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1. 发明专利

DE60011555T2 未知
公开(公告)号：DE60011555T2
公开(公告)日：2005-08-18
申请号：DE60011555
申请日：2000-12-08
申请人： HITACHI LTD , TAMURA FA SYSTEM CO , HITACHI CAR ENG CO LTD , TAMURA SEISAKUSHO KK
发明人： MUKUNO HIDEKI , TASHIRO KAZUMI , ARITA HIDEAKI , KANAI KIYOSHI , OKANO TERUO , YAMASHITA FUMIHIRO , MATSUHISA SHOICHIROU , IMAI HIDEKAZU
IPC分类号： B23K1/008 , B23K1/00 , B23K1/012 , B23K31/02 , H05K3/34

2. 发明专利

DE60011555D1 未知
公开(公告)号：DE60011555D1
公开(公告)日：2004-07-22
申请号：DE60011555
申请日：2000-12-08
申请人： HITACHI LTD , TAMURA FA SYSTEM CO , HITACHI CAR ENG CO LTD , TAMURA SEISAKUSHO KK
发明人： MUKUNO HIDEKI , TASHIRO KAZUMI , ARITA HIDEAKI , KANAI KIYOSHI , OKANO TERUO , YAMASHITA FUMIHIRO , MATSUHISA SHOICHIROU , IMAI HIDEKAZU
IPC分类号： B23K1/008 , B23K1/00 , B23K1/012 , B23K31/02 , H05K3/34

3. 发明专利

JP2006148152A Soldering equipment 审中-公开
标题翻译：焊接设备
公开(公告)号：JP2006148152A
公开(公告)日：2006-06-08
申请号：JP2005375248
申请日：2005-12-27
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , Tamura Fa System Co Ltd , Tamura Seisakusho Co Ltd , 株式会社タムラエフエーシステム , 株式会社タムラ製作所 , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： MUKUNO HIDEKI , TASHIRO KAZUMI , ARITA HIDEAKI , KANAI KIYOSHI , OKANO TERUO , YAMASHITA FUMIHIRO , MATSUHISA SHOICHIRO , IMAI HIDEKAZU
IPC分类号： H05K3/34 , B23K1/008 , B23K3/04 , B23K101/42
摘要： PROBLEM TO BE SOLVED: To provide soldering equipment, capable of uniformly heating a printed circuit board and the mounted electronic components, and of soldering, without thermally damaging the electronic components in soldering equipment using lead-free solder.
SOLUTION: The pressure of a fluid is allowed to be uniform and a porous body 130, having a plurality of pores, is disposed between a blower fan 122 and a heater 140. In addition, a radiation plate 150, that sprays the fluid heated by the heater 140 onto a heated object 10 as turbulent flow, is disposed between the heater 140 and the heated object 10, and the heated object is heated by spraying the heated fluid onto the heated object and melts the solder.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供能够均匀加热印刷电路板和安装的电子部件以及焊接的焊接设备，而不会在使用无铅焊料的焊接设备中对电子部件造成热损伤。解决方案：允许流体的压力是均匀的，并且具有多个孔的多孔体130设置在鼓风机风扇122和加热器140之间。此外，喷射板150喷射由加热器140加热到被加热物体10上的流体作为湍流被布置在加热器140和被加热物体10之间，并且通过将加热的流体喷射到被加热物体上并使焊料熔化来加热被加热物体。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2004106029A Soldering device 有权
公开(公告)号：JP2004106029A
公开(公告)日：2004-04-08
申请号：JP2002273723
申请日：2002-09-19
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , Tamura Fa System Co Ltd , Tamura Seisakusho Co Ltd , 株式会社タムラエフエーシステム , 株式会社タムラ製作所 , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： OKANO TERUO , UCHIDA TOSHIYA , HATTORI KAORU , MUKUNO HIDEKI , ARITA HIDEAKI
IPC分类号： B23K3/00 , B23K1/08 , B23K31/02 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a soldering device for preventing the environment on the lower side of a work from influencing the upper side of the work.
SOLUTION: A plurality of circular holes 33 to fit a work W therein are opened at a predetermined angular interval in a disk-like index table 22 rotated while being stopped at the predetermined angle. A supporting tool 31 and a masking tool 32 to hold the work W while covering a space between the index table 22 and the work W are respectively provided in the circular holes 33. A closed work lower side space part 61 is formed below the index table 22, the supporting tool 31, the masking tool 32, and the work W, and at least a pre-heating unit 27 and a nozzle of a jet soldering tank are disposed therein. A closed work upper side space part 62 is demarcated on the upper side of the work lower side space part 61 via the index table 22, the supporting tool 31, the masking tool 32, and the work W.
COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2004106028A Soldering device 审中-公开
公开(公告)号：JP2004106028A
公开(公告)日：2004-04-08
申请号：JP2002273722
申请日：2002-09-19
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , Tamura Fa System Co Ltd , Tamura Seisakusho Co Ltd , 株式会社タムラエフエーシステム , 株式会社タムラ製作所 , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： OKANO TERUO , UCHIDA TOSHIYA , HATTORI KAORU , MUKUNO HIDEKI , ARITA HIDEAKI
IPC分类号： B23K3/00 , B23K1/08 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a soldering device for enhancing the soldering efficiency.
SOLUTION: A pre-heating unit 27 to preheat a work W to be carried by an index table 22 and a wave soldering tank 28 to feed molten solder to the work W are installed on a lower side of the index table 22 to be turned while the work W is stopped at a predetermined angle. The wave solder tank 28 is located on the downstream side of the pre-heating unit 27 and between a stop position P
1 and a stop position P
2 of the index table 22. A pulse-controllable motor 25 to drive the index table 22 at a variable speed is controlled by a controller 26 at a variable speed. The controller 26 has a speed control pattern having a high-speed carrying area to drive the index table 22 in a non-soldering mode at a relatively high speed, and a soldering speed area to drive the index table 22 in a soldering mode at a soldering speed set according to the work W.
COPYRIGHT: (C)2004,JPO

