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    • 4. 发明申请
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US20070187743A1
    • 2007-08-16
    • US11656382
    • 2007-01-23
    • Shoichi MiyazakiHisataka MeguroFumitaka Arai
    • Shoichi MiyazakiHisataka MeguroFumitaka Arai
    • H01L29/76
    • H01L27/115H01L27/11521H01L27/11524
    • A semiconductor device includes a pair of select gate structures which are opposed to each other and which are formed in a select transistor formation area, each of the select gate structures including a gate insulating film formed on a semiconductor substrate and a gate electrode formed on the gate insulating film, and a pair of memory cell gate structure groups which are formed in a pair of memory cell formation areas between which the select transistor formation area is interposed and each of which has a plurality of memory cell gate structures arranged at the same pitch, the pair of select gate structures having sides which are opposed to each other, and at least the upper portion of each of the opposed sides of the select gate structures being inclined.
    • 半导体器件包括彼此相对并且形成在选择晶体管形成区域中的一对选择栅极结构,每个选择栅极结构包括形成在半导体衬底上的栅极绝缘膜和形成在栅极电极上的栅电极 栅极绝缘膜和一对存储单元栅极结构组,其形成在一对存储单元形成区域中,在该对存储单元形成区域之间插入选择晶体管形成区域,并且每个存储单元栅极结构组具有以相同间距排列的多个存储单元栅极结构 所述一对选择栅极结构具有彼此相对的侧面,并且至少所述选择栅极结构的每个相对侧的上部是倾斜的。
    • 6. 发明授权
    • Nonvolatile semiconductor memory device and method for manufacturing same
    • 非易失性半导体存储器件及其制造方法
    • US08624317B2
    • 2014-01-07
    • US13402477
    • 2012-02-22
    • Fumitaka AraiSatoshi NagashimaHisataka MeguroHideto TakekidaKenta Yamada
    • Fumitaka AraiSatoshi NagashimaHisataka MeguroHideto TakekidaKenta Yamada
    • H01L29/792
    • H01L27/11524G11C16/0466H01L27/11551H01L29/66825H01L29/7881
    • Nonvolatile semiconductor memory device includes first memory cell array layer, first insulating layer formed thereabove, and second memory cell array layer formed thereabove. First memory cell array layer includes first NAND cell units each including plural first memory cells. The first memory cell includes first semiconductor layer, first gate insulating film formed thereabove, and first charge accumulation layer formed thereabove. The second memory cell array layer includes second NAND cell units each including plural second memory cells. The second memory cell includes second charge accumulation layer, second gate insulating film formed thereabove, and second semiconductor layer formed thereabove. Control gates are formed, via an inter-gate insulating film, on first-direction both sides of the first and second charge accumulation layers positioned the latter above the former via the first insulating layer. The control gates extend in a second direction perpendicular to the first direction.
    • 非易失性半导体存储器件包括第一存储单元阵列层,形成在其上的第一绝缘层和形成在其上的第二存储单元阵列层。 第一存储单元阵列层包括每个包括多个第一存储单元的第一NAND单元单元。 第一存储单元包括形成在其上的第一半导体层,第一栅极绝缘膜和在其上形成的第一电荷累积层。 第二存储单元阵列层包括每个包括多个第二存储单元的第二NAND单元单元。 第二存储单元包括第二电荷累积层,在其上形成的第二栅极绝缘膜,以及在其上形成的第二半导体层。 控制栅极经由栅极间绝缘膜,在第一和第二电荷累积层的第一方向两侧经由第一绝缘层位于前者之上。 控制门在垂直于第一方向的第二方向延伸。
    • 8. 发明授权
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US07718474B2
    • 2010-05-18
    • US11656382
    • 2007-01-23
    • Shoichi MiyazakiHisataka MeguroFumitaka Arai
    • Shoichi MiyazakiHisataka MeguroFumitaka Arai
    • H01L21/335
    • H01L27/115H01L27/11521H01L27/11524
    • A semiconductor device includes a pair of select gate structures which are opposed to each other and which are formed in a select transistor formation area, each of the select gate structures including a gate insulating film formed on a semiconductor substrate and a gate electrode formed on the gate insulating film, and a pair of memory cell gate structure groups which are formed in a pair of memory cell formation areas between which the select transistor formation area is interposed and each of which has a plurality of memory cell gate structures arranged at the same pitch, the pair of select gate structures having sides which are opposed to each other, and at least the upper portion of each of the opposed sides of the select gate structures being inclined.
