit and the injector drive circuit and a switching element, the microcomputer, and a control substrate mounting a connector which is an interface with the exterior of the engine control device are laminated and disposed. The power module is divided into at least two and fixed by a structure in contact with a housing cover via a heat dissipation member. On the outer face of the housing cover where the power module is disposed, a fin for heat dissipation is disposed. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提高散热性和可靠性，同时减小用于汽车的发动机控制装置的安装结构的尺寸。
解决方案：发动机控制装置配有：用于升压电源电压的升压电路; 使用升压高压的注射器驱动电路; 以及用于控制发动机的微型计算机。在发动机控制装置中，安装构成升压电路的升压线圈的LC模块和累积电解电容器，安装构成升压电路的整流元件的电源模块和喷射器驱动电路以及开关元件，微型计算机，并且安装作为与发动机控制装置的外部的界面的连接器的控制基板被层压和布置。功率模块被分成至少两个，并且通过经由散热构件与壳体盖接触的结构固定。在设置电源模块的外壳盖的外表面上设置用于散热的散热片。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2010010220A Control device 有权
标题翻译：控制装置
公开(公告)号：JP2010010220A
公开(公告)日：2010-01-14
申请号：JP2008164872
申请日：2008-06-24
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KANEKO YUJIRO , ASANO MASAHIKO , YOSHINARI HIDETO
IPC分类号： H05K7/20
摘要： PROBLEM TO BE SOLVED: To provide a compact control device that implements improved heat dissipation.
SOLUTION: The control device has a control board 1 mounted with a microcomputer 17, a sub-module 2 mounted with a coil 8 and a capacitor 9 on a resin case 6 having built-in bus bar wiring 7, a housing cover 3 to which the sub-module is fixed, and a housing base 4 covering the sub-module with the control board fixed in between. The bus bar wiring 7 of the sub-module 2 is connected to the wiring of the control board 1. A semiconductor switching element 12 is mounted on the sub-module 2, and the semiconductor switching element 12 is thermally connected to the housing cover 3 through a thermally conductive adhesive 14.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供实现改进的散热的紧凑型控制装置。解决方案：控制装置具有安装有微型计算机17的控制板1，安装有线圈8的子模块2和具有内置母线布线7的树脂壳体6上的电容器9，壳体盖 3，子模块固定到其上的壳体基座4以及固定在其间的控制板覆盖子模块的壳体基座4。子模块2的母线布线7连接到控制板1的布线。半导体开关元件12安装在子模块2上，并且半导体开关元件12热连接到壳体盖3 通过导热粘合剂14。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2008008210A Engine control device 有权
标题翻译：发动机控制装置
公开(公告)号：JP2008008210A
公开(公告)日：2008-01-17
申请号：JP2006179929
申请日：2006-06-29
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KAMOSHITA MASARU , SASAKI MASAHIRO , IGARASHI SOJI , ASANO MASAHIKO
IPC分类号： F02B77/00 , F02D41/00
CPC分类号： H05K5/062 , H05K5/0052
摘要： PROBLEM TO BE SOLVED: To provide an engine control device providing high reliability especially by prevention of rust of an outer circumference end surface (cut surface) of a cover in addition to water proofing property and dust proofing property, while keeping manufacturing cost low.
SOLUTION: This device is provided with a circuit board 12 for engine control, an aluminum die-cast case body 20 having an upper surface thereof opened and storing the circuit board 12 or the like, a cover 30 made of ferrous metal plate having surface treatment applied beforehand thereon such as plated steel plate fastened and fixed on the case body 20 by a setscrew 40 to close the upper surface opening of the case body 20. A pedestal 24 or a groove 25 to which liquid or jelly water proofing adhesive 50 is applied or deposited is provided at the upper surface opening part of the case body 20 for sealing an inside of the case body 20, and the whole outer circumference end surface 33a of the cover 30 is embedded in the water proofing adhesive 50 applied or deposited to the pedestal 24 or the groove 25 and is substantially coated.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决问题：提供一种发动机控制装置，除了具有防水性和防尘性之外，还特别是通过防止盖的外周端面（切割面）的锈蚀而提供高可靠性，同时保持制造成本低。解决方案：该装置设置有用于发动机控制的电路板12，其上表面打开并存储电路板12等的铝压铸壳体20，由铁金属板制成的盖30 预先对其进行表面处理，例如通过固定螺丝40紧固并固定在壳体20上的电镀钢板，以封闭壳体20的上表面开口。基座24或槽25，液体或者胶水防水粘合剂 50被施加或沉积设置在壳体20的上表面开口部分处，用于密封壳体20的内部，并且盖30的整个外周端表面33a嵌入施加的防水粘合剂50中沉积到基座24或槽25上并且基本上被涂覆。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2007166899A Automobile controller 审中-公开
