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    • 3. 发明申请
    • SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 半导体存储器件及其制造方法
    • US20090218614A1
    • 2009-09-03
    • US12354271
    • 2009-01-15
    • Kenji AOYAMAHisataka MeguroSatoshi Nagashima
    • Kenji AOYAMAHisataka MeguroSatoshi Nagashima
    • H01L29/792H01L21/336
    • H01L21/28247H01L21/76229H01L27/11521H01L27/11524H01L27/11568
    • A semiconductor storage device has a plurality of word lines formed with a predetermined interval on a semiconductor substrate, a selection transistor provided at an end portion of the plurality of word lines, a first insulating film formed so as to cover side surfaces of the word lines, a side surface of the selection transistor, and a surface of the semiconductor substrate between the word lines, a high-permittivity film formed on the first insulation film, a second insulating film formed so as to cover the upper surface of the word lines and the selection transistor, a first air-gap portion located between the word lines and surrounded by the high-permittivity film and the second insulating film, and a second air-gap portion formed via the first insulating film and the high-permittivity film at a sidewall portion, which opposes the selection transistor, of the word line adjacent to the selection transistor, an upper portion of the second air-gap portion being covered by the second insulating film.
    • 半导体存储装置具有在半导体衬底上形成有预定间隔的多个字线,设置在多个字线的端部的选择晶体管,形成为覆盖字线的侧面的第一绝缘膜 所述选择晶体管的侧面以及所述字线之间的所述半导体基板的表面,形成在所述第一绝缘膜上的高电容率膜,形成为覆盖所述字线的上表面的第二绝缘膜,以及 选择晶体管,位于字线之间并被高电容率膜和第二绝缘膜包围的第一气隙部分和经由第一绝缘膜和高介电常数膜形成的第二气隙部分, 与选择晶体管相邻的字线相对的选择晶体管的侧壁部分,第二气隙部分的上部被第二i 记录膜。