    • 半导体器件包括彼此相对并且形成在选择晶体管形成区域中的一对选择栅极结构,每个选择栅极结构包括形成在半导体衬底上的栅极绝缘膜和形成在栅极电极上的栅电极 栅极绝缘膜和一对存储单元栅极结构组,其形成在一对存储单元形成区域中,在该对存储单元形成区域之间插入选择晶体管形成区域,并且每个存储单元栅极结构组具有以相同间距排列的多个存储单元栅极结构 所述一对选择栅极结构具有彼此相对的侧面,并且至少所述选择栅极结构的每个相对侧的上部是倾斜的。
    • 9. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
    • 非易失性半导体存储器件及其制造方法
    • US20120217571A1
    • 2012-08-30
    • US13402477
    • 2012-02-22
    • Fumitaka ARAISatoshi NagashimaHisataka MeguroHideto TakekidaKenta Yamada
    • Fumitaka ARAISatoshi NagashimaHisataka MeguroHideto TakekidaKenta Yamada
    • H01L29/792H01L21/76
    • H01L27/11524G11C16/0466H01L27/11551H01L29/66825H01L29/7881
    • Nonvolatile semiconductor memory device includes first memory cell array layer, first insulating layer formed thereabove, and second memory cell array layer formed thereabove. First memory cell array layer includes first NAND cell units each including plural first memory cells. The first memory cell includes first semiconductor layer, first gate insulating film formed thereabove, and first charge accumulation layer formed thereabove. The second memory cell array layer includes second NAND cell units each including plural second memory cells. The second memory cell includes second charge accumulation layer, second gate insulating film formed thereabove, and second semiconductor layer formed thereabove. Control gates are formed, via an inter-gate insulating film, on first-direction both sides of the first and second charge accumulation layers positioned the latter above the former via the first insulating layer. The control gates extend in a second direction perpendicular to the first direction.
    • 非易失性半导体存储器件包括第一存储单元阵列层,形成在其上的第一绝缘层和形成在其上的第二存储单元阵列层。 第一存储单元阵列层包括每个包括多个第一存储单元的第一NAND单元单元。 第一存储单元包括形成在其上的第一半导体层,第一栅极绝缘膜和在其上形成的第一电荷累积层。 第二存储单元阵列层包括每个包括多个第二存储单元的第二NAND单元单元。 第二存储单元包括第二电荷累积层,在其上形成的第二栅极绝缘膜,以及在其上形成的第二半导体层。 控制栅极经由栅极间绝缘膜,在第一和第二电荷累积层的第一方向两侧经由第一绝缘层位于前者之上。 控制门在垂直于第一方向的第二方向延伸。
    • 10. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20100176433A1
    • 2010-07-15
    • US12729383
    • 2010-03-23
    • Shoichi MiyazakiHisataka MeguroFumitaka Arai
    • Shoichi MiyazakiHisataka MeguroFumitaka Arai
    • H01L29/788
    • H01L27/115H01L27/11521H01L27/11524
    • A semiconductor device includes a pair of select gate structures which are opposed to each other and which are formed in a select transistor formation area, each of the select gate structures including a gate insulating film formed on a semiconductor substrate and a gate electrode formed on the gate insulating film, and a pair of memory cell gate structure groups which are formed in a pair of memory cell formation areas between which the select transistor formation area is interposed and each of which has a plurality of memory cell gate structures arranged at the same pitch, the pair of select gate structures having sides which are opposed to each other, and at least the upper portion of each of the opposed sides of the select gate structures being inclined.
    • 半导体器件包括彼此相对并且形成在选择晶体管形成区域中的一对选择栅极结构,每个选择栅极结构包括形成在半导体衬底上的栅极绝缘膜和形成在栅极电极上的栅电极 栅极绝缘膜和一对存储单元栅极结构组,其形成在一对存储单元形成区域中,在该对存储单元形成区域之间插入选择晶体管形成区域,并且每个存储单元栅极结构组具有以相同间距排列的多个存储单元栅极结构 所述一对选择栅极结构具有彼此相对的侧面,并且至少所述选择栅极结构的每个相对侧的上部是倾斜的。