6. 发明专利

JP2010135839A Soldering equipment 审中-公开
标题翻译：焊接设备
公开(公告)号：JP2010135839A
公开(公告)日：2010-06-17
申请号：JP2010036991
申请日：2010-02-23
申请人： Hitachi Automotive Systems Ltd , Hitachi Car Eng Co Ltd , Tamura Fa System Co Ltd , Tamura Seisakusho Co Ltd , 日立オートモティブシステムズ株式会社 , 株式会社タムラエフエーシステム , 株式会社タムラ製作所 , 株式会社日立カーエンジニアリング
发明人： MUKUNO HIDEKI , TASHIRO KAZUMI , ARITA HIDEAKI , KANAI KIYOSHI , OKANO TERUO , YAMASHITA FUMIHIRO , MATSUHISA SHOICHIRO , IMAI HIDEKAZU
IPC分类号： H05K3/34 , B23K1/008 , B23K3/04 , B23K101/42
摘要： PROBLEM TO BE SOLVED: To provide soldering equipment, capable of uniformly heating a printed circuit board and the mounted electronic components, and of soldering, without thermally damaging the electronic components in soldering equipment using lead-free solder.
SOLUTION: The pressure of a fluid is allowed to be uniform and a porous body 130, having a plurality of pores, is disposed between a blower fan 122 and a heater 140. In addition, a radiation plate 150, that sprays the fluid heated by the heater 140 onto a heated object 10 as turbulent flow, is disposed between the heater 140 and the heated object 10, and the heated object is heated by spraying the heated fluid onto the heated object and melts the solder.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供能够均匀加热印刷电路板和安装的电子部件以及焊接的焊接设备，而不会在使用无铅焊料的焊接设备中对电子部件造成热损伤。解决方案：允许流体的压力是均匀的，并且具有多个孔的多孔体130设置在鼓风机风扇122和加热器140之间。此外，喷射板150喷射由加热器140加热到被加热物体10上的流体作为湍流被布置在加热器140和被加热物体10之间，并且通过将加热的流体喷射到被加热物体上并使焊料熔化来加热被加热物体。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2001170767A SOLDERING APPARATUS 失效
公开(公告)号：JP2001170767A
公开(公告)日：2001-06-26
申请号：JP35146899
申请日：1999-12-10
申请人： HITACHI LTD , TAMURA SEISAKUSHO KK , TAMURA FA SYSTEM KK , HITACHI CAR ENG CO LTD
发明人： MUKUNO HIDEKI , TASHIRO KAZUMI , ARITA HIDEAKI , KANAI KIYOSHI , OKANO TERUO , YAMASHITA FUMIHIRO , MATSUHISA SHOICHIRO , IMAI HIDEKAZU
IPC分类号： B23K1/008 , B23K1/00 , B23K1/012 , B23K31/02 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a soldering apparatus capable of uniformly heating a printed circuit board and electronic parts mounted thereon and not damaging electronic parts in temperature-wise as a soldering apparatus using lead free solder. SOLUTION: A porous body 130 having a plurality of holes for uniformizing fluid pressure is arranged between a blower fan 122 and a heater 140. Further, a radiation plate 150 to blow a fluid heated by the heater 140 toward a object 10 to be heated in a turbulent flow is arranged between the heater 140 and the object 10 to be heated. Thus, the object to be heated is heated by blowing a heating fluid to the object to be heated, solder is fused.