标题翻译：汽车控制器
公开(公告)号：JP2007166899A
公开(公告)日：2007-06-28
申请号：JP2007030500
申请日：2007-02-09
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： ASANO MASAHIKO , AKUTSU YASUO , EGUCHI KUNIYUKI , NAKATSURU KUNITO , UCHIYAMA KAORU
IPC分类号： H02G3/16
摘要： PROBLEM TO BE SOLVED: To make arrangement for facilitating the connection of a connector and a substrate to the outside, in an automobile controller. SOLUTION: The automobile controller 8 is provided with a case 3, a rectangular substrate 4 fixed to the inside of a case with a control circuit mounted, and connectors 1a,1b provided in a position along one side of the rectangular substrate 4 to input and output a signal between the inside and the outside of the case 3. The connectors 1a,1b comprise a plurality of connector terminals 2, respectively, each connector terminal 2 is electrically connected to the substrate 4 through a bonding wire 5 in the case 3. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：在汽车控制器中，为了便于将连接器和基板连接到外部进行布置。解决方案：汽车控制器8设置有壳体3，固定到安装有控制电路的壳体的内部的矩形基板4，以及设置在矩形基板4的一侧的位置的连接器1a，1b 在壳体3的内部和外部之间输入和输出信号。连接器1a，1b分别包括多个连接器端子2，每个连接器端子2通过接合线5电连接到基板4 案例3.版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2005005629A Electronic device 有权
标题翻译：电子设备
公开(公告)号：JP2005005629A
公开(公告)日：2005-01-06
申请号：JP2003170185
申请日：2003-06-16
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： YOKOZUKA TAKEHIDE , HARADA MASAHIDE , YAMASHITA SHIRO , UCHIYAMA KAORU , EGUCHI KUNIYUKI , ASANO MASAHIKO , SATO KOJI , YOSHIDA ISAMU
IPC分类号： H01L23/12 , H01L23/367 , H05K1/02 , H05K1/14 , H05K7/14 , H05K7/20
CPC分类号： H05K1/0204 , H01L23/3677 , H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/14 , H01L2924/15311 , H01L2924/19105 , H05K3/0061 , H05K2201/09054 , H05K2201/10416 , H05K2201/10734 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To improve heat-radiating characteristics of an electronic device, especially to improve heat-radiating characteristics of an electronic device using an interposer substrate. SOLUTION: The electronic device has an electronic substrate having a first circuit substrate whereon an electronic component is mounted and a second circuit substrate electrically connected to the first circuit substrate and fixed to a housing, and the housing whereto the electronic substrate is fixed. A structure wherein the first circuit substrate is fixed to the housing in a space wherein it is not superposed with the second circuit substrate is employed. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提高电子设备的散热特性，特别是为了提高使用中介基板的电子设备的散热特性。解决方案：电子设备具有电子基板，其具有安装电子部件的第一电路基板和电连接到第一电路基板并固定到壳体的第二电路基板，以及固定电子基板的壳体。采用其中第一电路基板在不与第二电路基板叠合的空间中固定到壳体的结构。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2004172425A Electronic apparatus 有权
标题翻译：电子设备
公开(公告)号：JP2004172425A
公开(公告)日：2004-06-17
申请号：JP2002337365
申请日：2002-11-21
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： YOKOZUKA TAKEHIDE , HARADA MASAHIDE , YAMASHITA SHIRO , UCHIYAMA KAORU , EGUCHI KUNIYUKI , ASANO MASAHIKO , SATO KOJI
IPC分类号： H05K7/20 , H01L23/12 , H01L23/14 , H01L23/36
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To improve heat dissipating properties of an electronic apparatus with an interposer board having a certain structure, such as an MCM structure. SOLUTION: A metal core board having a large thermal capacity and high thermal conductivity is used not only as an interposer board but also as a mother board. Furthermore, core metal exposure portions are provided on the mother board, direct soldering pads are formed on each area of the exposures, and the direct soldering pads provided to the mother board are soldered to a metal core interposer board. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：通过具有一定结构的插入板（例如MCM结构）来提高电子设备的散热性能。解决方案：具有大的热容量和高导热性的金属芯板不仅用作插入板，而且用作母板。此外，在母板上设置芯金属曝光部分，在曝光的每个区域上形成直接焊盘，并将设置在母板上的直接焊盘焊接到金属芯插入板。版权所有（C）2004，JPO

9. 发明专利

JP2003297497A Electronic control device 审中-公开
标题翻译：电子控制装置
公开(公告)号：JP2003297497A
公开(公告)日：2003-10-17
申请号：JP2002104940
申请日：2002-04-08
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： ASANO MASAHIKO , EGUCHI KUNIYUKI
IPC分类号： H01R24/00 , H01R107/00 , H01R12/04
摘要： PROBLEM TO BE SOLVED: To provide an electronic control device with reduced manufacturing cost and avoiding a decrease in yield of wire-bonding.
SOLUTION: The electronic control device comprises a board forming an electronic circuit, a base fixing the board, and a connector transmitting an external signal to the board. A connector terminal of the connector includes an external connecting part for inputting the external signal and an internal connecting part for transmitting the external signal to the board. In the electronic control device, the external connecting part and the internal connecting part of the connector terminal are arranged in a straight line.
COPYRIGHT: (C)2004,JPO

10. 发明专利

JP2009246063A Cooling structure of power module and semiconductor device using same 审中-公开
标题翻译：使用相同的功率模块和半导体器件的冷却结构
公开(公告)号：JP2009246063A
公开(公告)日：2009-10-22
申请号：JP2008089171
申请日：2008-03-31
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KAWAKITA SHINYA , TSUYUNO ENJO , YOSHINARI HIDETO , KANEKO YUJIRO , HOZOJI HIROYUKI , ASANO MASAHIKO
IPC分类号： H01L23/36 , H01L23/40 , H01L25/07 , H01L25/18 , H05K7/20
CPC分类号： H01L2224/16225 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To reduce flowing-out of a heat dissipation member from a cooling structure of a power module. SOLUTION: A semiconductor device which includes the power module mounted in a housing with the heat dissipation member interposed includes a member for fixation which fixes the power module to the housing using a plurality of holes for fixation bored in the power module and housing respectively, and a heat dissipation member holding portion for holding the heat dissipation member, charged between the power module and housing, in the housing, the area of the heat dissipation holding portion being 40 to 80% of the area of the surface of the power module which is mounted in the housing. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：减少散热构件从电力模块的冷却结构的流出。解决方案：包括安装在外壳中的散热构件的电源模块的半导体器件包括用于固定的构件，其将功率模块固定到壳体上，所述多个孔用于固定在电源模块和壳体中以及散热构件保持部，其将被供给到所述动力组件与所述壳体之间的所述散热构件保持在所述壳体内，所述散热保持部的面积为所述动力面的面积的40〜80％模块，其安装在壳体中。版权所有（C）2010，JPO＆INPIT

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