8. 发明专利

JP2000074787A Method and apparatus for inspection of shape of weld and strength of weld 审中-公开
标题翻译：用于检查焊接形状和焊接强度的方法和装置
公开(公告)号：JP2000074787A
公开(公告)日：2000-03-14
申请号：JP24134798
申请日：1998-08-27
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： SHIMOTAKAHARA KEN , ARITA HIDEAKI , WATANABE TAKEHIKO
IPC分类号： G01M13/00 , B23K11/00 , B23K31/00
摘要： PROBLEM TO BE SOLVED: To reduce the limitation on products and reduce the cost by welding wire material with its both ends coming out of a terminal, and placing loads on the tip end of an excessive part of the wire materials being unnecessary to an electric circuit, and then making judgement as to whether the weld strength is good or not by the displacement of the wire material tip end.
SOLUTION: A matter to be inspected having wire material 3 welded through electric resistance to a terminal 2 is supplied in the weld strength inspection device, and thereafter, the whole of the device is lowered and a base plate 3 with a press plate 4 attached is moved horizontally by a guide-furnished cylinder. Meanwhile, the press plate 4 comes in contact with an excessive part of the wire material 3, the force of a tension spring 11 is loaded on the excessive part via the press plate 4. A displacement 8 of the excessive part at the movement of the guide-furnished cylinder 9 for a set stroke is converted as a rotational angle θ, and by a sensor 10, if the rotational angle θ is greater than the set value, it is accepted, and if smaller than that, it is determined as being excessive and hence weld failure. Accordingly, an inspection of the weld strength can be done within a space in which electrodes are put therein for welding the wire material 3 and terminal 2.
COPYRIGHT: (C)2000,JPO
摘要翻译：要解决的问题：为了减少对产品的限制，并且通过焊接线材的端部从端子排出来降低成本，并且将不需要的电路的过多部分的负载放置在电路上，然后通过线材末端的位移判断焊接强度是否良好。解决方案：在焊接强度检查装置中，供给通过电阻焊接在端子2上的具有线材3的检查对象，然后将整个装置降低，并且安装有压板4的基板3为由导向装置的气缸水平移动。同时，压板4与线材3的过多部分接触，拉力弹簧11的力通过压板4装载在过度部分上。在过度部分的位移8 导向装置用于设定行程的气缸9被转换为旋转角度θ，并且通过传感器10，如果旋转角度θ大于设定值，则被接受，如果小于该值，则确定为过度，因此焊接故障。因此，可以在放置电极的空间内进行焊接强度的检查，以焊接线材3和端子2。

9. 发明专利

JP2017091213A データベース更新処理システムおよびデータベース更新処理方法审中-公开
公开(公告)号：JP2017091213A
公开(公告)日：2017-05-25
申请号：JP2015220531
申请日：2015-11-10
申请人：株式会社日立製作所 , Hitachi Ltd
发明人： TANAKA KENSEI , ARITA HIDEAKI
IPC分类号： G06F12/00
摘要：【課題】勘定系システムにおけるオンライン系の処理結果をバッチ系にリアルタイムに反映する。【解決手段】データベース更新処理システム10において、バッチ処理キュー125を保持する記憶装置101と、各オンライン系システムでのトランザクションに関し、データ更新対象の資源および自他各々のオンライン系システムでのトランザクション間のデータ更新完了順序の各情報に基づき、各トランザクションによる当該資源に対するデータ更新事象の情報を生成し、バッチ処理キュー125が規定するオンライン系システムの当該資源とデータ利用系システムの資源とに対応付けてデータ利用系システム200に送る演算装置104を備えたオンライン系システム10を含む構成とする。【選択図】図2

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